TEA2376DT - Digital Interleaved PFC Controller | NXP
N.º da peça: TEA2376DT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
TEA2376DT Visão geral
A PFC controller is a power management IC that shapes the input current waveform of a switch-mode power supply so that it follows the input voltage, raising the power factor toward unity and reducing harmonic distortion. Within the power-supply control hierarchy - AC-DC converter, PFC pre-stage, PWM main converter - the PFC controller governs the boost converter front end and is essential for meeting international mains harmonics requirements in equipment above roughly 75 W.
Key features of the TEA2376DT include digital configurability that reduces external component count, two-phase interleaved operation that halves input ripple current and spreads thermal stress across two boost switches, valley switching that minimizes MOSFET turn-on losses, and phase shedding with burst mode for high efficiency at light load.
Technically, the device runs a digitally controlled regulation loop that can be tuned through configuration, supporting both discontinuous and transition conduction modes across a 25 kHz to 300 kHz switching range. NXP documents typical system power levels up to 1000 W, noting that high switching frequency and high power applications require attention to IC package thermal limits. The companion TEA2209T is used for the main converter stage in reference designs such as the 1 kW TEA2376DB1623 evaluation board.
Typical applications include TV power supplies, computing and server power supplies, and industrial AC-DC power systems where efficiency standards such as 80 PLUS class targets and low standby power drive the architecture.
When designing with the TEA2376DT, verify thermal dissipation of the SO-14 package at the target switching frequency and output power, and configure phase shedding thresholds to maximize light-load efficiency without audible noise.
This page synthesizes distributor data, the NXP datasheet, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para TEA2376DT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com TEA2376DT (mesmo formato e footprint) — diferindo em Package, Switching Frequency Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
TEA2376DT/1Y
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TEA2376T
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
TEA2376DB1623
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TEA2376DT Classificações máximas e características elétricas
| Função | Digital configurable two-phase interleaved PFC controller |
| Control Topology | Boost PFC, interleaved two-phase |
| Operating Modes | Discontinuous conduction mode (DCM) / quasi-resonant (transition) mode with valley switching |
| Switching Frequency Range | 25 kHz to 300 kHz |
| Typical Application Power | Up to 1000 W |
| Phase Management | Phase shedding and burst mode at light load |
| Configuration | Digital configurable |
| Encapsulamento | SO-14 (SOIC-14), surface mount |
| Tipo de montagem | Surface Mount |
| Categoria | PFC (Power Factor Correction) IC |
| Orderable Suffix | TEA2376DT/1Y (DigiKey listing) |
Guia de Configuração de Pinos do TEA2376DT so-14 (soic-14), surface mount
Configuração de pinos para TEA2376DT (pacote so-14 (soic-14), surface mount). Este dispositivo de potência possui terminais de gate, drain e source. Para pacotes não polarizados, consulte o datasheet do fabricante para a orientação exata do pino 1 e detalhes do footprint. Aplicações comuns incluem projeto de fontes de alimentação, acionamento de motores e comutação de cargas.
Nenhum dado detalhado de pinagem disponível para TEA2376DT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
TEA2376DT é adequado para 6 aplicaçãos: TV Power Supplies, Server and Computing Power Supplies, Industrial AC-DC Power Systems, High-Efficiency Adapter and Brick Power Supplies, 1 kW PFC Front-End Reference Designs, Power Supply Platform Reuse Across Power Levels.
TV Power Supplies
Modern flat-panel TV power supplies must meet strict mains harmonic limits while achieving high efficiency across a wide load range, from deep standby to full brightness. The TEA2376DT fits this application because its two-phase interleaved boost PFC halves input ripple current, allowing smaller EMI filters and inductors that fit the slim TV power board form factor. Its phase shedding and burst mode sustain efficiency at the very light loads typical of idle TV operation, while DCM/QR valley switching keeps MOSFET switching losses low at normal viewing loads. Placed ahead of an NXP flyback or LLC main controller such as the TEA2209T, the digitally configurable TEA2376DT lets one platform cover multiple screen sizes by configuration rather than hardware redesign.
Recomendado
Server and Computing Power Supplies
Server and desktop computing AC-DC supplies in the 500 W to 1000 W class need high power factor at the AC input and high efficiency at partial load, where servers spend most of their operating life. The TEA2376DT addresses this with two-phase interleaving that spreads thermal stress across two boost switches and inductors, easing cooling in dense 1U form factors. Its 25 kHz to 300 kHz frequency range allows inductors small enough for constrained board space, and valley switching reduces turn-on losses at high line. Phase shedding and burst mode maximize light-load efficiency for ENERGY STAR-type targets. NXP's 1 kW TEA2376DB1623 evaluation board demonstrates exactly this architecture paired with the TEA2209T main converter controller.
Recomendado
Industrial AC-DC Power Systems
Industrial power supplies for automation, drives, and instrumentation require robust PFC front ends that survive wide mains variation and deliver clean input current for EMC compliance. The TEA2376DT's digital configurability allows tuning of protection and operating thresholds in firmware-level configuration rather than by changing analog external components, simplifying platform reuse across power ratings up to the typical 1000 W level documented by NXP. Interleaved two-phase operation reduces peak current per component, improving reliability in high-ambient-temperature cabinets, while valley switching minimizes EMI at the switching node. Its DCM/transition conduction mode avoids the reverse-recovery losses of continuous conduction mode, supporting rugged, low-cost boost diode selection.
