RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
부품 번호: RTAX4000SL-CQ352E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2880 | $288,000.00 |
| 500 | $2750 | $1,375,000.00 |
| 1,000 | $2620 | $2,620,000.00 |
RTAX4000SL-CQ352E 개요
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, including proton and heavy-ion bombardment encountered in low-Earth orbit and deep-space missions. Within the programmable logic hierarchy, the RTAX4000SL sits at the top tier of the RTAX-S/SL family (semiconductor -> programmable logic device -> FPGA -> radiation-tolerant FPGA), one step above the mid-density RTAX2000S/SL and sharing its architecture with the commercial Axcelerator family from which it was derived.
Key features include densities of up to four million system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The anti-fuse-based fabric is live-at-power-up, eliminating the need for external configuration flash and reducing boot-time risk in orbit. The ceramic CQFP package provides the hermeticity required for space qualification flows.
Architecturally, the RTAX4000SL derives from the commercial Axcelerator family, so designers can prototype using low-cost, reprogrammable equivalents and then migrate the EDIF netlist and pinout to the radiation-tolerant device using Microchip's documented prototyping methodology and footprint-compatible adaptor boards.
Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and command interfaces, and radiation-exposed instrumentation where single-chip, low-power, live-at-power-up operation is mandatory.
A critical design consideration is the use of Triple-Module Redundancy (TMR) in the RTL for flip-flops sensitive to single-event upsets, since anti-fuse FPGAs tolerate configuration upsets well but user flip-flops still require mitigation.
This page synthesizes distributor data, drop-in alternative analysis, and practical space-design notes not found in the manufacturer datasheet, with pricing and stock signals refreshed as of 2026-09-01.
드롭인 대체품: RTAX4000SL-CQ352E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX4000SL-CQ352E (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Radiation Tolerance, Logic Cells, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX4000SL-1CQ352E
✅ 드롭인✓ 재고 있음
$3840 / 개
데이터시트 보기 →RTAX4000SL-CQ352B
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →RTAX4000SL-1CQ352PROTO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5962-0822405VXC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
RTAX4000SL-CQ352M
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
RTAX4000SL-CQ352E 최대 정격 & 전기적 특성
| Family | RTAX-SL (RTAX-S/SL and RTAX-DSP) |
| Equivalent System Gates | 4,000,000 |
| Logic Cells / Cells | 40,320 |
| Total Logic Modules | 60,480 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| 패키지 | 352-terminal CQFP (ceramic quad flat pack) |
| Terminal Pitch | 0.500 mm |
| Radiation Tolerance | Radiation-tolerant (space-flight grade) |
| Configuration | Anti-fuse, live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| 동작 온도 | -55C to +125C |
| 실장 유형 | Surface Mount |
| Typical Applications | Space-flight systems, satellites |
RTAX4000SL-CQ352E 352-terminal cqfp (ceramic quad flat pack) 핀 구성 가이드
RTAX4000SL-CQ352E(352-terminal cqfp (ceramic quad flat pack) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX4000SL-CQ352E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX4000SL-CQ352E 적합 용도: 6 애플리케이션s: Satellite Payload Processing, Spacecraft Bus Control, Telemetry and Command Interfaces, Radiation-Exposed Instrumentation, On-Board Data Handling and Storage Control, Space-Grade Prototyping and Verification.
Satellite Payload Processing
The RTAX4000SL-CQ352E fits satellite payload processing because its 4 million system gates and 40,320 logic cells absorb image preprocessing, compression engines, and protocol offload in a single anti-fuse device that is live at power-up - critical when a payload must respond the instant orbit power is applied. The embedded SRAM blocks with built-in FIFO control buffer high-rate sensor streams without external memory, and dedicated carry logic accelerates arithmetic datapaths. At a 1.5V core on 0.15 um CMOS, dynamic power stays within typical small-satellite power budgets. Unlike SRAM FPGAs, the anti-fuse configuration carries no configuration-upset risk in orbit, so SEU mitigation concentrates on user flip-flops via TMR.
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Spacecraft Bus Control
For spacecraft bus controllers - handling telemetry, telecommand, and mode management - the RTAX4000SL-CQ352E offers single-chip integration without external configuration devices, reducing board area and failure modes. The segmentable clock structure lets one FPGA serve independent bus clock domains safely, and chip-wide highway routing eases timing closure for cross-domain control logic. Its -55C to +125C operating range covers eclipse-driven thermal swings, and the hermetic 352-pin CQFP supports the assembly processes used in high-reliability spacecraft electronics. Designers typically implement CCSDS or custom TM/TC framing directly in the fabric, using the 1.5V core to minimize standby power during safe mode.
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Telemetry and Command Interfaces
Telemetry and telecommand interfaces benefit from the RTAX4000SL-CQ352E's anti-fuse live-at-power-up behavior: the interface is functional before any processor boots, enabling independent health monitoring and emergency command paths. The 40,320-cell capacity accommodates multiple redundant UART/MIL-STD-1553/SpaceWire-style front ends plus framing, CRC, and FIFO buffering in embedded SRAM. Carry-logic chains speed up CRC and checksum computation at low clock rates, cutting power. Because the configuration fabric is immune to configuration upsets, a watchdog-free command path can be trusted for mission-critical safing functions; only register-level TMR is required for long-mission SEU rates.
