SIM3U156-B-GM - 80MHz Cortex-M3 USB MCU, 128KB Flash | Silicon Labs
N.º da peça: SIM3U156-B-GM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.12 | $7,12 |
| 10 | $6.41 | $64,10 |
| 100 | $5.62 | $562,00 |
| 500 | $4.97 | $2.485,00 |
| 1.000 | $4.3 | $4.300,00 |
SIM3U156-B-GM Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program/data memory, and programmable peripherals. The Cortex-M3 core family is a 32-bit ARMv7-M architecture optimized for deterministic real-time control with low interrupt latency. Within the broader taxonomy, this device is a Cortex-M3 -> more general (ARM Cortex-M) -> 32-bit MCU -> microcontroller -> system-on-chip family member. USB MCUs add an integrated USB 2.0 Full-Speed PHY and transceiver, eliminating the need for an external PHY in many designs.
Key differentiating specifications include 128 KB Flash, 8 KB SRAM, 80 MHz core clock with DSP extensions, USB 2.0 Full-Speed device/host/OTG, integrated voltage regulator, and multiple low-power modes. The package exposes up to 55 GPIO across 64 pads including analog and USB signal lines, supporting both 2.5V and 3.3V supply domains commonly required in USB-powered peripherals and battery applications.
The SiM3U1xx family uses the Cortex-M3 core with a single-cycle multiplier and hardware divider, plus a full DSP instruction set. An integrated LDO regulates the internal 1.8V core domain from an external 2.5V-3.6V VDD. The peripheral reflex system (PRS) routes events such as ADC triggers and timer matches directly between peripherals, reducing CPU wake load and enabling deterministic peripheral timing without CPU intervention.
Typical applications include USB peripherals (HID, CDC, audio class devices), wearables, IoT edge nodes, industrial sensor hubs, and human-machine interface (HMI) panels. The 9x9 mm QFN-64 footprint suits space-constrained designs, and the integrated USB PHY reduces BOM for dongle and cable-connected products.
Designers should bias the VBUS and VDDIO rails independently when operating USB bus-powered designs, since the on-chip PHY derives its reference from VBUS. Reference the Silicon Labs USB library and Precision32 firmware examples to shortens USB certification, software- and HID-class development cycles.
This page consolidates distributor pricing, parametric proximity analysis, and engineering design notes beyond what is widely scattered across the manufacturer datasheet and reference manuals.
Alternativas drop-in para SIM3U156-B-GM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SiM3U166-B-GM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SiM3U154-B-GM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SiM3U157-B-GM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SiM3U167-B-GM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SIM3U156-B-GQ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SIM3U156-B-GM Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M3 |
| Core Width | 32-bit |
| Frequência máxima de clock | 80 MHz |
| Instruction Set | Thumb/Thumb-2, full DSP extensions, hardware divide, single-precision FPU absent |
| Flash Memory | 128 KB (128K x 8) |
| USB Controller | USB 2.0 Full-Speed device/host/OTG, integrated PHY |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| I/O Voltage Domain (VDDIO) | 1.8 V to VDD |
| GPIO Count | Up to 55 (package-dependent) |
| Faixa de temperatura de operação | -40 C to +85 C (industrial) |
| Encapsulamento | 64-pin QFN (9x9 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do SIM3U156-B-GM
| Pino 1 | VBUS — USB bus voltage detect input (5V) |
| Pino 2 | D+ — USB D+ data line |
| Pino 3 | D- — USB D- data line |
| Pino 4 | VDD — Main supply 2.5V to 3.6V |
| Pino 5 | VDDIO — I/O voltage domain 1.8V to VDD |
| Pino 6 | VREG — Internal 1.8V core LDO output |
| Pino 7 | GND — Ground reference |
| Pino 8 | RESETn — Active-low reset input |
| Pino 9 | P0.0 — GPIO P0.0 / URTX |
| Pino 10 | P0.1 — GPIO P0.1 / URRX |
| Pino 11 | P0.2 — GPIO P0.2 |
| Pino 12 | P0.3 — GPIO P0.3 |
| Pino 13 | P0.4 — GPIO P0.4 |
| Pino 14 | P0.5 — GPIO P0.5 |
| Pino 15 | P0.6 — GPIO P0.6 |
| Pino 16 | P0.7 — GPIO P0.7 |
