SC755BPX350LE - Power Architecture RISC Microprocessor | NXP | 360MHz
N.º da peça: SC755BPX350LE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $100.04 | $100,04 |
| 10 | $90.39 | $903,90 |
| 100 | $82.16 | $8.216,00 |
| 500 | $73.45 | $36.725,00 |
| 1.000 | $65.85 | $65.850,00 |
SC755BPX350LE Visão geral
What is a RISC microprocessor? A RISC (Reduced Instruction Set Computer) microprocessor executes a small, highly-optimized set of instructions, allowing each instruction to be completed in one or a few clock cycles. Power Architecture (formerly PowerPC) is a RISC ISA family developed jointly by IBM, Motorola (now Freescale/NXP), and Apple. The MPC755 sits within the broader hierarchy: microprocessor -> CPU -> embedded processor -> RISC processor -> Power Architecture. It is widely used in networking, telecom, and aerospace applications where deterministic performance and long-term reliability are essential.
Key features include a 360 MHz core clock, integrated L1 cache, a high-bandwidth 60x/MPX bus interface, and support for both big- and little-endian operation. The device also offers a Memory Management Unit (MMU) for full virtual memory support, hardware-assisted multiprocessing (SMP) capability, and low-power modes. The BGA package provides excellent thermal and electrical performance for high-clock embedded designs.
Technically, the SC755BPX350LE implements the Power Architecture 32-bit instruction set with dedicated branch prediction logic, dual-issue superscalar execution, and separate instruction and data L1 caches. This architecture enables instruction-level parallelism while maintaining the deterministic timing needed for real-time systems. The 60x bus interface allows connection to high-speed memory and companion chipsets.
Typical applications include industrial networking routers, telecom base-station controllers, aerospace flight-control modules, military command-and-control systems, and high-end embedded computing platforms where the long life cycle of the Power Architecture ecosystem is valued.
When designing with this device, pay close attention to thermal management - BGA packages dissipate significant heat at 360 MHz, and a multi-layer PCB with thermal vias is essential. Designers should also verify companion chipset availability, as the MPC755 ecosystem is mature but increasingly constrained.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not collected in any single manufacturer datasheet.
Alternativas drop-in para SC755BPX350LE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com SC755BPX350LE (mesmo formato e footprint) — diferindo em Architecture, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC755BPX350LE
✅ Drop-In✓ Em estoque
$49.9 / unidade
Ver ficha técnica →MPC755BPX400LE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC755BPX300LE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC745BXX350LE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC750BPX350LE
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SC755BPX350LE Classificações máximas e características elétricas
| Architecture | Power Architecture (PowerPC) 32-bit RISC |
| Core Frequency | 350 MHz |
| Bus Frequency | 360 MHz |
| Instruction Set | Power Architecture 32-bit |
| Bus Interface | 60x/MPX bus |
| MMU | Yes - hardware memory management |
| Endianness | Big- and little-endian support |
| Multiprocessing | Hardware-assisted SMP support |
| Encapsulamento | BGA (high-density, surface-mount) |
| Tipo de montagem | Surface Mount |
| Process Technology | CMOS (process node not publicly disclosed) |
Guia de Configuração de Pinos do SC755BPX350LE bga (high-density, surface-mount)
Configuração de pinos para SC755BPX350LE (pacote bga (high-density, surface-mount)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para SC755BPX350LE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
SC755BPX350LE é adequado para 6 aplicaçãos: Industrial Networking Routers, Telecom Base Station Controllers, Aerospace Flight Control Modules, Military Command and Control Systems, High-End Embedded Computing Platforms, Legacy Industrial Control Systems.
Industrial Networking Routers
The SC755BPX350LE's 350 MHz Power Architecture core and 60x bus deliver the throughput required for Layer 3 routing and packet-forwarding workloads in industrial-grade routers. With hardware-assisted multiprocessing and a hardware MMU for full virtual memory, the device handles concurrent routing tables, ACL processing, and management-plane traffic without dropping frames. The BGA package's thermal characteristics suit fanless sealed enclosures used on factory floors, where the part's long life cycle reduces OEM qualification costs.
Recomendado
Telecom Base Station Controllers
Telecom base-station controllers demand deterministic real-time performance and high reliability, both of which the SC755BPX350LE delivers through the Power Architecture's predictable instruction timing. The 350 MHz core supports Layer 2 protocol termination, scheduling algorithms, and hardware-acceleration hand-off to DSP coprocessors. The MMU enables full OS support (VxWorks, Linux), while SMP capability allows controller scaling without board redesign. NRND status makes the part best suited for sustaining legacy telecom installations rather than greenfield builds.
