S9S12GN48F0CLH - 16-bit S12 MCU, 48KB Flash, 25MHz, 64-LQFP | NXP
N.º da peça: S9S12GN48F0CLH ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $5.92 | $59,20 |
| 100 | $5.1 | $510,00 |
| 500 | $4.42 | $2.210,00 |
| 1.000 | $3.97 | $3.970,00 |
S9S12GN48F0CLH Visão geral
An MCU (microcontroller) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and a set of on-chip peripherals such as timers, ADC, communication interfaces, and GPIO. Within the broader semiconductor hierarchy, MCUs sit under embedded processors, alongside DSPs and microprocessors. The S12G family is built on the HCS12 CISC core architecture, balancing code density with deterministic interrupt behavior favored in automotive body and chassis control.
Key features of the S9S12GN48F0CLH include 48KB on-chip Flash for program storage, a 25MHz bus-compatible CPU, integrated peripherals supporting CAN and LIN/SAE J2602 communication, low-power run/wait/stop modes, and an on-chip voltage regulator allowing 5V or 3.3V single-supply operation. The 64-LQFP (10x10mm) footprint offers a balance between board density and ease of hand-rework during prototyping.
Architecture-wise, the device uses a 16-bit CISC instruction set with enhanced addressing modes and supports up to 64KB linear address space with banked memory expansion. The integrated CAN module (msCAN) and LIN-compatible SCI/SAE J2602 interface enable networked body-electronics applications without an external transceiver MCU.
Typical applications include automotive body controllers, HVAC control modules, seat and mirror modules, generic CAN/LIN nodes, sensor interface modules, and low-end industrial control boards. The wide operating temperature range and automotive-grade qualification also support rugged non-automotive environments.
When designing with this part, ensure that the S12G clock-and-reset circuitry is initialized per the S12G family reference manual. BDM (background debug mode) pin handling is critical for in-circuit programming and should be reserved on the PCB even if unused during production.
This page synthesizes distributor pricing, drop-in alternatives from the same S12G family, and practical design notes that go beyond the manufacturer reference manual to help engineers select and qualify the part faster.
Alternativas drop-in para S9S12GN48F0CLH — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S12GN48F0CLH (mesmo formato e footprint) — diferindo em Mounting Type, Core, Operating Temperature, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S9S12GN48F1CLC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12GN48CLH
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S12GN48F0MLC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
S9S12GN48F0VLC
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC9S12GC128CPBER
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.95 / unidade
Ver ficha técnica →S9S12G96F0MLH
✅ Drop-In✓ Em estoque
$7.95 / unidade
Ver ficha técnica →S9S12GN48F0CLH Classificações máximas e características elétricas
| Core | HCS12 (CISC, 16-bit) |
| Family | S12G |
| Program Memory | 48 KB Flash |
| CPU Clock | 25 MHz |
| Operating Voltage | 3.3 V / 5 V |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Contagem de pinos | 64 |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | CAN (msCAN), LIN/SAE J2602 (SCI) |
| Temperatura de operação | -40C to +85C |
| Qualification | Automotive Qualified |
| On-chip Voltage Regulator | Yes (5V to 3.3V core) |
| Debug Interface | BDM (Background Debug Mode) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do S9S12GN48F0CLH 64-lqfp (10x10 mm)
Configuração de pinos para S9S12GN48F0CLH (pacote 64-lqfp (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para S9S12GN48F0CLH.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
S9S12GN48F0CLH é adequado para 6 aplicaçãos: Automotive Body Control Module, HVAC Control Module, Seat and Mirror Control Module, Generic LIN/SAE J2602 Sensor Node, Industrial CAN-Based Control Board, Low-Cost CAN Gateway / Bridge Node.
Automotive Body Control Module
The S9S12GN48F0CLH's automotive qualification, integrated msCAN, and LIN/SAE J2602 SCI interface make it well-suited to body control modules that orchestrate lighting, door locks, and accessory relays. Its 25MHz HCS12 core delivers deterministic interrupt response needed when dozens of switch inputs must be debounced and forwarded on the CAN bus within bounded latencies. With 48KB Flash, the device accommodates typical BCM firmware plus CAN/LIN stack and diagnostic services (UDS) without external memory. The 64-LQFP (10x10mm) footprint and -40C to +85C rating also suit under-dash mounting where thermal headroom is constrained. Compared with a generic Cortex-M0 BCM MCU, the S9S12GN48F0CLH offers a more mature toolchain and proven long-term automotive supply.
Recomendado
HVAC Control Module
The S9S12GN48F0CLH is well matched to HVAC control modules where the MCU drives stepper motors, reads temperature sensors, and interfaces with the vehicle CAN/LIN network. Its 16-bit HCS12 CISC architecture is well suited to bit-banged protocol handling and PWM generation for blower and blend-door control. The 48KB Flash capacity holds HVAC application code plus calibration tables for different vehicle platforms, while the on-chip 5V-to-3.3V regulator simplifies power tree design in a 12V automotive battery environment. The -40C to +85C operating range supports under-dash thermal conditions encountered during cold-start and high-ambient operation. Integration of msCAN and LIN eliminates the need for an external communication coprocessor.
