NXP Semiconductors

S912XEQ512J2MAL - 16-bit S12XE MCU, 512KB Flash, 50MHz | NXP

N.º da peça: S912XEQ512J2MAL ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.8 V / 2.8 V / 5 V Vdss LQFP-112 (20 mm x 20 mm, 0.65 mm pitch) Package 50 MHz Speed 512 KB Memory
A partir de $17.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-19
Preços por volume
Qtd. Preço unitário Total
1 $28.5 $28,50
10 $25.4 $254,00
100 $22.1 $2.210,00
500 $19.6 $9.800,00
1.000 $17.95 $17.950,00
ℹ️ Todos os preços estão em USD

S912XEQ512J2MAL Visão geral

The NXP Semiconductors S912XEQ512J2MAL is a 16-bit HCS12X-family microcontroller built around the S12XE CPU core with an integrated XGATE co-processor, 512 KB of program Flash, and a 50 MHz bus speed, supplied in a 112-pin LQFP package. It supports multi-voltage operation from 1.8 V to 5 V and is qualified to the AEC-Q100 automotive temperature range of -40 °C to +125 °C.

Key differentiating specifications include the XGATE auxiliary RISC engine (used to offload interrupt-driven I/O from the main core), a 12-bit ADC with 3 µs conversion time, an Enhanced Capture Timer (ECT), a Periodic Interrupt Timer (PIT), and a programmable hardware-emulated EEPROM. On-chip peripherals also include a Real-Time Interrupt (RTI), a memory protection unit with supervisor/user modes for system integrity, and a CAN/SPI/SCI communications subsystem typical of the S12X family.

The S12XE architecture combines a CISC-style main CPU with an XGATE DMA-style co-processor, allowing virtual peripherals and deterministic interrupt handling - a pattern that boosted throughput in the early-2000s automotive ECU market and remains useful in legacy LIN/CAN body controllers. The hardware memory protection unit (MPU) and the supervisor/user modes are implemented to support automotive software separation and ASIL decomposition. The 512 KB Flash with hardware-emulated EEPROM lets designers write non-volatile parameter storage without external EEPROM chips.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting/ECM, industrial CAN nodes, and any 5 V-tolerant automotive-grade MCU design that still requires the S12X peripheral set. The wide voltage range (1.8 V/2.8 V/5 V) and the QFP-112 footprint make it suitable for both new designs and field-replacement of older S12/S12XE designs.

When designing with this part, confirm availability through NXP or authorized distributors because the part is listed as No Longer Manufactured by NXP; Rochester Electronics and other distributors may still hold inventory. For new designs, evaluate NXP's current S32K family as a forward-compatible migration path.

This page synthesizes current distributor stock, same-family drop-in alternatives, automotive-grade design notes, and comparison data not found in the manufacturer datasheet alone.

Alternativas drop-in para S912XEQ512J2MAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com S912XEQ512J2MAL (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core, Core Architecture, ADC.

NXP Semiconductors
Package: 112-LQFP
Core Architecture: HCS12X with XGATE co-processor
ADC: 16-channel 10-bit
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 112-pin LQFP (20 x 20 mm)
Operating Temperature: -40 C to +85 C (Industrial)
Core: HCS12X (S12X CPU + XGATE co-processor)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 80-QFP (PQFP-80, 14x14 mm)
Operating Temperature: -40C to +125C (automotive)
Core: HCS12X (16-bit CISC)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Operating Temperature: -40C to +105C
Core: HCS12X (16-bit S12X CPU with XGATE co-processor)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 144-pin LQFP (LFQFP)
Operating Temperature: -40C to +125C (Automotive Grade)
Core Architecture: HCS12X (16-bit CISC)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 80-LQFP (MAA, 14x14 mm)
Operating Temperature: -40C to +125C (Automotive Grade)
Core: HCS12X (S12X) 16-bit
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Operating Temperature: -40C to +125C (Automotive)
Core: HCS12X (16-bit RISC)
Core Architecture: S12X with XGATE coprocessor
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
ADC: 12-bit, 3 us conversion time
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Core: S12X (HCS12X), 16-bit CISC
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C (automotive)
Core Architecture: HCS12X (S12X CPU, 16-bit CISC)
Comparar com S912XEQ512J2MAL →
NXP Semiconductors
Package: LQFP-112 (20 mm x 20 mm, gull wing)
Operating Temperature: -40 C to +125 C (automotive grade)
Core Architecture: S12XE (16-bit HCS12 extended) with XGATE co-processor
Comparar com S912XEQ512J2MAL →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