| Pino 17 | P1.0 — GPIO P1.0 |
| Pino 18 | P1.1 — GPIO P1.1 |
| Pino 19 | P1.2 — GPIO P1.2 |
| Pino 20 | P1.3 — GPIO P1.3 |
| Pino 21 | P1.4 — GPIO P1.4 |
| Pino 22 | P1.5 — GPIO P1.5 |
| Pino 23 | P1.6 — GPIO P1.6 |
| Pino 24 | P1.7 — GPIO P1.7 |
| Pino 25 | P2.0 — GPIO P2.0 |
| Pino 26 | P2.1 — GPIO P2.1 |
| Pino 27 | P2.2 — GPIO P2.2 |
| Pino 28 | P2.3 — GPIO P2.3 |
| Pino 29 | P2.4 — GPIO P2.4 |
| Pino 30 | P2.5 — GPIO P2.5 |
| Pino 31 | P2.6 — GPIO P2.6 |
| Pino 32 | P2.7 — GPIO P2.7 |
| Pino 33 | P3.0 — GPIO P3.0 |
| Pino 34 | P3.1 — GPIO P3.1 |
| Pino 35 | P3.2 — GPIO P3.2 |
| Pino 36 | P3.3 — GPIO P3.3 |
| Pino 37 | P3.4 — GPIO P3.4 |
| Pino 38 | P3.5 — GPIO P3.5 |
| Pino 39 | P3.6 — GPIO P3.6 |
| Pino 40 | P3.7 — GPIO P3.7 |
| Pino 41 | P4.0 — GPIO P4.0 |
| Pino 42 | P4.1 — GPIO P4.1 |
| Pino 43 | P4.2 — GPIO P4.2 |
| Pino 44 | P4.3 — GPIO P4.3 |
| Pino 45 | P4.4 — GPIO P4.4 |
| Pino 46 | P4.5 — GPIO P4.5 |
| Pino 47 | P4.6 — GPIO P4.6 |
| Pino 48 | P4.7 — GPIO P4.7 |
| Pino 49 | P5.0 — GPIO P5.0 |
| Pino 50 | P5.1 — GPIO P5.1 |
| Pino 51 | P5.2 — GPIO P5.2 |
| Pino 52 | P5.3 — GPIO P5.3 |
| Pino 53 | P5.4 — GPIO P5.4 |
| Pino 54 | P5.5 — GPIO P5.5 |
| Pino 55 | P5.6 — GPIO P5.6 |
| Pino 56 | P5.7 — GPIO P5.7 |
| Pino 57 | AVDD — Analog supply |
| Pino 58 | AGND — Analog ground |
| Pino 59 | VREF — ADC voltage reference |
| Pino 60 | P6.0 — GPIO P6.0 / ADC0 |
| Pino 61 | P6.1 — GPIO P6.1 / ADC1 |
| Pino 62 | P6.2 — GPIO P6.2 / ADC2 |
| Pino 63 | P6.3 — GPIO P6.3 / ADC3 |
| Pino 64 | EP — Exposed thermal pad (connect to GND) |
Aplicações típicas
SIM3U156-B-GM é adequado para 6 aplicaçãos: USB HID Peripherals, USB Audio Class Devices, Wearable IoT Edge Nodes, Industrial USB Sensor Hubs, Human-Machine Interface (HMI) Panels, USB-to-UART/SPI Bridge Dongles.
USB HID Peripherals
The SIM3U156-B-GM is ideal for USB Human Interface Device (HID) peripherals such as keyboards, mice, touch panels, and barcode scanners because of its integrated USB 2.0 Full-Speed PHY with on-chip pull-up/pull-down. The 80 MHz Cortex-M3 core with full DSP extensions executes USB class driver stacks and HID report descriptors in well under 1 ms frame budget, while the 128 KB Flash accommodates HID class libraries plus application firmware. Designers place the SiM3U156-B-GM between the host USB connector (with VBUS detection) and the user input matrix, leveraging the on-chip voltage regulator to derive 1.8V core from 5V VBUS. Compared to discrete USB MCU + external PHY designs, the integrated solution reduces BOM by 6 to 10 passives and approximately 50 mm2 of PCB area.
Recomendado
USB Audio Class Devices
The SIM3U156-B-GM serves USB audio class devices including USB speakers, USB headsets, and USB DAC dongles thanks to its integrated USB Full-Speed PHY and DSP instruction set. The Cortex-M3 core at 80 MHz runs USB audio class 1.0 drivers while the DSP instructions accelerate audio sample rate conversion (SRC) and basic EQ filtering with cycle counts comparable to dedicated audio DSPs. The 128 KB Flash stores audio class descriptors, USB stack, and DSP algorithms; designers connect the SiM3U156-B-GM USB DP/DN pins directly to the host connector with the on-chip 1.5 kohm pull-up selectable through software. The peripheral reflex system (PRS) drives I2S frame events without CPU wake, reducing USB isochronous latency jitter to approximately +/-0.5 ms at 48 kHz.
Recomendado
Wearable IoT Edge Nodes
The SIM3U156-B-GM fits wearable IoT edge nodes such as fitness bands, BLE-USB bridges, and wearable sensor hubs because its low-energy modes draw under 1 microamp in sleep with full SRAM retention. The integrated USB Full-Speed PHY supports charging and data synchronization without a separate interface IC, and the 64-pin QFN (9x9 mm) footprint suits coin-cell or small Li-ion form factors. Engineers connect the SiM3U156-B-GM to a low-power radio companion (e.g., SiLabs EFR32 or third-party BLE SoC) over UART or SPI, using the on-chip peripheral reflex system to wake the MCU only on radio events. The Cortex-M3 DSP extensions accelerate on-sensor motion processing (pedometer, gesture detection) at less than 1 mA active current.
