RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
N.º da peça: RTAX4000SL-CQ352E ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3200 | $3.200,00 |
| 10 | $3050 | $30.500,00 |
| 100 | $2880 | $288.000,00 |
| 500 | $2750 | $1.375.000,00 |
| 1.000 | $2620 | $2.620.000,00 |
RTAX4000SL-CQ352E Visão geral
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, including proton and heavy-ion bombardment encountered in low-Earth orbit and deep-space missions. Within the programmable logic hierarchy, the RTAX4000SL sits at the top tier of the RTAX-S/SL family (semiconductor -> programmable logic device -> FPGA -> radiation-tolerant FPGA), one step above the mid-density RTAX2000S/SL and sharing its architecture with the commercial Axcelerator family from which it was derived.
Key features include densities of up to four million system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The anti-fuse-based fabric is live-at-power-up, eliminating the need for external configuration flash and reducing boot-time risk in orbit. The ceramic CQFP package provides the hermeticity required for space qualification flows.
Architecturally, the RTAX4000SL derives from the commercial Axcelerator family, so designers can prototype using low-cost, reprogrammable equivalents and then migrate the EDIF netlist and pinout to the radiation-tolerant device using Microchip's documented prototyping methodology and footprint-compatible adaptor boards.
Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and command interfaces, and radiation-exposed instrumentation where single-chip, low-power, live-at-power-up operation is mandatory.
A critical design consideration is the use of Triple-Module Redundancy (TMR) in the RTL for flip-flops sensitive to single-event upsets, since anti-fuse FPGAs tolerate configuration upsets well but user flip-flops still require mitigation.
This page synthesizes distributor data, drop-in alternative analysis, and practical space-design notes not found in the manufacturer datasheet, with pricing and stock signals refreshed as of 2026-09-01.
Alternativas drop-in para RTAX4000SL-CQ352E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com RTAX4000SL-CQ352E (mesmo formato e footprint) — diferindo em Package, Family, Radiation Tolerance, Logic Cells, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
RTAX4000SL-1CQ352E
✅ Drop-In✓ Em estoque
$3840 / unidade
Ver ficha técnica →RTAX4000SL-CQ352B
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →RTAX4000SL-1CQ352PROTO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
5962-0822405VXC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
RTAX4000SL-CQ352M
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
RTAX4000SL-CQ352E Classificações máximas e características elétricas
| Family | RTAX-SL (RTAX-S/SL and RTAX-DSP) |
| Equivalent System Gates | 4,000,000 |
| Logic Cells / Cells | 40,320 |
| Total Logic Modules | 60,480 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Encapsulamento | 352-terminal CQFP (ceramic quad flat pack) |
| Terminal Pitch | 0.500 mm |
| Radiation Tolerance | Radiation-tolerant (space-flight grade) |
| Configuration | Anti-fuse, live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| Temperatura de operação | -55C to +125C |
| Tipo de montagem | Surface Mount |
| Typical Applications | Space-flight systems, satellites |
Guia de Configuração de Pinos do RTAX4000SL-CQ352E 352-terminal cqfp (ceramic quad flat pack)
Configuração de pinos para RTAX4000SL-CQ352E (pacote 352-terminal cqfp (ceramic quad flat pack)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para RTAX4000SL-CQ352E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
RTAX4000SL-CQ352E é adequado para 6 aplicaçãos: Satellite Payload Processing, Spacecraft Bus Control, Telemetry and Command Interfaces, Radiation-Exposed Instrumentation, On-Board Data Handling and Storage Control, Space-Grade Prototyping and Verification.
Satellite Payload Processing
The RTAX4000SL-CQ352E fits satellite payload processing because its 4 million system gates and 40,320 logic cells absorb image preprocessing, compression engines, and protocol offload in a single anti-fuse device that is live at power-up - critical when a payload must respond the instant orbit power is applied. The embedded SRAM blocks with built-in FIFO control buffer high-rate sensor streams without external memory, and dedicated carry logic accelerates arithmetic datapaths. At a 1.5V core on 0.15 um CMOS, dynamic power stays within typical small-satellite power budgets. Unlike SRAM FPGAs, the anti-fuse configuration carries no configuration-upset risk in orbit, so SEU mitigation concentrates on user flip-flops via TMR.
Recomendado
Spacecraft Bus Control
For spacecraft bus controllers - handling telemetry, telecommand, and mode management - the RTAX4000SL-CQ352E offers single-chip integration without external configuration devices, reducing board area and failure modes. The segmentable clock structure lets one FPGA serve independent bus clock domains safely, and chip-wide highway routing eases timing closure for cross-domain control logic. Its -55C to +125C operating range covers eclipse-driven thermal swings, and the hermetic 352-pin CQFP supports the assembly processes used in high-reliability spacecraft electronics. Designers typically implement CCSDS or custom TM/TC framing directly in the fabric, using the 1.5V core to minimize standby power during safe mode.
Recomendado
Telemetry and Command Interfaces
Telemetry and telecommand interfaces benefit from the RTAX4000SL-CQ352E's anti-fuse live-at-power-up behavior: the interface is functional before any processor boots, enabling independent health monitoring and emergency command paths. The 40,320-cell capacity accommodates multiple redundant UART/MIL-STD-1553/SpaceWire-style front ends plus framing, CRC, and FIFO buffering in embedded SRAM. Carry-logic chains speed up CRC and checksum computation at low clock rates, cutting power. Because the configuration fabric is immune to configuration upsets, a watchdog-free command path can be trusted for mission-critical safing functions; only register-level TMR is required for long-mission SEU rates.
