PIC32MZ2064DAH169-I/6J - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA
N.º da peça: PIC32MZ2064DAH169-I/6J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.2 | $172,00 |
| 100 | $15.4 | $1.540,00 |
| 500 | $13.85 | $6.925,00 |
| 1.000 | $12.6 | $12.600,00 |
PIC32MZ2064DAH169-I/6J Visão geral
Key features include a 12-bit, 18 MSPS, 45-channel ADC module with analog comparators and a high-speed USB 2.0 high-speed PHY, along with dual panel Flash for live update support and a memory management unit (MMU) for embedded OS execution. The microMIPS mode yields up to 35% smaller code footprint, and integrated graphics peripherals (GPU, display controller, DDR2 interface) simplify HMI design.
The architecture combines a 5-stage pipeline MIPS32 core with dedicated 2D graphics engine and TFT/panel interface hardware, enabling smooth GUI rendering without external graphics controllers. DDR2 memory support via the integrated controller removes the need for external SDRAM chips, reducing BOM and board area while delivering sufficient bandwidth for full-HD framebuffer manipulation.
Typical applications include industrial HMI panels, automotive dashboards, medical patient monitors, smart-home control displays, and embedded GUI products. The combination of microAptiv performance, 2 MB Flash, 640 KB SRAM and integrated DDR2 enables 32-bit OS execution (FreeRTOS, embOS, MPLAB Harmony) plus rich graphical interfaces.
When designing with this MCU, use MPLAB X IDE and MPLAB Harmony framework for driver and middleware integration. The LFBGA package requires X-ray inspection and 4-layer PCB minimum; ensure thermal vias under the exposed pad and verify impedance-controlled traces for DDR2 signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and practical design considerations not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC32MZ2064DAH169-I/6J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ2064DAH169-I/6J (mesmo formato e footprint) — diferindo em Graphics Controller, USB, ADC, Operating Temperature, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ2064DAS169-I/6J
✅ Drop-In✓ Em estoque
$11.94 / unidade
Ver ficha técnica →PIC32MZ2064DAS169-V/6J
✅ Drop-In✓ Em estoque
$15.18 / unidade
Ver ficha técnica →PIC32MZ2064DAH169-V/6J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ2064DAH169-I/6JX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ2064DAG169-I/6J
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →PIC32MZ2064DAB169-I/HF
✅ Drop-In✓ Em estoque
$19.95 / unidade
Ver ficha técnica →PIC32MZ2064DAH169-I/6J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Maximum CPU Clock | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 controller (32 MB or 128 MB addressable) |
| ADC | 12-bit, 18 MSPS, 45-channel |
| Operating Voltage | 1.8 V core supply (typical) |
| Encapsulamento | 169-LFBGA (11x11 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial, 'I' suffix) |
| Status RoHS | Compliant |
| Graphics Controller | Integrated 2D GPU and display/panel controller |
| USB | USB 2.0 High-Speed PHY integrated |
| MMU | Yes (supports embedded OS execution) |
| code-density Mode | microMIPS (up to 35% smaller code) |
| Dual-Panel Flash | Yes (live update support) |
Guia de Configuração de Pinos do PIC32MZ2064DAH169-I/6J 169-lfbga (11x11 mm)
Configuração de pinos para PIC32MZ2064DAH169-I/6J (pacote 169-lfbga (11x11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MZ2064DAH169-I/6J.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MZ2064DAH169-I/6J é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Automotive Dashboard Displays, Medical Patient Monitoring Displays, Smart Home Control Panels, Embedded GUI / Industrial Control, Point-of-Sale Terminals.
Industrial HMI Touch Panels
The PIC32MZ2064DAH169-I/6J is engineered for industrial HMI panels where its 200 MHz microAptiv core, 2 MB Flash and 640 KB SRAM run MPLAB Harmony + LVGL graphics stacks directly. The integrated 2D GPU and TFT/panel controller drive WXGA or smaller TFT displays without external graphics chips, while the on-chip DDR2 controller handles 32-128 MB of external framebuffer memory for smooth multi-layer UI rendering. The 12-bit 18 MSPS 45-channel ADC supports touch-screen and analog sensor monitoring. Its industrial -40C to +85C temperature range suits factory-floor deployment.
Recomendado
Automotive Dashboard Displays
For automotive dashboard and instrument cluster displays, the PIC32MZ2064DAH169-I/6J provides the graphics bandwidth and real-time performance required. The integrated DDR2 controller supports multi-layer instrument cluster graphics, while the 200 MHz core runs CAN-FD stacks, OBD-II parsing, and gauge animation logic. The MMU enables QNX or AUTOSAR-like OS execution for safety-critical separation. Designers should evaluate the PIC32MZ2064DAH169-V/6J V-temperature grade variant (-40C to +105C) for under-hood or cabin-temperature automotive use.
Recomendado
Medical Patient Monitoring Displays
The PIC32MZ2064DAH169-I/6J suits patient monitor front-panel graphics where 2 MB Flash accommodates waveform rendering algorithms and 640 KB SRAM buffers multiple trace displays simultaneously. Its high-speed 12-bit 18 MSPS ADC samples physiological signals (ECG, SpO2, respiration) without external analog front ends. The MIPS32 microAptiv MMU supports secure separation between real-time display updates and network connectivity stacks. Combined with its 169-LFBGA package, the device enables compact medical device form factors.
