PIC32MX775F512HT-80I/MR - 80MHz 512KB MCU USB/CAN/Ethernet | Microchip
N.º da peça: PIC32MX775F512HT-80I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $10.9956 | $11,00 |
| 10 | $10.45 | $104,50 |
| 100 | $9.42 | $942,00 |
| 500 | $8.65 | $4.325,00 |
| 1.000 | $7.88 | $7.880,00 |
PIC32MX775F512HT-80I/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, and a rich set of peripherals into one package. Within the broader taxonomy, the PIC32MX775 sits under 32-bit MCU -> RISC MCU -> microcontroller -> integrated circuit -> semiconductor. Compared with 8-bit and 16-bit MCUs, a 32-bit MCU executes instructions on 32-bit data paths, allowing larger address spaces, higher throughput, and richer peripheral integration for connected embedded applications.
Key features of the PIC32MX775F512HT-80I/MR include 80 MHz core speed, 512 KB Flash, 64 KB SRAM, integrated USB 2.0 Full-Speed device/host/OTG, two CAN 2.0b controllers, a 10/100 Mbit Ethernet MAC, 8-channel DMA, and 5 timers / 5 IC/OC / 5 I2C / 4 UART / 2 SPI peripherals. The 64-VQFN (9x9 mm) package exposes 53 digital I/O pins and supports industrial operating temperatures from -40C to +85C.
The device uses the MIPS32 M4K core with 5-stage pipeline and prefetch cache, executing most instructions in a single clock cycle. The dual Flash panel and live update partition allow firmware field updates via bootloader, while 8 DMA channels offload data movement between peripherals and RAM. USB, CAN, and Ethernet MACs share DMA, reducing CPU interrupt load in connected designs.
Typical applications include industrial Ethernet nodes, CAN-connected motor and building automation controllers, USB peripherals and embedded hosts, factory automation gateways, and connected medical or instrumentation devices. The PIC32MX5/6/7 series is fully supported by MPLAB Harmony and MPLAB X IDE for firmware development.
When designing, ensure the USB D+/D- trace impedance is 90 ohms differential and add a 1 uF bulk capacitor near the VBUS pin. Use the internal pull-up on D+ only in bus-powered designs; for self-powered devices, drive D+ through an external switchable resistor to avoid back-powering the host port.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MX775F512HT-80I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX775F512HT-80I/MR (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, Core Architecture, DMA Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX775F512H-80I/MR
✅ Drop-In✓ Em estoque
$5.41 / unidade
Ver ficha técnica →PIC32MX695F512HT-80I/MR
✅ Drop-In✓ Em estoque
$8.42 / unidade
Ver ficha técnica →PIC32MX675F512HT-80I/MR
✅ Drop-In✓ Em estoque
$6.45 / unidade
Ver ficha técnica →PIC32MX764F128HT-I/MR
✅ Drop-In✓ Em estoque
$6.04 / unidade
Ver ficha técnica →PIC32MX570F512HT-50I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX440F512HT-80I/MR
✅ Drop-In✓ Em estoque
$6.2 / unidade
Ver ficha técnica →PIC32MX775F512HT-80I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 80 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 64 KB |
| Tensão de alimentação | 2.3 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 64-VQFN (9x9 mm) |
| Tipo de montagem | Surface Mount |
| I/O Pins | 53 |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | 2 x CAN 2.0b |
| Ethernet | 10/100 Mbit MAC (RMII/MII) |
| DMA Channels | 8 |
| Timers | 5 x 16-bit |
| UART / I2C / SPI | 4 UART / 5 I2C / 2 SPI |
| ADC | 16-channel 10-bit |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MX775F512HT-80I/MR 64-vqfn (9x9 mm)
Configuração de pinos para PIC32MX775F512HT-80I/MR (pacote 64-vqfn (9x9 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MX775F512HT-80I/MR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MX775F512HT-80I/MR é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB-Connected Embedded Peripherals, CAN Bus Industrial Nodes, Building Automation Controllers, Connected Medical Instrumentation, Multi-Protocol Sensor Hubs.
Industrial Ethernet Gateway
The PIC32MX775F512HT-80I/MR's integrated 10/100 Mbit Ethernet MAC and 80 MHz MIPS32 M4K core make it well suited for industrial Ethernet gateways that must run a lightweight TCP/IP stack (e.g., TCP/IP + MQTT or Modbus TCP) alongside application logic. Placed on the fieldbus side of a factory node, it bridges Ethernet to local CAN and UART sensors while the 8-channel DMA engine offloads packet movement from the CPU. The 64 KB SRAM comfortably holds a TCP/IP socket buffer plus application queues, and the 512 KB Flash is large enough for the Harmony 3 Net Preset plus user firmware without external program memory.
Recomendado
USB-Connected Embedded Peripherals
The PIC32MX775F512HT-80I/MR's USB 2.0 Full-Speed device/host/OTG controller, combined with 53 digital I/O pins and 64 KB SRAM, supports USB HID/CDC/MSC peripherals such as data loggers, human-interface panels, and instrument front-ends. A typical design places the MCU between a host PC and downstream UART/I2C/SPI sensors, presenting as a composite USB device. The 80 MHz core provides enough headroom for USB stack plus real-time sampling, and the 512 KB Flash lets Harmony 3 USB stacks fit alongside application firmware without an external boot-loader partition.