Recomendado
Radiation-Exposed Instrumentation
Scientific instruments on interplanetary probes and Earth-observation satellites face total ionizing dose and single-event effects that commercial FPGAs cannot survive. The RTAX4000SL-CQ352E, as a radiation-tolerant RTAX-SL device, provides 4M gates of design capacity with a configuration fabric immune to upsets, allowing instrument sequencing, ADC control, and on-board data reduction in one device. Its -55C to +125C range handles instrument thermal environments, and the 1.5V core limits self-heating in vacuum where only conduction cooling exists. The 352-terminal CQFP hermetic package is compatible with the staking and bonding practices used in high-reliability instrument assemblies.
Recomendado
On-Board Data Handling and Storage Control
Mass-memory units and solid-state recorders use the RTAX4000SL-CQ352E to manage flash arrays, error correction, and downlink formatting. The embedded SRAM with built-in FIFO control provides ping-pong buffering between acquisition and telemetry channels, while the 40,320 logic cells host BCH or Reed-Solomon style EDAC pipelines using dedicated carry logic. Segmentable clocks let acquisition, EDAC, and downlink domains run at independent frequencies for power optimization. Since the anti-fuse configuration is fixed, boot-time is zero - the memory controller is protecting stored data from the first millisecond after power application, which protects data integrity through brown-out and reset events in orbit.
Recomendado
Space-Grade Prototyping and Verification
Microchip's documented methodology pairs the RTAX4000SL-CQ352E flight device with low-cost prototyping paths: the RTAX4000SL-1CQ352PROTO offers the same functional characteristics in a non-hermetic package, and commercial Axcelerator devices run the design on a footprint-compatible adaptor board using an EDIF netlist and pinout converter (application note AC170). This workflow lets teams verify RTL, timing, and board-level bring-up before committing scarce flight units, then migrate unchanged to the CQ352E. Budgeting prototype hardware early avoids schedule risk, because flight-unit RTAX devices carry long lead times when distribution stock is exhausted.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para RTAX4000SL-CQ352E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | RTAX4000SL-1CQ352E | RTAX4000SL-CQ352B | RTAX4000SL-1CQ352PROTO | 5962-0822405VXC |
|---|---|---|---|---|---|
| Package | 352-pin CQFP | 352-pin CQFP - same | 352-pin CQFP - same | 352-pin CQFP (non-hermetic PROTO) | 352-pin CQFP - same |
| Brand | Actel / Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 40,320 | 40,320 | 40,320 | 40,320 | 40,320 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Hermeticity / Intended Use | Hermetic ceramic, flight | Hermetic ceramic, flight | Hermetic ceramic, flight | Non-hermetic, prototyping only | Hermetic ceramic, SMD-screened flight |
| Configuration Technology | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up |
Principais diferenciais
- Standard speed grade at lower cost (vs RTAX4000SL-1CQ352E)
- Flight-hermetic package versus prototype (vs RTAX4000SL-1CQ352PROTO)
- Commercial ordering path versus SMD screening (vs 5962-0822405VXC)
Notas de projeto
The 352-pin CQFP with 0.500 mm pitch and large body requires careful simultaneous-switching-noise management: distribute VSSI/VDDI return pins across the ring and keep high-fanout clocks on the segmentable clock resources rather than general routing. Series-terminate outputs driving backplane or harness lines - the ceramic package's lead inductance is higher than a BGA, so edge rates on fast speed grades (-1) can ring on longer traces. Microchip's RTAX-S/SL datasheet high-speed I/O section gives per-bank drive strengths; derate for vacuum operation where no convection assists trace heating.
Do not plan an RTL migration from commercial Axcelerator prototypes without following Microchip application note AC170: the supported path uses a footprint-compatible adaptor board plus an EDIF netlist and pinout converter, not a direct bitstream transfer. Also remember that anti-fuse devices are one-time programmable - a design change after programming means a new flight unit, so freeze RTL and complete TMR verification (flip-flop triple modular redundancy for SEU mitigation) before submitting devices for programming. Ordering PROTO devices (e.g., RTAX4000SL-1CQ352PROTO) for bring-up avoids burning flight hardware.
Estimated: power budgeting for the RTAX4000SL must combine 1.5V core dynamic power with I/O bank currents; use Microchip's SmartPower tool with your placed netlist rather than rule-of-thumb numbers, since a 4M-gate design can span a wide power range depending on clock activity. At a 1.5V core, every 100 mA of core current is only 150 mW, but I/O banks at 2.5V/3.3V often dominate. In vacuum, all heat leaves by conduction only - verify the CQFP-to-chassis thermal path (wedge-lock or thermal pad) before finalizing the power budget.
Informações de conformidade
Space-flight hermetic ceramic CQFP packaging; qualification is per space/military flows rather than AEC-Q100. RoHS/REACH status not stated in provided data - hermetic ceramic packages with alloy-42 or similar leads may carry exemptions; confirm with Microchip.
