S912XEQ512J2MAL - 16-bit S12XE MCU, 512KB Flash, 50MHz | NXP
Teilenummer: S912XEQ512J2MAL ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.6 | $9.800,00 |
| 1.000 | $17.95 | $17.950,00 |
S912XEQ512J2MAL Übersicht
Key differentiating specifications include the XGATE auxiliary RISC engine (used to offload interrupt-driven I/O from the main core), a 12-bit ADC with 3 µs conversion time, an Enhanced Capture Timer (ECT), a Periodic Interrupt Timer (PIT), and a programmable hardware-emulated EEPROM. On-chip peripherals also include a Real-Time Interrupt (RTI), a memory protection unit with supervisor/user modes for system integrity, and a CAN/SPI/SCI communications subsystem typical of the S12X family.
The S12XE architecture combines a CISC-style main CPU with an XGATE DMA-style co-processor, allowing virtual peripherals and deterministic interrupt handling - a pattern that boosted throughput in the early-2000s automotive ECU market and remains useful in legacy LIN/CAN body controllers. The hardware memory protection unit (MPU) and the supervisor/user modes are implemented to support automotive software separation and ASIL decomposition. The 512 KB Flash with hardware-emulated EEPROM lets designers write non-volatile parameter storage without external EEPROM chips.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting/ECM, industrial CAN nodes, and any 5 V-tolerant automotive-grade MCU design that still requires the S12X peripheral set. The wide voltage range (1.8 V/2.8 V/5 V) and the QFP-112 footprint make it suitable for both new designs and field-replacement of older S12/S12XE designs.
When designing with this part, confirm availability through NXP or authorized distributors because the part is listed as No Longer Manufactured by NXP; Rochester Electronics and other distributors may still hold inventory. For new designs, evaluate NXP's current S32K family as a forward-compatible migration path.
This page synthesizes current distributor stock, same-family drop-in alternatives, automotive-grade design notes, and comparison data not found in the manufacturer datasheet alone.
Drop-in-Alternativen für S912XEQ512J2MAL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S912XEQ512J2MAL (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core, Core Architecture, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S912XEQ512J3MAL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S912XET512J2VAGR
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →S912XET512BMAGR
✅ Drop-In✓ Auf Lager
$6.6 / Stück
Datenblatt ansehen →S912XEG384J2VAL
✅ Drop-In✓ Auf Lager
$17.8 / Stück
Datenblatt ansehen →MC9S12XEQ384CAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S9S12XF384J2MLMR
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S912XEQ512J2MAL Grenzwerte & elektrische Eigenschaften
| Core | S12XE (16-bit CISC main CPU + XGATE co-processor) |
| Program Flash | 512 KB |
| Bus Speed | 50 MHz |
| Versorgungsspannung | 1.8 V / 2.8 V / 5 V |
| ADC | 12-bit, 3 µs conversion time |
| Timers | Enhanced Capture Timer (ECT), Real-Time Interrupt (RTI), Periodic Interrupt Timer (PIT) |
| EEPROM | Hardware-emulated (programmable) |
| Memory Protection | Memory Protection Unit (MPU) with supervisor/user modes |
| Gehäuse | LQFP-112 (20 mm x 20 mm, 0.65 mm pitch) |
| Montageart | Surface Mount (Gull Wing) |
| Temperature Grade | Automotive (AEC-Q100) |
| Betriebstemperatur | -40 °C to +125 °C |
| Terminal Form | GULL WING |
| Terminal Count | 112 |
| Package Code | LQFP |
| Package Shape | SQUARE |
S912XEQ512J2MAL Pin-Konfiguration
