S9S08SG4E2MTJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP
N.º da peça: S9S08SG4E2MTJ ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.28 | $12,80 |
| 100 | $1.12 | $112,00 |
| 500 | $0.98 | $490,00 |
| 1.000 | $0.85 | $850,00 |
S9S08SG4E2MTJ Visão geral
An 8-bit microcontroller (MCU) integrates a processor core, program memory (flash), data RAM, and peripherals such as timers, serial interfaces, and ADC onto a single chip. Within the power-management hierarchy of embedded systems, an MCU sits between simple logic ICs and 32-bit application processors, executing control loops, communication protocols, and system supervision tasks. The S08SG family is NXP's entry-level to mid-range 8-bit offering, positioned for cost-sensitive embedded control.
Key features of the S9S08SG4E2MTJ include 4KB (4K x 8) in-system-programmable flash with 256 bytes of RAM, support for up to 32 interrupt/reset sources, and the HC08 instruction set extended with the BGND background-debug instruction for non-intrusive on-chip debugging. The family is explicitly targeted at LIN slave nodes, general-market applications, and space-constrained designs where a small 20-pin footprint is essential.
Architecturally, the HCS08 central processor unit is a fully static CMOS core derived from the HC08 ISA; per manufacturer family documentation, the CPU can run at up to 40MHz in the standard temperature range, with a derated clock ceiling when ambient temperature rises above specified limits. Flash erase/program control and oscillator options are integrated on-chip, minimizing external component count and bill-of-material cost.
Typical applications include automotive LIN slave modules such as seat controllers, mirror actuators, and wiper controls; industrial controls requiring automotive-grade reliability at -40 to +125 degC; and small consumer appliance boards where 4KB of code space and 20 pins are sufficient.
A key design consideration: verify the bus-clock versus temperature derating table in the NXP datasheet - the maximum CPU frequency drops when the junction temperature exceeds the standard range, which affects timing-critical code.
This page adds value beyond the manufacturer datasheet by synthesizing distributor availability data, drop-in alternative analysis within the S08 family, and practical design guidance for automotive-grade 8-bit MCU selection.
Alternativas drop-in para S9S08SG4E2MTJ — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S08SG4E2MTJ (mesmo formato e footprint) — diferindo em Operating Temperature, Core, Supply Voltage, ADC, Automotive Qualification.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S08SG4E2VTJ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08SG4E2MTJR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08SF4MTJ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08SL8F1MTJR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08SH4MFK
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.15 / unidade
Ver ficha técnica →S9S08SG4E2MTJ Classificações máximas e características elétricas
| Core | S08 (HCS08) 8-bit CPU |
| Core Clock Speed | 40 MHz |
| Flash Memory | 4 KB (4K x 8) |
| RAM | 256 B |
| Tensão de alimentação | 2.7 V to 5.5 V |
| Temperatura de operação | -40 degC to +125 degC |
| Automotive Qualification | Automotive Qualified (AEC-Q100 family grade) |
| Interrupt/Reset Sources | Up to 32 |
| Instruction Set | HC08 with added BGND instruction |
| Debug Interface | Background Debug Mode (BDM) |
| Encapsulamento | 20-TSSOP (MTJ) |
| Tipo de montagem | Surface Mount |
| Status RoHS | RoHS Compliant |
| Status do ciclo de vida | End of Life (per NXP product page) |
| Target Applications | LIN slave, general market, high-temperature, space-constrained |
Guia de Configuração de Pinos do S9S08SG4E2MTJ 20-tssop (mtj)
Configuração de pinos para S9S08SG4E2MTJ (pacote 20-tssop (mtj)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para S9S08SG4E2MTJ.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
S9S08SG4E2MTJ é adequado para 6 aplicaçãos: Automotive LIN Slave Nodes, Industrial Control Boards, High-Temperature Sensing Modules, Space-Constrained Consumer Appliance Control, DC Motor and Actuator Supervision, Battery-Backed System Supervision.
Automotive LIN Slave Nodes
The S9S08SG4E2MTJ is purpose-built by NXP for LIN slave communication in body electronics such as seat adjustment modules, mirror actuators, and wiper position sensors. Its 8-bit S08 core at up to 40MHz easily sustains LIN 2.x bit rates, while the 4KB flash holds the LIN transport layer plus the node's control logic and 256B of RAM handles message buffers. Automotive qualification across -40 to +125 degC matches the under-dash and engine-bay-adjacent environments where LIN nodes live, and the 20-TSSOP package keeps board area minimal in mechatronic housings. Designers should budget code space carefully, as 4KB fills quickly with diagnostics and NVM parameter storage.
Recomendado
Industrial Control Boards
In industrial equipment that demands automotive-grade reliability - motor-start interlocks, sensor hubs, and small PLC front ends - the S9S08SG4E2MTJ offers a -40 to +125 degC qualified envelope rarely found at 8-bit price points. The 2.7V to 5.5V supply range accepts 3.3V or 5V logic rails directly, and the up-to-32 interrupt/reset sources support multi-input fault handling. The HC08 instruction set with the BGND debug instruction enables non-intrusive background debugging through a low-cost BDM pod, reducing development time. Because flash-based reprogramming is in-circuit, field firmware updates over an existing serial link are practical without socketed parts.