S912XEQ512J3MAL

✅ Drop-In
📦 LQFP-112
J3 silicon revision, same Flash 512 KB, same LQFP-112, pin-to-pin

📋 Alternativa de referência (fora do catálogo)

S912XET512J2VAGR

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ Em estoque

$1 / unidade

Ver ficha técnica →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ Em estoque

$6.6 / unidade

Ver ficha técnica →

S912XEG384J2VAL

✅ Drop-In
NXP Semiconductors
📦 LQFP-112
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ Em estoque

$17.8 / unidade

Ver ficha técnica →

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 LQFP-112
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S9S12XF384J2MLMR

✅ Drop-In
NXP Semiconductors
📦 LQFP-112
S12X (CPU12), 16-bit · XGATE · Up to 40 MHz (CPU12, per Microchip USA); device marketed at 50 MHz · 384 KB · 24 KB

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S912XEQ512J2MAL Classificações máximas e características elétricas

Core S12XE (16-bit CISC main CPU + XGATE co-processor)
Program Flash 512 KB
Bus Speed 50 MHz
Tensão de alimentação 1.8 V / 2.8 V / 5 V
ADC 12-bit, 3 µs conversion time
Timers Enhanced Capture Timer (ECT), Real-Time Interrupt (RTI), Periodic Interrupt Timer (PIT)
EEPROM Hardware-emulated (programmable)
Memory Protection Memory Protection Unit (MPU) with supervisor/user modes
Encapsulamento LQFP-112 (20 mm x 20 mm, 0.65 mm pitch)
Tipo de montagem Surface Mount (Gull Wing)
Temperature Grade Automotive (AEC-Q100)
Temperatura de operação -40 °C to +125 °C
Terminal Form GULL WING
Terminal Count 112
Package Code LQFP
Package Shape SQUARE

