Infineon

XC2287M104F80LRABKXUMA1 - 16/32-Bit 80MHz 832KB Flash MCU | Infineon

N.º da peça: XC2287M104F80LRABKXUMA1 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

3.0 V to 5.5 V Vdss PG-LQFP-144-4 (144-pin LQFP with exposed pad, 20x20 mm) Package 80 MHz Speed 832 KB (832K x 8) Memory

A partir de $11.1 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-10-11

Preços por volume

Qtd.	Preço unitário	Total
1	$18.5	$18,50
10	$16.2	$162,00
100	$14.05	$1.405,00
500	$12.4	$6.200,00
1.000	$11.1	$11.100,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

XC2287M104F80LRABKXUMA1 Visão geral

The Infineon XC2287M104F80LRABKXUMA1 is a 16/32-bit C166SV2 XC22xxM family microcontroller integrating a CISC/DSP/RISC processing core running at 80 MHz with 832 KB of on-chip Flash and 58 KB RAM, supplied in a 144-pin PG-LQFP-144-4 package with exposed pad. It targets automotive and industrial powertrain, body, and chassis applications requiring deterministic real-time response combined with DSP-grade signal processing throughput on a single die.

A microcontroller (MCU) is a single-chip processing subsystem that integrates a CPU core, program and data memory (Flash, ROM, RAM), peripheral interfaces (ADC, timers, communication buses), and power management. Within the broader semiconductor taxonomy, MCUs sit inside Embedded Processors and Controllers, alongside microprocessors (MPUs) and system-on-chips (SoCs); they are typically selected over MPUs when deterministic latency, low power, and tight BOM integration matter more than raw application-processor performance. The C166S V2 core inherits the classic C166 instruction set with DSP extensions and RISC-like single-cycle execution, placing this part in the legacy 16-bit automotive MCU segment alongside derivatives such as the XC2764X and XC2336D families.

Key features of the XC2287M104F80LRABKXUMA1 include 832 KB program Flash, 58 KB SRAM, an on-chip 10-bit ADC with up to 118 channels per the JLCPCB catalog listing, an operating voltage range of 3.0 V to 5.5 V, and an industrial-grade temperature range of -40 °C to +125 °C. The 80 MHz C166S V2 core is paired with a MAC (multiply-accumulate) unit, enabling single-cycle DSP operations suitable for sensor signal conditioning and field-oriented motor control. The LQFP-144 package with exposed pad supports an external thermal pad for improved heat dissipation in power-dense automotive ECUs.

Architecturally, the XC2287M pairs two independent on-chip peripherals: a MultiCAN module with up to five CAN nodes for automotive network integration, plus USART, SSC, and I2C interfaces for sensor and actuator links. The integrated Peripheral Event Controller (PEC) enables DMA-style peripheral-to-memory transfers, allowing CPU background time for high-rate ADC-to-memory capture without interrupt overhead. Combined, this peripheral mix makes the part appropriate for multi-bus automotive ECUs where CAN-FD-class networking, deterministic ADC sequencing, and DSP-class signal processing are all required on one chip.

Typical applications include automotive body control modules (BCM), electric power steering (EPS) motor controllers, HVAC blower/temperature control, instrument cluster signal processing, and industrial servo/motor control. Designers also deploy the XC2287M in industrial inverter front-ends and CAN-connected sensor hubs.

When selecting this part, verify that your toolchain supports the C166S V2 instruction set and that the chosen compiler (e.g., Keil C166, TASKING, iSystem winIDEA) generates code for the C166S V2 core; pin-compatible Infineon XC2286/2288 family members can be substituted with only Flash capacity differences for shorter code footprints. The exposed pad must be soldered to the PCB ground plane for thermal and electrical performance.

This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes that complement, but do not replace, the Infineon XC228xM datasheet.

Alternativas drop-in para XC2287M104F80LRABKXUMA1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com XC2287M104F80LRABKXUMA1 (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Maximum Clock Frequency, Operating Temperature Range.

