SPC5604PEF1VLL6 - 32-bit 64MHz 512KB MCU | NXP | Automotive
N.º da peça: SPC5604PEF1VLL6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.05 | $13,05 |
| 10 | $12.4 | $124,00 |
| 100 | $11.75 | $1.175,00 |
| 500 | $11.15 | $5.575,00 |
| 1.000 | $10.5 | $10.500,00 |
SPC5604PEF1VLL6 Visão geral
A 32-bit automotive microcontroller is the central processing device of an electronic control unit (ECU): it executes control firmware, drives communication peripherals such as CAN and LIN, and manages I/O for actuators and sensors. Within the power management and body-electronics hierarchy, the SPC5604 line sits between entry-level 8/16-bit MCUs and the higher-performance MPC55xx/MPC57xx multicore parts, offering a single e200z0h Power Architecture core at 64 MHz.
Key features include the 512KB flash with EEPROM emulation support, a cross-triggering unit (CTU) that manages ADC sample timing and off-loads the CPU, and a fault collection unit (FCU) that monitors and manages fault events - both critical for functional-safety designs. Robust, high-speed communication is supported through FlexRay and CAN interfaces.
The e200z0h core implements the Power Architecture (Book E) instruction set, giving access to NXP's extensive MPC56xx software ecosystem, SPC5 Studio development environment, and mature compiler support. The PICTUS platform integrates a system-on-chip architecture with on-chip clocking, low-voltage detect, and watchdog supervision suited to automotive reliability requirements.
Typical applications include body control modules, automotive gateways, HVAC controllers, and industrial control nodes that require CAN/FlexRay connectivity with moderate compute performance. The 64 MHz core and 512KB flash comfortably host gateway routing stacks and body-function firmware.
Designers should verify the exact supply-voltage range, peripheral count, and temperature profile against the NXP MPC5604P reference manual before finalizing the design, and budget flash capacity for bootloader plus OTA-updated application images.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para SPC5604PEF1VLL6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com SPC5604PEF1VLL6 (mesmo formato e footprint) — diferindo em Series, Package, Connectivity, Core Processor, Core Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SPC5604CK0CLL6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC560B54L3C6E0X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC560P34L1CEFAR
✅ Drop-In✓ Em estoque
$3.8 / unidade
Ver ficha técnica →SPC5602BF2MLL6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.59 / unidade
Ver ficha técnica →SPC5604PEF1VLL6 Classificações máximas e características elétricas
| Core Processor | e200z0h (Power Architecture, MPC56xx Qorivva) |
| Core Size | 32-Bit Single-Core |
| Frequência máxima de clock | 64 MHz |
| Flash Memory | 512KB (512K x 8) |
| Series | MPC5604P (PICTUS 512K) |
| Connectivity | CANbus, I2C, FlexRay |
| Encapsulamento | 100-LQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Terminal Form | Gull Wing |
| Package Shape | Square |
| Operating Temperature Grade | Industrial (per distributor listing) |
| Safety Features | Cross Triggering Unit (CTU), Fault Collection Unit (FCU) |
Guia de Configuração de Pinos do SPC5604PEF1VLL6 square
Configuração de pinos para SPC5604PEF1VLL6 (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para SPC5604PEF1VLL6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
SPC5604PEF1VLL6 é adequado para 6 aplicaçãos: Automotive Body Control Module, Automotive Gateway ECU, HVAC and Climate Control, Industrial CAN Control Nodes, Seat and Door Zone Controllers, Chassis Sensor Acquisition Modules.
Automotive Body Control Module
Body control modules coordinate lighting, door locks, wipers, and window lifts across dozens of loads, requiring a MCU that combines adequate flash for legacy-heavy firmware with robust in-vehicle networking. The SPC5604PEF1VLL6 fits this role with its 64 MHz e200z0h core and 512KB flash, sized for the full BCM application stack including diagnostics and bootloaders. CAN and FlexRay interfaces allow the module to bridge low-speed body buses and high-speed chassis networks. The fault collection unit monitors and manages fault events such as stuck outputs or missing feedback, enabling graceful degradation strategies mandated by automotive OEMs. Using the 100-LQFP package keeps the two-layer ECU board compact and cost-effective for high-volume vehicle programs.
Recomendado
Automotive Gateway ECU
Gateway ECUs route messages between CAN, LIN, and FlexRay domains, so the processor must sustain worst-case bus throughput while maintaining deterministic latency. The SPC5604PEF1VLL6 provides the FlexRay and CAN peripherals the PICTUS platform is known for, and its cross-triggering unit manages ADC sample timing off the CPU, freeing the 64 MHz e200z0h core for routing and protocol translation. The 512KB flash hosts the gateway routing tables, network management stack, and OTA-updatable firmware images. NXP's SPC5 Studio toolchain supports gateway reference configurations for the MPC5604P. For gateways with heavy functional-safety requirements, the fault collection unit provides hardware-level fault monitoring that software-only watchdog schemes cannot match.