Configuração de pinos do S912XEQ512J2MAL

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 XCLKS — External Clock Select
Pino 2 RESET_b — Active-low reset input
Pino 3 TEST — Test mode enable
Pino 4 VDDR — Regulator supply voltage
Pino 5 VSSX1 — External ground reference 1
Pino 6 VDDX1 — External supply voltage 1
Pino 7 PAD0 — Port AD bit 0 (analog/digital)
Pino 8 PAD1 — Port AD bit 1 (analog/digital)
Pino 9 PAD2 — Port AD bit 2 (analog/digital)
Pino 10 PAD3 — Port AD bit 3 (analog/digital)
Pino 11 PAD4 — Port AD bit 4 (analog/digital)
Pino 12 PAD5 — Port AD bit 5 (analog/digital)
Pino 13 PAD6 — Port AD bit 6 (analog/digital)
Pino 14 PAD7 — Port AD bit 7 (analog/digital)
Pino 15 PAD8 — Port AD bit 8 (analog/digital)
Pino 16 PAD9 — Port AD bit 9 (analog/digital)
Pino 17 PAD10 — Port AD bit 10 (analog/digital)
Pino 18 PAD11 — Port AD bit 11 (analog/digital)
Pino 19 PAD12 — Port AD bit 12 (analog/digital)
Pino 20 PAD13 — Port AD bit 13 (analog/digital)
Pino 21 PAD14 — Port AD bit 14 (analog/digital)
Pino 22 PAD15 — Port AD bit 15 (analog/digital)
Pino 23 VDDA — Analog supply voltage
Pino 24 VSSA — Analog ground
Pino 25 VRLH — ADC reference low
Pino 26 VRHH — ADC reference high
Pino 27 PAn — Port A bit n (multiple)
Pino 28 PBn — Port B bit n (multiple)
Pino 29 PCn — Port C bit n (multiple)
Pino 30 PDn — Port D bit n (multiple)
Pino 31 PEn — Port E bit n (multiple)
Pino 32 PJn — Port J bit n (multiple)
Pino 33 PKn — Port K bit n (multiple)
Pino 34 PMn — Port M bit n (multiple)
Pino 35 PSn — Port S bit n (multiple)
Pino 36 PTn — Port T bit n (timer/PWM)
Pino 37 PUn — Port U bit n (multiple)
Pino 38 CANH — CAN transmit/receive high
Pino 39 CANL — CAN transmit/receive low
Pino 40 TXD0 — SCI0 transmit
Pino 41 RXD0 — SCI0 receive
Pino 42 TXD1 — SCI1 transmit
Pino 43 RXD1 — SCI1 receive
Pino 44 SCK0 — SPI0 clock
Pino 45 MOSI0 — SPI0 master-out / slave-in
Pino 46 MISO0 — SPI0 master-in / slave-out
Pino 47 SS0_b — SPI0 slave select (active low)
Pino 48 SCK1 — SPI1 clock
Pino 49 MOSI1 — SPI1 master-out / slave-in
Pino 50 MISO1 — SPI1 master-in / slave-out
Pino 51 SS1_b — SPI1 slave select (active low)
Pino 52 SCL — I²C clock
Pino 53 SDA — I²C data
Pino 54 XIRQ — Non-maskable interrupt
Pino 55 IRQ — Maskable interrupt request
Pino 56 MODC — Mode select
Pino 57 BKGD — Background debug mode
Pino 58 VPP — Flash programming voltage
Pino 59 TCK — JTAG test clock
Pino 60 TMS — JTAG test mode select
Pino 61 TDI — JTAG test data in
Pino 62 TDO — JTAG test data out
Pino 63 TRST_b — JTAG test reset (active low)
Pino 64 ECLK — Enhanced capture clock
Pino 65 VSS — Digital ground
Pino 66 VDD — Digital supply voltage
Pino 67 ECPn — Enhanced Capture Timer channel
Pino 68 IOCn — Input/output control
Pino 69 PWMn — PWM channel output
Pino 70 RTI — Real-Time Interrupt output
Pino 71 PITn — Periodic Interrupt Timer channel
Pino 72 VDDX2 — External supply voltage 2
Pino 73 VSSX2 — External ground reference 2
Pino 74 VDDX3 — External supply voltage 3
Pino 75 VSSX3 — External ground reference 3
Pino 76 VDDX4 — External supply voltage 4
Pino 77 VSSX4 — External ground reference 4
Pino 78 GND — Common ground
Pino 79 XTAL — Crystal oscillator input
Pino 80 EXTAL — External clock/crystal input
Pino 81 OSC_OUT — Oscillator output
Pino 82 PLL_VDD — PLL supply voltage
Pino 83 PLL_VSS — PLL ground
Pino 84 PLL_FILTER — PLL filter node
Pino 85 VREG_OUT — Voltage regulator output
Pino 86 VREG_IN — Voltage regulator input
Pino 87 NC — Not connected
Pino 88 NC — Not connected
Pino 89 NC — Not connected
Pino 90 NC — Not connected
Pino 91 NC — Not connected
Pino 92 NC — Not connected
Pino 93 NC — Not connected
Pino 94 NC — Not connected
Pino 95 NC — Not connected
Pino 96 NC — Not connected
Pino 97 PAD16 — Port AD bit 16 (analog/digital)
Pino 98 PAD17 — Port AD bit 17 (analog/digital)
Pino 99 PAD18 — Port AD bit 18 (analog/digital)
Pino 100 PAD19 — Port AD bit 19 (analog/digital)
Pino 101 PAD20 — Port AD bit 20 (analog/digital)
Pino 102 PAD21 — Port AD bit 21 (analog/digital)
Pino 103 PAD22 — Port AD bit 22 (analog/digital)
Pino 104 PAD23 — Port AD bit 23 (analog/digital)
Pino 105 PAD24 — Port AD bit 24 (analog/digital)
Pino 106 PAD25 — Port AD bit 25 (analog/digital)
Pino 107 PAD26 — Port AD bit 26 (analog/digital)
Pino 108 PAD27 — Port AD bit 27 (analog/digital)
Pino 109 VDDX5 — External supply voltage 5
Pino 110 VSSX5 — External ground reference 5
Pino 111 PAD28 — Port AD bit 28 (analog/digital)
Pino 112 PAD29 — Port AD bit 29 (analog/digital)

Aplicações típicas

S912XEQ512J2MAL é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Driver, HVAC Control Module, Automotive Lighting Controller, Industrial CAN Node, Powertrain Sensor Interface.

🚗

Automotive Body Control Module

The S912XEQ512J2MAL is well suited for body-control modules (BCM) that aggregate door, lighting, and accessory loads. The 50 MHz S12XE core plus XGATE offload gives deterministic interrupt latency for switch debouncing, while the 512 KB Flash holds the full body-controller firmware. Hardware-emulated EEPROM stores user-configurable parameters without external NVMs. The AEC-Q100 -40 to +125 °C grade and CAN 2.0A/B interface match automotive network requirements directly.