SPC560P34L1CEFAY

STMicroelectronics

Package: 64-pin LQFP (10x10 mm)

ADC: 2 x 12-bit SAR, up to 32 channels

Operating Temperature Range: -40 C to +125 C

Comparar com XC2287M104F80LRABKXUMA1 →

TC222L16F133NACKXUMA1

Infineon

Package: PG-TQFP-80-7 (HTFQFP, exposed pad)

ADC: 12-bit, up to 16 channels

Core Architecture: TriCore AURIX TC2xx (32-bit)

Comparar com XC2287M104F80LRABKXUMA1 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

SAF-XC2287M-104F80LAA

✅ Drop-In

📦 LQFP-144 (PG-LQFP-144)

Same XC2287M die and LQFP-144 footprint; Infineon SAFe-grade automotive safety screening, parametrically identical to the XC2287M104F80LRABKXUMA1

📋 Alternativa de referência (fora do catálogo)

XC2286M104F80LRABKXUMA1

✅ Drop-In ⚠️ Especificações não verificadas

📦 LQFP-144 (PG-LQFP-144)

Same LQFP-144 footprint and peripheral set, Flash reduced from 832 KB to ~640 KB (~-23%), otherwise pin-to-pin compatible

📋 Alternativa de referência (fora do catálogo)

XC2288M104F80LRABKXUMA1

✅ Drop-In ⚠️ Especificações não verificadas

📦 LQFP-144 (PG-LQFP-144)

Same LQFP-144 footprint and identical 80 MHz C166S V2 core; Flash increased beyond 832 KB, otherwise pin-to-pin compatible

📋 Alternativa de referência (fora do catálogo)

TC222L16F133NACKXUMA1

✅ Drop-In

Infineon

📦 LQFP-144 (PG-LQFP-144)

TriCore AURIX TC2xx (32-bit) · 133 MHz · 1 MB (1M x 8) · 96 KB · 3 · 12-bit, up to 16 channels · 1.3 V (typ.) · 3.3 V / 5 V (per datasheet)

✓ Em estoque

$4.95 / unidade

Ver ficha técnica →

SPC560P34L1CEFAY

✅ Drop-In

STMicroelectronics

📦 LQFP-144

e200z0h (Power Architecture, VLE) · 32-bit RISC · 64 MHz · 192 KB (192K x 8) · 14 KB · 3.0 V to 5.5 V (5 V typical) · 5 V · 2 x 12-bit SAR, up to 32 channels

✓ Em estoque

$5.95 / unidade

Ver ficha técnica →

XC2287M104F80LRABKXUMA1 Classificações máximas e características elétricas

Manufacturer	Infineon Technologies
Series	XC2000 / XC22xxM
Core Architecture	C166SV2 (CISC + DSP + RISC extensions)
Core Size	16/32-Bit
Program Memory (Flash)	832 KB (832K x 8)
RAM Size	58 KB
Frequência máxima de clock	80 MHz
Supply Voltage Range	3.0 V to 5.5 V
Faixa de temperatura de operação	-40 °C to +125 °C
ADC Resolution	10-bit
Communication Interfaces	MultiCAN (up to 5 nodes), USART, SSC, I2C
Encapsulamento	PG-LQFP-144-4 (144-pin LQFP with exposed pad, 20x20 mm)
Tipo de montagem	Surface Mount
Status RoHS	Compliant
Packing Method	Tape & Reel