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Radiation-Exposed Instrumentation
Scientific instruments on interplanetary probes and Earth-observation satellites face total ionizing dose and single-event effects that commercial FPGAs cannot survive. The RTAX4000SL-CQ352E, as a radiation-tolerant RTAX-SL device, provides 4M gates of design capacity with a configuration fabric immune to upsets, allowing instrument sequencing, ADC control, and on-board data reduction in one device. Its -55C to +125C range handles instrument thermal environments, and the 1.5V core limits self-heating in vacuum where only conduction cooling exists. The 352-terminal CQFP hermetic package is compatible with the staking and bonding practices used in high-reliability instrument assemblies.
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On-Board Data Handling and Storage Control
Mass-memory units and solid-state recorders use the RTAX4000SL-CQ352E to manage flash arrays, error correction, and downlink formatting. The embedded SRAM with built-in FIFO control provides ping-pong buffering between acquisition and telemetry channels, while the 40,320 logic cells host BCH or Reed-Solomon style EDAC pipelines using dedicated carry logic. Segmentable clocks let acquisition, EDAC, and downlink domains run at independent frequencies for power optimization. Since the anti-fuse configuration is fixed, boot-time is zero - the memory controller is protecting stored data from the first millisecond after power application, which protects data integrity through brown-out and reset events in orbit.
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Space-Grade Prototyping and Verification
Microchip's documented methodology pairs the RTAX4000SL-CQ352E flight device with low-cost prototyping paths: the RTAX4000SL-1CQ352PROTO offers the same functional characteristics in a non-hermetic package, and commercial Axcelerator devices run the design on a footprint-compatible adaptor board using an EDIF netlist and pinout converter (application note AC170). This workflow lets teams verify RTL, timing, and board-level bring-up before committing scarce flight units, then migrate unchanged to the CQ352E. Budgeting prototype hardware early avoids schedule risk, because flight-unit RTAX devices carry long lead times when distribution stock is exhausted.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX4000SL-CQ352E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX4000SL-1CQ352E | RTAX4000SL-CQ352B | RTAX4000SL-1CQ352PROTO | 5962-0822405VXC |
|---|---|---|---|---|---|
| Package | 352-pin CQFP | 352-pin CQFP - same | 352-pin CQFP - same | 352-pin CQFP (non-hermetic PROTO) | 352-pin CQFP - same |
| Brand | Actel / Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 40,320 | 40,320 | 40,320 | 40,320 | 40,320 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Hermeticity / Intended Use | Hermetic ceramic, flight | Hermetic ceramic, flight | Hermetic ceramic, flight | Non-hermetic, prototyping only | Hermetic ceramic, SMD-screened flight |
| Configuration Technology | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up | Anti-fuse, live at power-up |
주요 차별점
- Standard speed grade at lower cost (vs RTAX4000SL-1CQ352E)
- Flight-hermetic package versus prototype (vs RTAX4000SL-1CQ352PROTO)
- Commercial ordering path versus SMD screening (vs 5962-0822405VXC)
설계 노트
The 352-pin CQFP with 0.500 mm pitch and large body requires careful simultaneous-switching-noise management: distribute VSSI/VDDI return pins across the ring and keep high-fanout clocks on the segmentable clock resources rather than general routing. Series-terminate outputs driving backplane or harness lines - the ceramic package's lead inductance is higher than a BGA, so edge rates on fast speed grades (-1) can ring on longer traces. Microchip's RTAX-S/SL datasheet high-speed I/O section gives per-bank drive strengths; derate for vacuum operation where no convection assists trace heating.
Do not plan an RTL migration from commercial Axcelerator prototypes without following Microchip application note AC170: the supported path uses a footprint-compatible adaptor board plus an EDIF netlist and pinout converter, not a direct bitstream transfer. Also remember that anti-fuse devices are one-time programmable - a design change after programming means a new flight unit, so freeze RTL and complete TMR verification (flip-flop triple modular redundancy for SEU mitigation) before submitting devices for programming. Ordering PROTO devices (e.g., RTAX4000SL-1CQ352PROTO) for bring-up avoids burning flight hardware.
Estimated: power budgeting for the RTAX4000SL must combine 1.5V core dynamic power with I/O bank currents; use Microchip's SmartPower tool with your placed netlist rather than rule-of-thumb numbers, since a 4M-gate design can span a wide power range depending on clock activity. At a 1.5V core, every 100 mA of core current is only 150 mW, but I/O banks at 2.5V/3.3V often dominate. In vacuum, all heat leaves by conduction only - verify the CQFP-to-chassis thermal path (wedge-lock or thermal pad) before finalizing the power budget.
규정 준수 정보
Space-flight hermetic ceramic CQFP packaging; qualification is per space/military flows rather than AEC-Q100. RoHS/REACH status not stated in provided data - hermetic ceramic packages with alloy-42 or similar leads may carry exemptions; confirm with Microchip.