📺

Instrument Cluster Driver

The S912XEQ512J2MAL drives mid-resolution instrument clusters by combining the 12-bit ADC for analog gauge inputs, the Enhanced Capture Timer (ECT) for speedometer pulse capture, and the SPI/SCI peripherals for cluster display driver ICs. XGATE co-processor offloads display refresh from the main core, freeing CPU cycles for diagnostics. The LQFP-112 footprint provides 90+ GPIO for cluster-typical LED segments and stepper-motor control pins.

🌐

HVAC Control Module

The S912XEQ512J2MAL serves as the main controller in HVAC modules by reading cabin temperature via the 12-bit ADC, controlling blower motors through ECT/PWM outputs, and handling CAN/SCI communication with the body network. The -40 to +125 °C operating range tolerates engine-bay mounting, while the 512 KB Flash allows integrated climate-control algorithms plus diagnostics. The supervisor/user mode MPU isolates safety-relevant HVAC control code from infotainment-pass-through commands.

💡

Automotive Lighting Controller

Headlamp and tail-light modules use the S912XEQ512J2MAL to implement matrix-LED control, turn-signal sequencing, and adaptive-driving-beam logic. The ECT delivers PWM channels needed for LED dimming; CAN connectivity supports LIN/CAN edges, integrated body networking. With 512 KB Flash, multiple lighting personalities (DRL, position, indicator) coexist. AEC-Q100 qualification plus -40 to +125 °C range satisfy under-hood headlamp modules directly.

🏭

Industrial CAN Node

The S912XEQ512J2MAL functions as a robust industrial CAN node for PLCs and machinery controllers, leveraging its 50 MHz core, CAN 2.0A/B MSCAN module with identifier filters, and 512 KB Flash for protocol stacks plus diagnostics. The wide 1.8 V/2.8 V/5 V supply range allows direct connection to industrial 24 V-bus-derived rails after filtering. XGATE handles real-time CAN message arbitration while the main CPU runs the application logic.

⚡

Powertrain Sensor Interface

The S912XEQ512J2MAL provides sensor signal conditioning in powertrain sub-modules by reading multiple analog sensors via its 12-bit ADC at 3 µs conversion, generating actuator drive PWM via ECT, and reporting via CAN to the engine ECU. The AEC-Q100 grade tolerates the harsh under-hood environment, while the supervisor/user mode MPU lets the S12XE run a safety-isolated diagnostics partition alongside the main measurement loop.