Recomendado
Smart Home Control Panels
Smart-home control hubs leverage the PIC32MZ2064DAH169-I/6J for rich touchscreen interfaces managing lighting, HVAC, security, and multimedia. Its integrated DDR2 controller supports full-HD resolution framebuffers, while the USB 2.0 High-Speed PHY connects directly to Wi-Fi/Bluetooth modules for IoT cloud connectivity. The microAptiv core runs TLS stacks, MQTT clients, and reactive UI frameworks within 2 MB Flash. The 169-LFBGA package keeps PCB size compact for wall-mounted panel designs.
Recomendado
Embedded GUI / Industrial Control
For non-medical, non-automotive industrial control with graphical interfaces, the PIC32MZ2064DAH169-I/6J provides MPU-class performance in an MCU form factor. The dual-panel Flash enables live firmware updates without process downtime - critical for factory automation systems. The 45-channel ADC handles multi-sensor acquisition (temperature, pressure, flow) concurrently. MPLAB Harmony 3 framework provides validated middleware for TCP/IP, USB, and graphics, accelerating time-to-market for custom industrial controllers.
Recomendado
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2064DAH169-I/6J's 2 MB Flash for payment-application logic and 640 KB SRAM for transaction buffering. The integrated DDR2 controller supports QR/barcode scanner camera frames, while the 2D GPU accelerates payment UI animations. USB 2.0 High-Speed PHY connects to printers, scanners, and contactless payment modules. The microAptiv MMU enables secure separation between payment logic and OS-level networking, satisfying PCI-PTS software isolation requirements.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ2064DAH169-I/6J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ2064DAS169-I/6J | PIC32MZ2064DAS169-V/6J | PIC32MZ2064DAH169-V/6J | PIC32MZ2064DAH169-I/6JX | PIC32MZ2064DAG169-I/6J | PIC32MZ2064DAB169-I/HF |
|---|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (HF) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 512 KB | 640 KB |
| DDR2 Controller | Yes (32/128 MB) | Yes (32/128 MB) | Yes (32/128 MB) | Yes (32/128 MB) | Yes (32/128 MB) | Yes (32/128 MB) | Yes (32/128 MB) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | V -40C to +105C | V -40C to +105C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| Recommended for New Designs | Superseded by S revision | Yes (current) | Yes (current) | Superseded | Superseded | Superseded | Superseded |
| RoHS / Lead-Free | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
Principais diferenciais
- Microchip officially recommends this part's silicon revision successor (vs PIC32MZ2064DAH169-I/6J vs PIC32MZ2064DAS169-I/6J)
- Wider temperature grade option exists in same package (vs PIC32MZ2064DAH169-I/6J vs PIC32MZ2064DAH169-V/6J)
- Lower-cost SRAM-reduced sibling exists for cost-sensitive HMI (vs PIC32MZ2064DAH169-I/6J vs PIC32MZ2064DAG169-I/6J)
Notas de projeto
The 169-LFBGA package requires 4-layer PCB minimum with a continuous ground plane under the device for signal integrity and thermal dissipation. Place a thermal via array (0.3 mm drill, 0.5 mm pitch, plugged-and-capped) directly under the exposed pad. DDR2 signal traces must be length-matched within 25 mil tolerance per the PIC32MZ DA family hardware design checklist; reference Microchip AN2497 for DDR2 routing guidelines.
Place decoupling capacitors (100 nF X7R) within 2 mm of every VDD/VSS pin pair and bulk capacitors (10 uF + 1 uF) near the package perimeter. Separate analog AVSS/AVDD planes from digital VDDCORE/VDDIO planes; join them at a single point under the MCU. Keep display/TFT parallel bus traces short and impedance-controlled (50 ohm single-ended) to avoid crosstalk with the DDR2 bus.
Do not assume the 169-LFBGA footprint accepts paste-inspect via X-ray only - visual inspection under the balls is impossible. The device requires factory-programmed boot configuration fuses; ensure the configuration words are explicitly set for DDR2 initialization, oscillator mode, and dual-panel Flash before production. Microchip MPLAB IPE must be used to program the device via ICSP (PGECx/PGEDx pairs) - any pair works but they must be paired.
DDR2 termination: VTT termination resistors (50 ohm to 0.9V VTT) must be placed within 200 mil of every DDR2 DQ/DQS pin. The VTT regulator must source/sink peak currents of 1-2 A during write cycles. Series resistors on DDR2CK and DDR2CKE (33 ohm) reduce ringing. Matched trace lengths for DDR2DQS to DDR2DQ within +/- 25 mil are mandatory - failure causes intermittent data corruption visible as screen-tearing in graphics workloads.
At 200 MHz with DDR2 active, the PIC32MZ2064DAH169-I/6J draws approximately 200-300 mA from VDDCORE (1.8V) - around 0.5W typical dissipation. With 169-LFBGA thermal resistance theta-JA of approximately 25 C/W (estimated, 4-layer JEDEC test board), junction-to-ambient rise is roughly 12C at typical load. Industrial -40C to +85C operation is satisfied without active cooling, but enclosed enclosures should add thermal vias to inner ground planes for additional margin.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 not qualified - select automotive-grade Microchip parts from PIC32CK or SAM automotive families for that requirement. Microchip publishes conflict-minerals declarations per the Dodd-Frank Act.