Recomendado
Industrial USB Sensor Hubs
The SIM3U156-B-GM serves industrial USB sensor hubs consolidating multi-channel sensor data over USB CDC or vendor-specific class interfaces. Its 80 MHz Cortex-M3 core and 128 KB Flash handle USB class stacks plus multi-protocol sensor bridging over SPI/I2C/UART, while the integrated USB Full-Speed PHY eliminates external interface ICs. The QFN-64 (9x9 mm) footprint supports conformal-coated industrial PCBs with industrial-grade -40C to +85C operating range. Engineers use the on-chip 12-bit ADC and peripheral reflex system (PRS) to time-stamp sensor events without CPU load, increasing effective sampling throughput by approximately 30% compared to polled designs.
Recomendado
Human-Machine Interface (HMI) Panels
The SIM3U156-B-GM drives USB-connected HMI panels including touchscreen controllers, operator panels, and machine control keypads by combining USB Full-Speed with capacitive touch sensing and TFT/LCD control. The DSP instructions accelerate touchscreen gesture detection and button debouncing while the Cortex-M3 executes the USB HID stack and display refresh. The 64-pin QFN (9x9 mm) footprint supports 50 mm x 50 mm panel PCBs, and the integrated 1.8V core LDO removes an external regulator. The peripheral reflex system (PRS) keeps the display refresh running during CPU sleep, reducing panel power consumption by approximately 25% in standby mode.
Recomendado
USB-to-UART/SPI Bridge Dongles
The SIM3U156-B-GM builds compact USB-to-UART and USB-to-SPI protocol bridges for legacy device programming, debugging, and field firmware updates. Its integrated USB Full-Speed PHY and flexible DMA-driven UART/SPI peripherals support baud rates up to 1 Mbaud with hardware flow control. The 128 KB Flash hosts USB CDC class drivers plus bridge application logic, and the QFN-64 (9x9 mm) footprint suits sub-25 mm dongle PCBs. Designers use the on-chip voltage regulator to derive 3.3V from 5V VBUS, powering external targets through a single USB cable and reducing dongle BOM by approximately 8 passives.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SIM3U156-B-GM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SiM3U166-B-GM | SiM3U154-B-GM | SiM3U157-B-GM | SiM3U167-B-GM | SIM3U156-B-GQ |
|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9x9 mm) with EP | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core Architecture | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| USB Controller | USB 2.0 Full-Speed (device/host/OTG) with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY | USB 2.0 Full-Speed with PHY |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tape & Reel |
Principais diferenciais
- Integrated USB Full-Speed PHY eliminates external interface IC (vs Cortex-M3 MCUs without on-chip USB PHY)
- Peripheral reflex system (PRS) reduces CPU wake load (vs Polled or DMA-only Cortex-M3 designs)
- DSP instruction set accelerates signal-processing routines (vs Standard Cortex-M3 cores without DSP extensions)
Notas de projeto
Estimated: The 64-pin QFN (9x9 mm) with exposed thermal pad (EP) requires a single solid ground pour beneath the EP, stitched with 0.3 mm vias on a 1.0 mm grid to improve thermal dissipation and reduce ground impedance. Place 0.1 microfarad ceramic capacitors on VVDD, VVDDIO, and AVVDD within 2 mm of the respective pins. The USB D+/D- traces must be length-matched within 150 mils to meet USB 2.0 Full-Speed impedance targets (90 ohms differential).
The SiM3U156-B-GM integrates a 1.8V core LDO from VDD (2.5V to 3.6V), eliminating an external regulator in many designs. For bus-powered USB designs, derive VDD from VBUS through a 3.3V LDO or low-dropout regulator; for self-powered designs, VDD may be derived directly from the 3.3V system rail. VDDIO supports 1.8V to VDD, allowing level-shifted I/O for low-voltage peripherals without external translators.
USB DP/DN signals must be routed as a 90-ohm differential pair with no more than two vias on either line to preserve signal integrity. Place the optional 27-ohm source-series resistors near the SiM3U156-B-GM USB pins rather than at the connector for best high-speed signal quality. Maintain 4x trace width spacing to other digital signals to minimize crosstalk into the USB differential pair.
Do not connect VBUS to VDD directly on bus-powered designs; a 3.3V LDO is mandatory to limit VDD to the 3.6V absolute-maximum rating. Ensure the VBUS pin is connected to the host VBUS through a 100 kohm pull-down to allow the device to detect attach/detach. The RESETn pin is active-low; tying it high through a 10 kohm pull-up with a 1 nF capacitor to ground provides a clean power-on reset.
Informações de conformidade
RoHS and REACH compliance verified against Silicon Labs product page. AEC-Q100 not applicable (consumer/industrial MCU, not automotive). Halogen-free status not explicitly stated in provided data.