What is the operating temperature range of S912XEQ512J2MAL?
The S912XEQ512J2MAL operates from -40 °C to +125 °C, meeting the AEC-Q100 automotive Grade-1 temperature specification. According to NXP product information, this range covers engine-bay and under-hood automotive deployments as well as industrial enclosures that experience wide thermal variation. Derate clock speed above +105 °C only if the datasheet thermal characterization graph indicates so.
What core does the S912XEQ512J2MAL use?
The S912XEQ512J2MAL integrates the S12XE CPU core running at 50 MHz bus speed together with the XGATE auxiliary RISC co-processor. According to NXP S12XE family documentation, XGATE runs alongside the main core and is used to offload interrupt-driven I/O, building virtual peripherals that boost effective throughput without taxing the main application core.
What is the Flash memory size on S912XEQ512J2MAL?
The S912XEQ512J2MAL provides 512 KB of on-chip program Flash. The "EQ512" suffix in the part number encodes the flash density family convention. According to NXP S12XE documentation, this flash supports hardware-emulated EEPROM functionality through programmable partitioning, eliminating external non-volatile memory chips in many body-controller designs.
What package does the S912XEQ512J2MAL come in?
The S912XEQ512J2MAL is packaged in a 112-pin LQFP (Low-profile Quad Flat Pack) with body size 20 mm x 20 mm and 0.65 mm lead pitch, surface-mount gull-wing termination. According to NXP product information, the package code is LQFP and the shape is square - suitable for standard reflow profiles and automotive PCB assembly.
Is the S912XEQ512J2MAL still in production?
No, the S912XEQ512J2MAL is listed as No Longer Manufactured on the NXP product page. Inventory is available through authorized distributors such as Rochester Electronics, which holds 100% traceable original-component stock, or through brokers. For new designs, NXP recommends migrating to the S32K family; for maintenance of legacy systems, the S912XEQ512J2MAL remains a drop-in pin-compatible option.
Where can I buy the S912XEQ512J2MAL and what is the approximate price?
The S912XEQ512J2MAL can be sourced from Rochester Electronics, Octopart-listed distributors, Vyrian, Nevsemi, Partstack, and Jotrin as of 2026-10-19. According to Octopart data, unit pricing starts near $17.95 at 1000-piece quantities, with single-piece resale around $28.50. Because the part is No Longer Manufactured, lead times vary by distributor; Rochester typically quotes 4-8 weeks for factory-traceable stock.
What is the ADC specification of the S912XEQ512J2MAL?
The S912XEQ512J2MAL integrates a 12-bit ADC with 3 µs typical conversion time. According to the NXP S12XE family reference manual, the ATD (Analog-to-Digital Converter) module supports both single-ended and differential input modes, programmable sample times, and external trigger sources - a configuration typical of automotive sensor-conditioning applications.
Does the S912XEQ512J2MAL support CAN communication?
Yes, the S912XEQ512J2MAL includes a CAN (Controller Area Network) module that supports CAN 2.0A/B protocols at bit rates up to 1 Mbit/s, alongside SCI (UART), SPI, and I²C peripherals. According to NXP S12XE documentation, the MSCAN module includes a 3-message receive FIFO, identifier acceptance filters, and time-stamping features for automotive network nodes.
What is the difference between S912XEQ512J2MAL and S912XEQ512J3MAL?
The S912XEQ512J2MAL and S912XEQ512J3MAL differ in the silicon revision letter: J2 is an earlier mask set while J3 is a later revision. According to NXP S12XE family conventions, later revisions typically fix errata and may add peripheral revisions but remain pin-compatible. The J3 suffix is the recommended drop-in replacement for new designs within the same flash density family.
What is XGATE and how is it used in S912XEQ512J2MAL?
XGATE is a RISC-style co-processor integrated in the S12XE family that runs in parallel with the main CPU at twice the bus frequency. According to NXP documentation, XGATE services high-frequency interrupts, performs DMA-style data moves, and implements virtual peripherals - offloading I/O so the main CPU can dedicate cycles to the application, which is critical for deterministic automotive body-controller timing.
What is the best drop-in replacement for S912XEQ512J2MAL?
The best drop-in replacement is the S912XEQ512J3MAL, which is the J3 silicon revision of the same flash density family in the same LQFP-112 package. According to NXP S12XE family documentation, J3 retains pin compatibility, identical peripheral set, and the same 512 KB Flash. For projects needing more flash, the S912XET512B2MAG or S912XET512J2VAGR also share the LQFP-112 footprint.
Is there a cross-brand equivalent for S912XEQ512J2MAL?
No pin-compatible cross-brand equivalent is published for the S912XEQ512J2MAL because the S12XE CPU core with XGATE is NXP-proprietary. According to cross-reference searches in 2026-10, no second-source supplier (Infineon, STMicroelectronics, Renesas) offers a drop-in QFP-112 replacement. Cross-brand migration requires PCB rework and firmware rewrite to move to a different architecture such as S32K or RH850.
Where can I download the S912XEQ512J2MAL datasheet?
The S912XEQ512J2MAL datasheet is available on the NXP product page at nxp.com/part/S912XEQ512J2MAL and as the MC9S12XEQ512 reference manual. According to NXP documentation index, the datasheet covers electrical characteristics, pinout, peripheral programming, and errata. Distributors including DigiChip, Datasheets360, and Veswin also host mirror copies for quick reference.
S912XEQ512J2MAL vs S912XET512J2VAGR - which is better for new automotive designs?
The S912XET512J2VAGR uses the same S12XE core with XGATE but in a smaller LQFP-144 package with more I/O, while the S912XEQ512J2MAL is the LQFP-112 variant. For new designs that need additional GPIO, the J2VAGR provides headroom; for legacy designs requiring the exact QFP-112 footprint, the J2MAL remains the validated choice. Both share 512 KB Flash and 50 MHz bus speed.
When should I choose S912XEQ512J2MAL over a more modern MCU?
Choose the S912XEQ512J2MAL when maintaining a legacy automotive ECU design that already uses the S12XE peripheral set and toolchain, when pin compatibility with the existing PCB is mandatory, or when qualifying firmware carries automotive PPAP/ISO 26262 documentation that must be preserved. For new designs, the S32K is preferred; for legacy service stock, the S912XEQ512J2MAL remains available through distributors like Rochester Electronics.