Recomendado
High-Efficiency Adapter and Brick Power Supplies
High-power adapters and open-frame brick supplies targeting efficiency-tier certifications benefit from an interleaved PFC front end when power exceeds roughly 500 W. The TEA2376DT supports these designs with a low external component count - NXP states the interleaved PFC is easy to design - which shortens development time for cost-sensitive adapter platforms. Quasi-resonant valley switching reduces switching loss at the light-to-medium loads where adapters typically operate, and burst mode holds no-load and standby input power low to meet eco-design regulations. Because both interleaved phases are managed by one digitally configurable controller, phase imbalance is corrected digitally, removing the matching burden that analog two-controller schemes impose on the magnetics design.
Recomendado
1 kW PFC Front-End Reference Designs
NXP's own TEA2376DB1623 user manual (UM11967) documents a 1 kW PFC standalone design in which the TEA2376DT in SO-14 controls the interleaved boost PFC while the TEA2209T in SO-16 manages the downstream converter. This application shows the part operating at the top of its typical power range and highlights the design consideration NXP raises: at high switching frequency combined with high power, IC package thermal limits of the SO-14 require attention, so designers should verify junction temperature with adequate PCB copper. Engineers developing new 800 W to 1000 W supplies can use this validated reference design as a starting point, reusing its configuration settings and layout to shorten time to market.
Recomendado
Power Supply Platform Reuse Across Power Levels
Because the TEA2376DT is digitally configurable, a single PCB and controller layout can be reconfigured to serve several power ratings in a product family - for example, 400 W, 650 W, and 1000 W variants of the same power supply platform. The configuration covers operating mode (DCM or quasi-resonant), frequency behavior, and phase shedding thresholds, so engineers qualify one control architecture and adjust settings per model. This reduces BOM fragmentation and inventory risk, and simplifies safety and EMC re-certification since the power stage topology stays consistent. NXP markets the TEA2376 family for TV, computing, server, and industrial supplies precisely because this configurability supports multi-platform deployment with low external component count.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para TEA2376DT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | TEA2376DT/1Y | TEA2376T | TEA2376DB1623 (board reference) |
|---|---|---|---|---|
| Package | SO-14 | SO-14 - same | SO-14 - same | SO-14 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Architecture | Two-phase interleaved PFC | Two-phase interleaved PFC | Two-phase interleaved PFC | Two-phase interleaved PFC + TEA2209T main stage |
| Operating Mode | DCM / quasi-resonant with valley switching | DCM / quasi-resonant with valley switching | DCM / quasi-resonant with valley switching | DCM / quasi-resonant (per UM11967 design) |
| Typical Power Level | Up to 1000 W | Up to 1000 W | Up to 1000 W | 1000 W (validated design) |
| Light-Load Features | Phase shedding, burst mode | Phase shedding, burst mode | Phase shedding, burst mode | Phase shedding, burst mode |
| Configuration | Digital configurable | Digital configurable | Digital configurable | Digital configurable (with TEA2209T) |
Principais diferenciais
- Digitally configurable architecture (vs Conventional analog interleaved PFC controllers)
- Two-phase interleaving with digital phase management (vs Single-phase PFC controllers such as TEA17531)
- Phase shedding and burst mode (vs TEA2376DB1623 reference design running continuously without shedding)
Notas de projeto
NXP explicitly cautions that for high switching frequency and high power applications, IC package thermal limitations of the SO-14 require attention (source: NXP TEA2376 documentation). Estimated: at 1000 W output, 90% PFC efficiency, and 230 VAC input, input current is roughly 4.8 A rms, and controller losses are small, but gate-drive power into two large boost MOSFETs at 300 kHz can push controller dissipation toward the package limit. Verify junction temperature using the SO-14 theta-JA from the datasheet with your PCB copper area, and deraise switching frequency at the top of the power range if needed.
Keep the two interleaved boost power loops (inductor - MOSFET - bulk capacitor) symmetrical and physically separated from the controller's sensing traces. Because the TEA2376DT is digitally configurable, its sense inputs carry control-loop information that is sensitive to switching noise; route current-sense and ZVS/valley-detection lines as short kelvin connections to the MOSFET sources. Follow the TEA2376DB1623 1 kW evaluation board layout (UM11967), which demonstrates a validated SO-14 placement, star grounding, and bulk capacitor placement for the interleaved phases.
Do not assume pin compatibility with other NXP PFC controllers - the TEA2376DT is a digitally configurable two-phase architecture unique to the TEA2376 family, so third-party or single-phase NXP parts cannot be dropped onto the same footprint. Also confirm the exact orderable suffix (e.g., TEA2376DT/1Y) when purchasing; NXP suffixes carry die-version and packing information. Finally, configure phase shedding thresholds during development: setting them too high can cause audible noise during burst operation at light load.
Informações de conformidade
Compliance data was not present in the verified web data retrieved 2026-09-13. Confirm RoHS/REACH status on the official NXP product page at https://www.nxp.com/part/TEA2376DT.