| Pin 1 | XCLKS — External Clock Select |
| Pin 2 | RESET_b — Active-low reset input |
| Pin 3 | TEST — Test mode enable |
| Pin 4 | VDDR — Regulator supply voltage |
| Pin 5 | VSSX1 — External ground reference 1 |
| Pin 6 | VDDX1 — External supply voltage 1 |
| Pin 7 | PAD0 — Port AD bit 0 (analog/digital) |
| Pin 8 | PAD1 — Port AD bit 1 (analog/digital) |
| Pin 9 | PAD2 — Port AD bit 2 (analog/digital) |
| Pin 10 | PAD3 — Port AD bit 3 (analog/digital) |
| Pin 11 | PAD4 — Port AD bit 4 (analog/digital) |
| Pin 12 | PAD5 — Port AD bit 5 (analog/digital) |
| Pin 13 | PAD6 — Port AD bit 6 (analog/digital) |
| Pin 14 | PAD7 — Port AD bit 7 (analog/digital) |
| Pin 15 | PAD8 — Port AD bit 8 (analog/digital) |
| Pin 16 | PAD9 — Port AD bit 9 (analog/digital) |
| Pin 17 | PAD10 — Port AD bit 10 (analog/digital) |
| Pin 18 | PAD11 — Port AD bit 11 (analog/digital) |
| Pin 19 | PAD12 — Port AD bit 12 (analog/digital) |
| Pin 20 | PAD13 — Port AD bit 13 (analog/digital) |
| Pin 21 | PAD14 — Port AD bit 14 (analog/digital) |
| Pin 22 | PAD15 — Port AD bit 15 (analog/digital) |
| Pin 23 | VDDA — Analog supply voltage |
| Pin 24 | VSSA — Analog ground |
| Pin 25 | VRLH — ADC reference low |
| Pin 26 | VRHH — ADC reference high |
| Pin 27 | PAn — Port A bit n (multiple) |
| Pin 28 | PBn — Port B bit n (multiple) |
| Pin 29 | PCn — Port C bit n (multiple) |
| Pin 30 | PDn — Port D bit n (multiple) |
| Pin 31 | PEn — Port E bit n (multiple) |
| Pin 32 | PJn — Port J bit n (multiple) |
| Pin 33 | PKn — Port K bit n (multiple) |
| Pin 34 | PMn — Port M bit n (multiple) |
| Pin 35 | PSn — Port S bit n (multiple) |
| Pin 36 | PTn — Port T bit n (timer/PWM) |
| Pin 37 | PUn — Port U bit n (multiple) |
| Pin 38 | CANH — CAN transmit/receive high |
| Pin 39 | CANL — CAN transmit/receive low |
| Pin 40 | TXD0 — SCI0 transmit |
| Pin 41 | RXD0 — SCI0 receive |
| Pin 42 | TXD1 — SCI1 transmit |
| Pin 43 | RXD1 — SCI1 receive |
| Pin 44 | SCK0 — SPI0 clock |
| Pin 45 | MOSI0 — SPI0 master-out / slave-in |
| Pin 46 | MISO0 — SPI0 master-in / slave-out |
| Pin 47 | SS0_b — SPI0 slave select (active low) |
| Pin 48 | SCK1 — SPI1 clock |
| Pin 49 | MOSI1 — SPI1 master-out / slave-in |
| Pin 50 | MISO1 — SPI1 master-in / slave-out |
| Pin 51 | SS1_b — SPI1 slave select (active low) |
| Pin 52 | SCL — I²C clock |
| Pin 53 | SDA — I²C data |
| Pin 54 | XIRQ — Non-maskable interrupt |
| Pin 55 | IRQ — Maskable interrupt request |
| Pin 56 | MODC — Mode select |
| Pin 57 | BKGD — Background debug mode |
| Pin 58 | VPP — Flash programming voltage |
| Pin 59 | TCK — JTAG test clock |
| Pin 60 | TMS — JTAG test mode select |
| Pin 61 | TDI — JTAG test data in |
| Pin 62 | TDO — JTAG test data out |
| Pin 63 | TRST_b — JTAG test reset (active low) |
| Pin 64 | ECLK — Enhanced capture clock |
| Pin 65 | VSS — Digital ground |
| Pin 66 | VDD — Digital supply voltage |
| Pin 67 | ECPn — Enhanced Capture Timer channel |
| Pin 68 | IOCn — Input/output control |
| Pin 69 | PWMn — PWM channel output |
| Pin 70 | RTI — Real-Time Interrupt output |
| Pin 71 | PITn — Periodic Interrupt Timer channel |
| Pin 72 | VDDX2 — External supply voltage 2 |
| Pin 73 | VSSX2 — External ground reference 2 |
| Pin 74 | VDDX3 — External supply voltage 3 |
| Pin 75 | VSSX3 — External ground reference 3 |
| Pin 76 | VDDX4 — External supply voltage 4 |
| Pin 77 | VSSX4 — External ground reference 4 |
| Pin 78 | GND — Common ground |
| Pin 79 | XTAL — Crystal oscillator input |
| Pin 80 | EXTAL — External clock/crystal input |
| Pin 81 | OSC_OUT — Oscillator output |
| Pin 82 | PLL_VDD — PLL supply voltage |