Recomendado
High-Temperature Sensing Modules
NXP explicitly targets the S08SG family at high-temperature applications, and the S9S08SG4E2MTJ's 125 degC rating (with family grades extending to 150 degC ambient) suits thermocouple-front-end boards, pump controllers, and oven or HVAC sensor modules. Designers must consult the CPU-frequency derating table: the 40MHz ceiling applies in the standard range, with a lower clock allowed above defined temperature thresholds, so timing budgets should be set at the derated frequency. The 20-TSSOP package's compact thermal mass eases hot-spot avoidance, and 4KB flash is adequate for calibration tables plus a simple PID or threshold-alarm algorithm executed by the S08 core.
Recomendado
Space-Constrained Consumer Appliance Control
For appliance control boards - fan speed regulators, lid-lock logic, indicator sequencing - the S9S08SG4E2MTJ combines a 20-pin TSSOP footprint with on-chip flash, oscillator options, and debug circuitry, cutting external component count. The HC08 heritage instruction set is well supported by mature development toolchains, and 4KB of flash is sufficient for state-machine control plus simple UART diagnostics. The 2.7V to 5.5V range allows direct operation from a 5V appliance supply or 3.3V logic domain. Automotive qualification provides a free reliability margin in consumer products exposed to heat near motors and heating elements, and RoHS compliance simplifies regulatory paperwork.
Recomendado
DC Motor and Actuator Supervision
Small actuator modules - throttle flaps, HVAC dampers, seat motors - need a supervisory MCU that watches position feedback, current, and stall conditions while driving a driver stage. The S9S08SG4E2MTJ's 40MHz S08 core provides fast loop response, and its interrupt architecture (up to 32 sources) handles edge-counting from Hall or optical sensors. Automotive qualification keeps the device valid in vehicle-mounted actuators exposed to -40 to +125 degC. The BGND background-debug instruction lets engineers instrument control loops non-intrusively during tuning. Note that 4KB flash limits the scope for adaptive or self-learning algorithms; keep them in calibration tables instead.
Recomendado
Battery-Backed System Supervision
Battery packs, UPS units, and backup-power controllers need a low-pin-count MCU that supervises voltage thresholds, drives alarms, and logs events. The S9S08SG4E2MTJ operates from a 2.7V to 5.5V rail, tolerating battery sag without brownout trips across most of the discharge curve, and its flash-based parameter storage retains configuration without external EEPROM in simple designs. The 20-TSSOP package fits single-side layouts on small supervisor boards. Because the part is EOL, long-lifetime battery products should design in the pin-compatible S9S08SG4E2VTJ/MTJR variants or hold last-time-buy stock, since NXP's discontinuance PCN will eventually end production shipments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S08SG4E2MTJ — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S08SG4E2VTJ | S9S08SG4E2MTJR | MC9S08SF4MTJ | S9S08SL8F1MTJR |
|---|---|---|---|---|---|
| Package | 20-TSSOP | 20-TSSOP - same footprint | 20-TSSOP - same footprint | 20-TSSOP - same footprint | 20-TSSOP - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit | S08 8-bit |
| Flash Memory | 4 KB | 4 KB | 4 KB | 4 KB | 8 KB |
Principais diferenciais
- Automotive qualification at 8-bit price point (vs MC9S08SF4MTJ)
- Same-die pin-compatible upgrade path with more memory (vs S9S08SL8F1MTJR)
- Trade-off: family with 4KB flash ceiling (vs S9S08SL8F1MTJR)
Notas de projeto
The NXP product page lists S9S08SG4E2MTJ as End of Life with a discontinuance PCN. Before committing this part to any new design, check the NXP PCN for the last-order date and design in the pin-compatible S9S08SG4E2VTJ or S9S08SG4E2MTJR instead. For existing designs, calculate total lifetime consumption and place a last-time-buy with sufficient yield margin (typically 5-10% above BOM need) before authorized stock depletes.
The device runs from a 2.7V to 5.5V single supply. In 12V automotive systems it must sit behind a pre-regulator or clamp; verify the regulator's output stays within 5.5V during load-dump transients. Decouple VDD with a 0.1uF ceramic capacitor placed within 5mm of the pin, plus bulk capacitance at the board level per NXP S08 hardware design guidance. Confirm flash programming voltage margins hold at the low end of the supply range across the full -40 to +125 degC temperature span.
The S08SG family supports up to 40MHz CPU operation, but the datasheet derates the maximum CPU frequency at elevated temperatures - the digchip summary notes 36MHz operation for temperatures above the standard range on related grades. Read the frequency-versus-temperature table in the NXP datasheet and set your timing budget at the derated figure, especially for LIN timing loops and software delay routines calibrated at room temperature, which will run proportionally slower at the reduced clock setting.
The 20-TSSOP (MTJ) package has 0.5mm pitch leads - use a standard TSSOP-20 land pattern and keep the BDM (background debug) 6-pin header routed to a board edge for factory programming. Reserve a series resistor on any pin shared between debug and application functions. Place crystal/oscillator components (if an external clock source is used) close to the device with guard ground traces to preserve clock stability in electrically noisy automotive environments.
Informações de conformidade
ROHS COMPLIANT per digchip datasheet summary; Automotive Qualified per Mouser listing. REACH, lead-free, halogen-free and conflict-minerals status should be confirmed via the Environmental Quality section of the NXP product page.