Recomendado
HVAC and Climate Control
Automotive HVAC controllers blend blower control, flap actuation, and temperature sensing under tight acoustic and comfort constraints. The SPC5604PEF1VLL6's integrated ADC, driven via the cross-triggering unit for jitter-free sample timing, reads NTC sensor networks and actuator position feedback without CPU intervention, which improves control-loop determinism. The 512KB flash accommodates control algorithms, LIN/CAN diagnostics, and calibration data sets. FlexRay connectivity supports integration into zonal climate architectures in newer vehicle platforms. The industrial temperature grade of this ordering code suits under-dash environments; verify the specific ambient profile against the MPC5604P data sheet thermal data. NXP reference designs for the SPC560P series include blower and flap motor control examples that port directly.
Recomendado
Industrial CAN Control Nodes
Factory automation nodes, pump controllers, and building-management devices benefit from automotive-grade silicon derated for industrial use: the SPC5604PEF1VLL6 brings a proven Power Architecture core, 512KB flash, and CAN connectivity into industrial control hardware. The 64 MHz single-core e200z0h delivers enough headroom for Modbus-over-CAN gateways, sequence control, and local HMI communication, while the fault collection unit supports the watchdog and fault-logging practices expected in industrial safety reviews. The 100-LQFP (14x14 mm) gull-wing package reflows on standard industrial PCB processes, and the square footprint simplifies placement on dense IO boards. Engineers migrating from MC9S12 designs gain a 32-bit migration path without abandoning the NXP tool ecosystem.
Recomendado
Seat and Door Zone Controllers
Seat modules, mirror controllers, and door-zone ECUs integrate many brushed-DC motor drives, position sensors, and Hall feedback channels under a strict cost ceiling. The SPC5604PEF1VLL6's ADC channels, scheduled through the cross-triggering unit, synchronize Hall and current sampling with PWM cycles for smooth, quiet motor commutation. Its 512KB flash stores per-variant calibration and configuration data for platform reuse across trim levels, and CAN/FlexRay links tie the zone controller into the vehicle network. The fault collection unit detects stalled motors and shorted drivers, enabling the diagnostic coverage OEMs require. The 100-LQFP footprint supports compact, single-PCB zone ECUs that mount directly inside the door or seat frame.
Recomendado
Chassis Sensor Acquisition Modules
Sensor acquisition modules for chassis functions (suspension travel, wheel-speed aggregation, pedal position) demand precise, time-correlated sampling of multiple analog channels. The SPC5604PEF1VLL6 addresses this with its cross-triggering unit, which manages ADC sample timing autonomously and off-loads the CPU - a defining feature of the MPC5604P PICTUS platform. Samples are time-stamped and fault events are captured by the fault collection unit, giving the ECU verifiable data quality for downstream chassis-control algorithms. The 64 MHz core handles filtering and protocol packaging, while CAN and FlexRay transmit the conditioned data to the domain controller. The 512KB flash retains the full signal-conditioning library and calibration tables in a single-chip solution.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SPC5604PEF1VLL6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SPC5604CK0CLL6 | SPC560B54L3C6E0X | SPC560P34L1CEFAR | SPC5602BF2MLL6 |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP | 100-LQFP | 100-LQFP | 100-LQFP |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Target Application | Automotive body/gateway (PICTUS 512K) | Automotive body | Automotive body | Automotive | Entry automotive body |
Principais diferenciais
- Integrated cross-triggering unit (CTU) for deterministic ADC scheduling (vs SPC5604CK0CLL6)
- Fault collection unit (FCU) for hardware fault monitoring (vs SPC5602BF2MLL6)
- FlexRay connectivity in a 100-LQFP footprint (vs SPC5604CK0CLL6)
Notas de projeto
Estimated: the MPC5604P platform operates from a nominal 5V automotive supply rail with an on-chip regulator stepping down to the 1.2-3.3V core domains; confirm the exact pin-level supply architecture in the NXP MPC5604P reference manual before designing the power tree. Provide bulk (47-100 uF) plus 100 nF per supply pin decoupling at the 100-LQFP, and add TVS protection on the CAN/FlexRay transceiver supply rails since this device connects to automotive harness networks. Use a dedicated local regulator with power-good supervision so the fault collection unit can capture brown-out events.
For the 14x14 mm 100-LQFP, use 0.5 mm-pitch escape routing with a solid ground plane on layer 2 to control return paths for the 64 MHz core and bus switching. Keep the crystal and PLL filter loop short and guarded by ground; route CAN and FlexRay differential pairs with controlled impedance (approximately 120 ohm for CAN, 100 ohm for FlexRay) away from the clock tree. Place 100 nF decoupling within 2 mm of each supply pin pair. Expose a thermal via array under the chip area for improved heat spreading, though dissipation is modest at this clock rate.
Do not assume pin function equivalence across SPC5604 family variants: the PEF1 (PICTUS) ordering code differs from CK0 and SPC560B parts in peripheral multiplexing even when the 100-LQFP footprint matches, so verify the pin multiplexing tables before swapping. Budget flash carefully - the PICTUS 512K naming reflects 512KB total; reserve space for the bootloader and checksums. Also confirm the temperature grade of the exact ordering code (distributor listings show industrial grade for SPC5604PEF1VLL6) against your ECU ambient requirements before using it in under-hood positions.
Informações de conformidade
Verified web data does not state RoHS/REACH/AEC-Q100 status for this ordering code. Check the Environmental Compliance section of NXP's product page (nxp.com/part/SPC5604PEF1VLL6) for certificate downloads.