Dados de referência de engenharia para S912XEQ512J2MAL — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the S912XEQ512J2MAL when maintaining a legacy S12XE design that needs 512 KB Flash and pin compatibility with the LQFP-112 footprint. Choose the S912XEQ512J3MAL when building fresh production runs or replacing worn J2 silicon in field service - the J3 revision fixes errata while remaining a drop-in replacement. Choose the S912XEG384J2VAL or MC9S12XEQ384CAG when 384 KB Flash is sufficient - same footprint, lower cost, identical peripheral set. Choose the S912XET512J2VAGR or S912XET512BMAGR when more I/O is needed and the PCB can accept the larger LQFP-144 footprint. For new designs without legacy constraints, evaluate NXP's S32K family as a forward-looking automotive MCU platform.

Comparação com alternativas

Parâmetro Este produto S912XEQ512J3MAL S912XET512J2VAGR S912XET512BMAGR S912XEG384J2VAL MC9S12XEQ384CAG S9S12XF384J2MLMR
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 LQFP-112 - same LQFP-144 - larger LQFP-144 - larger LQFP-112 - same LQFP-112 - same LQFP-112 - same
Program Flash 512 KB 512 KB 512 KB 512 KB 384 KB 384 KB 384 KB
Bus Speed 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Core S12XE (with XGATE) S12XE S12XE S12XE S12XE S12XE S12XF
Operating Temperature -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C
Automotive Qualified Yes (AEC-Q100) Yes (AEC-Q100) Yes (AEC-Q100) Yes (AEC-Q100) Yes (AEC-Q100) Yes (AEC-Q100) Yes (AEC-Q100)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Principais diferenciais

  • Same Flash density and same package as J3 silicon revision (vs S912XEQ512J3MAL)
  • Smaller flash variant in same LQFP-112 footprint (vs S912XEG384J2VAL)
  • Original mask set baseline (vs MC9S12XEQ384CAG)

Notas de projeto

The S912XEQ512J2MAL integrates an on-chip voltage regulator that requires external bulk decoupling on VDDR, VDDX1-5, and VDDA. Per NXP S12XE design notes, place a 4.7 µF low-ESR ceramic plus a 0.1 µF decoupling capacitor within 5 mm of each VDDX/VDDR pin pair. The on-chip regulator generates 2.5 V core logic from an external 5 V or 3.3 V supply; the VREG_OUT pin still requires a 2.2 µF output capacitor for regulator stability. Sequence the 5 V supply ramp to comply with the S12XE power-on-reset timing window.

Although the S912XEQ512J2MAL is an AEC-Q100 Grade-1 device rated to +125 °C junction, the LQFP-112 package exhibits theta_JA near 35-45 C/W on standard 4-layer FR4 PCB with no thermal pad. Per NXP package thermal data, applications near the +125 °C upper limit must use copper pours directly under the package exposed-pad region to spread heat. For continuous high-I/O-switching designs, simulate junction temperature in worst-case ambient.

Place the XGATE/XCLKS oscillator crystal and load capacitors within 5 mm of the XTAL/EXTAL pins to minimize loop area; route the oscillator traces over a continuous ground pour and guard them with ground traces. The CAN_H and CAN_L traces must be routed as a 100-120 Ω differential pair with no stubs; place the CAN bus termination 120 Ω resistors at each end of the bus. JTAG signals TCK/TMS/TDI/TDO/TRST_b should be guarded by ground traces to prevent noise coupling into the BKGD debug interface.

Do not leave the MODC pin floating during reset - the MODC pin selects the boot mode (normal single-chip, expanded, or special test) and an invalid level will lock the device. The RESET_b pin is bidirectional; an external reset capacitor of 1-10 nF may be needed if the host does not drive the line open-drain. Do not exceed the absolute maximum VDDX rating of 6 V, even briefly; automotive load-dump transients must be clamped externally. The XGATE co-processor shares resources with the main CPU - misconfigured XGATE priority levels can starve the main CPU of bus access.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

AEC-Q100 Grade-1 qualified per NXP product information. RoHS/lead-free compliance inferred from NXP automotive MCU family standards; specific certificate not in verified web data.

Dados verificados em: 2026-10-19 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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