Recomendado
Seat and Mirror Control Module
The S9S12GN48F0CLH suits seat and mirror control modules that need multiple PWM channels, position-feedback ADC inputs, and CAN/LIN connectivity for body-network integration. The 25MHz HCS12 core can service multiple LIN nodes and switch inputs concurrently while maintaining deterministic response times for motor stall detection. With 48KB Flash and automotive-grade qualification, the device handles memory-adjustment tables, end-of-line calibration, and UDS diagnostic stacks. The compact 64-LQFP (10x10mm) footprint supports the small PCB area typical of seat and mirror modules mounted inside door trims. On-chip voltage regulation simplifies the power tree where only a 12V battery feed is available.
Recomendado
Generic LIN/SAE J2602 Sensor Node
The S9S12GN48F0CLH is well matched to LIN/SAE J2602 sensor nodes such as rain-light sensors, parking-distance modules, and climate sensor clusters. The integrated SCI hardware supports the LIN 2.x/SAE J2602 protocol with low CPU overhead, leaving the 25MHz HCS12 core free to service ADC conversions for sensor front-ends. 48KB Flash is sufficient for LIN stack, signal conditioning firmware, and OEM-specific calibration. The -40C to +85C temperature window supports under-hood and behind-bumper mounting where ambient extremes are routine. Its on-chip voltage regulator and small 64-LQFP footprint minimize BOM and PCB area for cost-sensitive nodes.
Recomendado
Industrial CAN-Based Control Board
Outside automotive, the S9S12GN48F0CLH serves industrial CAN-based control boards such as PLC expansion modules, motor starters, and remote I/O nodes. The integrated msCAN module with hardware filtering offloads CAN 2.0A/B processing from the CPU, while the LIN-capable SCI supports secondary networks for sensor expansion. The -40C to +85C rating and 48KB Flash comfortably handle industrial control firmware plus protocol stacks. The 64-LQFP (10x10mm) package is compatible with hand-rework and through-hole-free assembly, simplifying field-serviceable industrial designs. Compared with newer Cortex-M0 industrial MCUs, the S9S12GN48F0CLH offers a more mature long-lifecycle supply path.
Recomendado
Low-Cost CAN Gateway / Bridge Node
The S9S12GN48F0CLH fits low-cost CAN-to-LIN or CAN-to-CAN gateway nodes that aggregate messages between body and powertrain sub-networks. Its 16-bit HCS12 core handles message translation, filtering, and routing while keeping BOM low compared with dual-core gateway solutions. 48KB Flash holds gateway routing tables and diagnostic firmware, and the integrated msCAN plus SCI interfaces can run two bus channels simultaneously with external transceivers. The 64-LQFP (10x10mm) footprint and automotive qualification also let the same firmware run in cabin and under-hood environments with appropriate conformal coating. The on-chip 5V-to-3.3V regulator simplifies 12V battery-fed gateways.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S12GN48F0CLH — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S9S12GN48F1CLC | MC9S12GN48CLH | S9S12GN48F0MLC | S9S12GN48F0VLC | MC9S12GC128CPBER | S9S12G96F0MLH |
|---|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) | HCS12 (16-bit, 25 MHz) |
| Flash | 48 KB | 48 KB | 48 KB | 48 KB | 48 KB | 128 KB | 96 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C |
| Automotive Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN (msCAN) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| LIN/SCI (SAE J2602) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- F0 silicon mask with mature automotive supply (vs S9S12GN48F1CLC)
- Automotive-qualified with msCAN + LIN on-chip (vs MC9S12GC128CPBER)
- Drop-in scalability to 96KB Flash without PCB change (vs S9S12G96F0MLH)
Notas de projeto
The S9S12GN48F0CLH integrates a 5V-to-3.3V voltage regulator allowing direct connection to a 12V automotive battery rail through an external pass element. Ensure the VDDR pin is decoupled with a 1uF to 4.7uF low-ESR ceramic capacitor placed within 5mm of the pin, and the VDDA pin decoupled separately for ADC reference cleanliness. Reverse-battery and load-dump protection must be implemented externally because the on-chip regulator is not rated for 42V load-dump transients.
Always bring out the BKGD (background debug) and RESET pins to a test header even on production boards - the S12G family requires BDM access for in-circuit programming and field firmware updates. The MODC pin must be tied to a defined logic level (typically GND or BDM-mode) at reset; a floating MODC pin can leave the device in an undefined debug mode. Use 100nF bypass on every VDD pin pair plus a bulk capacitor on VDDR, per the S12G reference manual.
Route the external CAN and LIN bus traces as differential pairs with 120 ohm characteristic impedance, keeping them at least 10mm away from switching power or PWM traces to minimize crosstalk into the bus. The 64-LQFP (10x10mm) package has ample ground-pour capability; stitch a continuous ground plane under the MCU and stitch vias around the perimeter for thermal dissipation. Place the crystal or resonator within 5mm of the EXTAL/XTAL pins with short, symmetric traces to minimize load-capacitance mismatch and EMI.
Informações de conformidade
Automotive qualification per NXP S12G family product page; AEC-Q100 qualified for body-electronics use cases. RoHS and REACH compliance per NXP product declaration.