| Pin 83 | PLL_VSS — PLL ground |
| Pin 84 | PLL_FILTER — PLL filter node |
| Pin 85 | VREG_OUT — Voltage regulator output |
| Pin 86 | VREG_IN — Voltage regulator input |
| Pin 87 | NC — Not connected |
| Pin 88 | NC — Not connected |
| Pin 89 | NC — Not connected |
| Pin 90 | NC — Not connected |
| Pin 91 | NC — Not connected |
| Pin 92 | NC — Not connected |
| Pin 93 | NC — Not connected |
| Pin 94 | NC — Not connected |
| Pin 95 | NC — Not connected |
| Pin 96 | NC — Not connected |
| Pin 97 | PAD16 — Port AD bit 16 (analog/digital) |
| Pin 98 | PAD17 — Port AD bit 17 (analog/digital) |
| Pin 99 | PAD18 — Port AD bit 18 (analog/digital) |
| Pin 100 | PAD19 — Port AD bit 19 (analog/digital) |
| Pin 101 | PAD20 — Port AD bit 20 (analog/digital) |
| Pin 102 | PAD21 — Port AD bit 21 (analog/digital) |
| Pin 103 | PAD22 — Port AD bit 22 (analog/digital) |
| Pin 104 | PAD23 — Port AD bit 23 (analog/digital) |
| Pin 105 | PAD24 — Port AD bit 24 (analog/digital) |
| Pin 106 | PAD25 — Port AD bit 25 (analog/digital) |
| Pin 107 | PAD26 — Port AD bit 26 (analog/digital) |
| Pin 108 | PAD27 — Port AD bit 27 (analog/digital) |
| Pin 109 | VDDX5 — External supply voltage 5 |
| Pin 110 | VSSX5 — External ground reference 5 |
| Pin 111 | PAD28 — Port AD bit 28 (analog/digital) |
| Pin 112 | PAD29 — Port AD bit 29 (analog/digital) |
Typische Anwendungen
S912XEQ512J2MAL ist geeignet für 6 Anwendungs: Automotive Body Control Module, Instrument Cluster Driver, HVAC Control Module, Automotive Lighting Controller, Industrial CAN Node, Powertrain Sensor Interface.
Automotive Body Control Module
The S912XEQ512J2MAL is well suited for body-control modules (BCM) that aggregate door, lighting, and accessory loads. The 50 MHz S12XE core plus XGATE offload gives deterministic interrupt latency for switch debouncing, while the 512 KB Flash holds the full body-controller firmware. Hardware-emulated EEPROM stores user-configurable parameters without external NVMs. The AEC-Q100 -40 to +125 °C grade and CAN 2.0A/B interface match automotive network requirements directly.
Empfohlen
Instrument Cluster Driver
The S912XEQ512J2MAL drives mid-resolution instrument clusters by combining the 12-bit ADC for analog gauge inputs, the Enhanced Capture Timer (ECT) for speedometer pulse capture, and the SPI/SCI peripherals for cluster display driver ICs. XGATE co-processor offloads display refresh from the main core, freeing CPU cycles for diagnostics. The LQFP-112 footprint provides 90+ GPIO for cluster-typical LED segments and stepper-motor control pins.
Empfohlen
HVAC Control Module
The S912XEQ512J2MAL serves as the main controller in HVAC modules by reading cabin temperature via the 12-bit ADC, controlling blower motors through ECT/PWM outputs, and handling CAN/SCI communication with the body network. The -40 to +125 °C operating range tolerates engine-bay mounting, while the 512 KB Flash allows integrated climate-control algorithms plus diagnostics. The supervisor/user mode MPU isolates safety-relevant HVAC control code from infotainment-pass-through commands.
Empfohlen
Automotive Lighting Controller
Headlamp and tail-light modules use the S912XEQ512J2MAL to implement matrix-LED control, turn-signal sequencing, and adaptive-driving-beam logic. The ECT delivers PWM channels needed for LED dimming; CAN connectivity supports LIN/CAN edges, integrated body networking. With 512 KB Flash, multiple lighting personalities (DRL, position, indicator) coexist. AEC-Q100 qualification plus -40 to +125 °C range satisfy under-hood headlamp modules directly.