Recomendado
Aerospace Flight Control Modules
Aerospace flight-control modules rely on the SC755BPX350LE's deterministic interrupt latency, hardware MMU, and extended-temperature BGA packaging. The 350 MHz Power Architecture core executes flight-control loops with consistent timing while the 60x/MPX bus interfaces to high-reliability memory and companion I/O controllers. The part's mature PowerPC software ecosystem (DO-178C certified VxWorks profiles) simplifies certification reuse, and its long product life cycle aligns with aerospace program durations that often exceed 15-20 years.
Recomendado
Military Command and Control Systems
Military command-and-control platforms depend on the SC755BPX350LE for hardened, deterministic processing under extended environmental conditions. The Power Architecture's proven toolchain support and the BGA package's robust thermal behavior suit ruggedized enclosures. SMP capability allows multi-CPU command-station configurations, while the MMU enables memory protection between classified and unclassified processing domains. The part's long life cycle and continued niche-distributor availability make it practical for sustainment-phase defense programs.
Recomendado
High-End Embedded Computing Platforms
High-end embedded computing platforms leverage the SC755BPX350LE for compute-intensive signal processing, image analysis, and industrial automation workloads. The 350 MHz Power Architecture core combined with the 60x bus delivers sustained throughput for real-time data acquisition. The MMU and full Power Architecture toolchain (GCC, Wind River, Green Hills) allow engineers to deploy Linux or RTOS environments quickly. NRND status is acceptable for sustaining mature platforms but new designs should evaluate active Power Architecture successors.
Recomendado
Legacy Industrial Control Systems
Legacy industrial control systems with multi-decade field deployments often specify the SC755BPX350LE for its proven reliability, deterministic timing, and ongoing niche-distributor availability. The Power Architecture core handles PID loops, motion-control algorithms, and HMI logic without RTOS overhead. The BGA package's thermal mass accommodates sealed cabinet environments, and the mature MPC755 firmware ecosystem reduces long-term maintenance risk. This application is the strongest fit for the part given its NRND status.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SC755BPX350LE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC755BPX350LE | MPC755BPX400LE | MPC755BPX300LE | MPC745BXX350LE | MPC750BPX350LE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | BGA | BGA - same | BGA - same | BGA - same | BGA - same family | BGA - same family |
| Core Frequency | 350 MHz | 350 MHz | 400 MHz | 300 MHz | 350 MHz | 350 MHz |
| Architecture | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit |
| MMU | Yes | Yes | Yes | Yes | Yes | Yes |
| SMP Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Dual-frequency core/bus architecture (vs MPC755BPX400LE)
- Mature Power Architecture ecosystem with long product life (vs MPC750BPX350LE)
- NRND status with continued niche availability (vs Active Power Architecture successors)
Notas de projeto
Estimated: At a 350 MHz core frequency with typical 2.0V core supply, the SC755BPX350LE can dissipate 4-6 W under sustained load. The BGA package's bottom-mounted thermal balls require a multi-layer PCB with a thermal via array directly beneath the die. Designers should target a junction-to-ambient thermal resistance (theta_JA) below 8 C/W by using 4+ PCB layers with continuous ground/power planes and a minimum 6x6 thermal via farm at 0.3 mm pitch.
The 60x/MPX bus operates at 360 MHz and demands controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential for clock). Trace lengths must be matched within 50 mils across the bus to preserve timing margins. Use 8+ layer stack-up with dedicated ground planes between signal layers; avoid routing 60x signals over split planes or noisy power regions.
Do not assume all MPC755 family members share an identical pinout. While the SC755BPX350LE and MPC755BPX350LE are functionally identical, other family derivatives (MPC745, MPC750) may differ in pin assignment, voltage domains, or peripheral mapping. Always cross-reference the exact device errata and BSDL files against the target PCB layout before PCB fabrication.
Place BGA decoupling capacitors on the opposite PCB side directly beneath the package's outer ball rows to minimize loop inductance. Use a mix of 0.1 uF MLCC for high-frequency decoupling and 10 uF bulk tantalum or ceramic capacitors for low-frequency transient suppression. Keep all decoupling within 5 mm of the respective power/ground balls.
Informações de conformidade
Compliance information for the SC755BPX350LE was not present in the verified web data. BGA PowerPC parts of this era were generally lead-free, but verification against the lot-specific manufacturer certificate is recommended for production.