Recomendado
CAN Bus Industrial Nodes
With two independent CAN 2.0b controllers and a 80 MHz core, the PIC32MX775F512HT-80I/MR is well matched to industrial CAN nodes such as motor controllers, building-automation sensors, and automotive-bus gateways. Each CAN controller has its own DMA channel, so traffic on one bus does not block the other. The 53 I/O pins expose ample PWM/IC/OC channels for motor-drive interface, and the 64 KB SRAM holds CAN message queues without dropping frames under burst conditions.
Recomendado
Building Automation Controllers
The PIC32MX775F512HT-80I/MR's mix of Ethernet, dual CAN, USB, and 53 I/O pins serves BACnet/Modbus building-automation controllers that bridge multiple field buses. The 80 MHz M4K core handles BACnet/IP plus local control loops, while 64 KB SRAM maintains HVAC schedule tables and trend logs. Operating temperature -40 C to +85 C and the 64-VQFN (9x9) exposed-pad package make it thermally robust inside equipment rooms without requiring a heatsink above 0.5 W dissipation.
Recomendado
Connected Medical Instrumentation
The PIC32MX775F512HT-80I/MR provides 16-channel 10-bit ADC, USB, and ample I/O for connected medical instruments such as portable monitors and bench-top analyzers. The 80 MHz core runs USB CDC plus signal-processing loops, while 512 KB Flash holds firmware for waveform capture and on-screen UI. The 64-VQFN package's small footprint fits inside handheld enclosures, and the industrial -40 C to +85 C range supports hospital and field-clinic environments. Note: medical certification is system-level; this MCU itself is not FDA-cleared.
Recomendado
Multi-Protocol Sensor Hubs
The PIC32MX775F512HT-80I/MR aggregates UART, I2C, CAN, and SPI sensors into a single Ethernet or USB gateway. Five I2C buses support multiple sensor ICs without bus contention, while four UARTs bridge RS-485/Modbus devices. The 8-channel DMA engine handles simultaneous data streams without CPU interrupt load, and 64 KB SRAM buffers pre-aggregation payloads. The 64-VQFN 9x9 mm exposed-pad package allows compact PCB designs where the MCU sits at the heart of the sensor hub.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX775F512HT-80I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX775F512H-80I/MR | PIC32MX695F512HT-80I/MR | PIC32MX675F512HT-80I/MR | PIC32MX764F128HT-I/MR | PIC32MX570F512HT-50I/MR | PIC32MX440F512HT-80I/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Core / CPU Speed | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 40 MHz | MIPS32 M4K / 50 MHz | MIPS32 M4K / 80 MHz |
| Flash / SRAM | 512 KB / 64 KB | 512 KB / 64 KB | 512 KB / 64 KB | 512 KB / 64 KB | 128 KB / 32 KB | 512 KB / 64 KB | 512 KB / 32 KB |
| USB OTG | Yes (FS OTG) | Yes (FS OTG) | No | No | Yes (FS OTG) | Yes | No |
| Ethernet MAC | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | No | 10/100 Mbit | No | No |
| CAN 2.0b | 2 | 2 | 2 | 2 | 2 | 2 | 0 |
| DMA Channels | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- Integrated USB OTG plus Ethernet plus dual CAN in a single 64-VQFN device (vs PIC32MX440F512HT-80I/MR)
- Largest Flash/RAM in the 64-VQFN PIC32MX5/6/7xx family (vs PIC32MX764F128HT-I/MR)
- Industrial-grade operating temperature and mature 80 MHz M4K core (vs PIC32MX570F512HT-50I/MR)
Notas de projeto
The 64-VQFN (9x9 mm) package has an exposed thermal pad on pin 64. The PCB land pattern MUST include a central pad with at least 9 thermal vias (0.3 mm drill, 0.6 mm pitch) tied to the ground plane. Without this thermal path, the junction temperature can exceed 125 C at full 80 MHz operation with all peripherals active. Solder paste stencil should use a 0.127 mm (5 mil) thickness with a 1:1 aperture ratio for the central thermal pad to avoid voids above 25 percent.
USB D+/D- traces must be routed as a 90 ohm differential pair with no splits or test points in the middle of the run. Add a common-mode choke near the connector and place the 15 kohm pull-down on D+ and D- to ensure a defined high-speed idle state. For self-powered USB designs, drive D+ through a switchable pull-up (e.g., VBUS-detect GPIO) instead of the internal pull-up to avoid back-powering the host port when the device is unpowered.
Place a 1 uF + 0.1 uF bulk-decoupling pair on every VDD/VSS pin combination, with the 0.1 uF as close as physically possible to the IC pin (under 1 mm trace length). The analog AVdd/AVss pins must be filtered with a ferrite bead and a 10 uF + 0.1 uF pair, and the AGND pin should return to a clean analog ground island that joins the digital ground at a single point near the PCB power entry.
Supply voltage range is 2.3 V to 3.6 V. The PIC32MX775F512HT-80I/MR consumes roughly 70 mA at 80 MHz with all peripherals active, so the 3.3 V LDO must supply at least 100 mA plus margin for digital I/O sourcing. For USB bus-powered designs, ensure VBUS detection GPIO is wired before the regulator enable so the MCU can hold the USB PHY in high-Z until a valid VBUS is present.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C) but NOT AEC-Q100 qualified for automotive. Lead-free / matte-tin finish. Halogen-free status not explicitly stated in verified data; consult Microchip environmental compliance letter for confirmation.