Empfohlen
Industrial CAN Node
The S912XEQ512J2MAL functions as a robust industrial CAN node for PLCs and machinery controllers, leveraging its 50 MHz core, CAN 2.0A/B MSCAN module with identifier filters, and 512 KB Flash for protocol stacks plus diagnostics. The wide 1.8 V/2.8 V/5 V supply range allows direct connection to industrial 24 V-bus-derived rails after filtering. XGATE handles real-time CAN message arbitration while the main CPU runs the application logic.
Empfohlen
Powertrain Sensor Interface
The S912XEQ512J2MAL provides sensor signal conditioning in powertrain sub-modules by reading multiple analog sensors via its 12-bit ADC at 3 µs conversion, generating actuator drive PWM via ECT, and reporting via CAN to the engine ECU. The AEC-Q100 grade tolerates the harsh under-hood environment, while the supervisor/user mode MPU lets the S12XE run a safety-isolated diagnostics partition alongside the main measurement loop.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S912XEQ512J2MAL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S912XEQ512J3MAL | S912XET512J2VAGR | S912XET512BMAGR | S912XEG384J2VAL | MC9S12XEQ384CAG | S9S12XF384J2MLMR |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-112 | LQFP-112 - same | LQFP-144 - larger | LQFP-144 - larger | LQFP-112 - same | LQFP-112 - same | LQFP-112 - same |
| Program Flash | 512 KB | 512 KB | 512 KB | 512 KB | 384 KB | 384 KB | 384 KB |
| Bus Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core | S12XE (with XGATE) | S12XE | S12XE | S12XE | S12XE | S12XE | S12XF |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Automotive Qualified | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Same Flash density and same package as J3 silicon revision (vs. S912XEQ512J3MAL)
- Smaller flash variant in same LQFP-112 footprint (vs. S912XEG384J2VAL)
- Original mask set baseline (vs. MC9S12XEQ384CAG)
Designhinweise
The S912XEQ512J2MAL integrates an on-chip voltage regulator that requires external bulk decoupling on VDDR, VDDX1-5, and VDDA. Per NXP S12XE design notes, place a 4.7 µF low-ESR ceramic plus a 0.1 µF decoupling capacitor within 5 mm of each VDDX/VDDR pin pair. The on-chip regulator generates 2.5 V core logic from an external 5 V or 3.3 V supply; the VREG_OUT pin still requires a 2.2 µF output capacitor for regulator stability. Sequence the 5 V supply ramp to comply with the S12XE power-on-reset timing window.
Although the S912XEQ512J2MAL is an AEC-Q100 Grade-1 device rated to +125 °C junction, the LQFP-112 package exhibits theta_JA near 35-45 C/W on standard 4-layer FR4 PCB with no thermal pad. Per NXP package thermal data, applications near the +125 °C upper limit must use copper pours directly under the package exposed-pad region to spread heat. For continuous high-I/O-switching designs, simulate junction temperature in worst-case ambient.
Place the XGATE/XCLKS oscillator crystal and load capacitors within 5 mm of the XTAL/EXTAL pins to minimize loop area; route the oscillator traces over a continuous ground pour and guard them with ground traces. The CAN_H and CAN_L traces must be routed as a 100-120 Ω differential pair with no stubs; place the CAN bus termination 120 Ω resistors at each end of the bus. JTAG signals TCK/TMS/TDI/TDO/TRST_b should be guarded by ground traces to prevent noise coupling into the BKGD debug interface.
Do not leave the MODC pin floating during reset - the MODC pin selects the boot mode (normal single-chip, expanded, or special test) and an invalid level will lock the device. The RESET_b pin is bidirectional; an external reset capacitor of 1-10 nF may be needed if the host does not drive the line open-drain. Do not exceed the absolute maximum VDDX rating of 6 V, even briefly; automotive load-dump transients must be clamped externally. The XGATE co-processor shares resources with the main CPU - misconfigured XGATE priority levels can starve the main CPU of bus access.
Compliance-Informationen
AEC-Q100 Grade-1 qualified per NXP product information. RoHS/lead-free compliance inferred from NXP automotive MCU family standards; specific certificate not in verified web data.