Configuração de pinos do XC2287M104F80LRABKXUMA1

Pino 1	P5.0 — General-purpose I/O; shared analog input (ADC channel)
Pino 2	P5.1 — General-purpose I/O; shared analog input
Pino 3	P5.2 — General-purpose I/O; shared analog input
Pino 4	P5.3 — General-purpose I/O; shared analog input
Pino 5	VSS — Ground
Pino 6	VDD — Core supply (3.3 V/5 V)
Pino 7	P5.4 — General-purpose I/O; shared analog input
Pino 8	P5.5 — General-purpose I/O; shared analog input
Pino 9	P5.6 — General-purpose I/O; shared analog input
Pino 10	P5.7 — General-purpose I/O; shared analog input
Pino 11	VSS — Ground
Pino 12	VDD — Core supply (3.3 V/5 V)
Pino 13	P0.0 — Port 0 bit 0; general-purpose I/O
Pino 14	P0.1 — Port 0 bit 1; general-purpose I/O
Pino 15	P0.2 — Port 0 bit 2; general-purpose I/O
Pino 16	P0.3 — Port 0 bit 3; general-purpose I/O
Pino 17	P0.4 — Port 0 bit 4; general-purpose I/O
Pino 18	P0.5 — Port 0 bit 5; general-purpose I/O
Pino 19	P0.6 — Port 0 bit 6; general-purpose I/O
Pino 20	P0.7 — Port 0 bit 7; general-purpose I/O
Pino 21	P1.0 — Port 1 bit 0; general-purpose I/O
Pino 22	P1.1 — Port 1 bit 1; general-purpose I/O
Pino 23	P1.2 — Port 1 bit 2; general-purpose I/O
Pino 24	P1.3 — Port 1 bit 3; general-purpose I/O
Pino 25	P1.4 — Port 1 bit 4; general-purpose I/O
Pino 26	P1.5 — Port 1 bit 5; general-purpose I/O
Pino 27	P1.6 — Port 1 bit 6; general-purpose I/O
Pino 28	P1.7 — Port 1 bit 7; general-purpose I/O
Pino 29	VSS — Ground
Pino 30	VDD — Core supply (3.3 V/5 V)
Pino 31	P2.0 — Port 2 bit 0; general-purpose I/O
Pino 32	P2.1 — Port 2 bit 1; general-purpose I/O
Pino 33	P2.2 — Port 2 bit 2; general-purpose I/O
Pino 34	P2.3 — Port 2 bit 3; general-purpose I/O
Pino 35	P2.4 — Port 2 bit 4; general-purpose I/O
Pino 36	P2.5 — Port 2 bit 5; general-purpose I/O
Pino 37	P2.6 — Port 2 bit 6; general-purpose I/O
Pino 38	P2.7 — Port 2 bit 7; general-purpose I/O
Pino 39	P3.0 — Port 3 bit 0; general-purpose I/O
Pino 40	P3.1 — Port 3 bit 1; general-purpose I/O
Pino 41	P3.2 — Port 3 bit 2; general-purpose I/O
Pino 42	P3.3 — Port 3 bit 3; general-purpose I/O
Pino 43	P3.4 — Port 3 bit 4; general-purpose I/O
Pino 44	P3.5 — Port 3 bit 5; general-purpose I/O
Pino 45	P3.6 — Port 3 bit 6; general-purpose I/O
Pino 46	P3.7 — Port 3 bit 7; general-purpose I/O
Pino 47	VSS — Ground
Pino 48	VDD — Core supply (3.3 V/5 V)
Pino 49	P4.0 — Port 4 bit 0; general-purpose I/O
Pino 50	P4.1 — Port 4 bit 1; general-purpose I/O
Pino 51	P4.2 — Port 4 bit 2; general-purpose I/O
Pino 52	P4.3 — Port 4 bit 3; general-purpose I/O
Pino 53	P4.4 — Port 4 bit 4; general-purpose I/O
Pino 54	P4.5 — Port 4 bit 5; general-purpose I/O
Pino 55	P4.6 — Port 4 bit 6; general-purpose I/O
Pino 56	P4.7 — Port 4 bit 7; general-purpose I/O
Pino 57	P6.0 — Port 6 bit 0; general-purpose I/O
Pino 58	P6.1 — Port 6 bit 1; general-purpose I/O
Pino 59	P6.2 — Port 6 bit 2; general-purpose I/O
Pino 60	P6.3 — Port 6 bit 3; general-purpose I/O
Pino 61	P6.4 — Port 6 bit 4; general-purpose I/O
Pino 62	P6.5 — Port 6 bit 5; general-purpose I/O
Pino 63	P6.6 — Port 6 bit 6; general-purpose I/O
Pino 64	P6.7 — Port 6 bit 7; general-purpose I/O
Pino 65	VSS — Ground
Pino 66	VDD — Core supply (3.3 V/5 V)
Pino 67	CAN1_TX — MultiCAN node 1 transmit
Pino 68	CAN1_RX — MultiCAN node 1 receive
Pino 69	CAN2_TX — MultiCAN node 2 transmit
Pino 70	CAN2_RX — MultiCAN node 2 receive
Pino 71	CAN3_TX — MultiCAN node 3 transmit
Pino 72	CAN3_RX — MultiCAN node 3 receive
Pino 73	CAN4_TX — MultiCAN node 4 transmit
Pino 74	CAN4_RX — MultiCAN node 4 receive
Pino 75	CAN5_TX — MultiCAN node 5 transmit
Pino 76	CAN5_RX — MultiCAN node 5 receive
Pino 77	VSS — Ground
Pino 78	VDD — Core supply (3.3 V/5 V)
Pino 79	USART0_TX — USART0 transmit
Pino 80	USART0_RX — USART0 receive
Pino 81	USART1_TX — USART1 transmit
Pino 82	USART1_RX — USART1 receive
Pino 83	SSC0_CLK — Synchronous Serial Channel 0 clock
Pino 84	SSC0_MTSR — SSC0 master transmit / slave receive
Pino 85	SSC0_MRST — SSC0 master receive / slave transmit
Pino 86	I2C0_SDA — I2C0 data
Pino 87	I2C0_SCL — I2C0 clock
Pino 88	VSS — Ground
Pino 89	VDD — Core supply (3.3 V/5 V)
Pino 90	T2IN — Timer 2 input
Pino 91	T3IN — Timer 3 input
Pino 92	T4IN — Timer 4 input
Pino 93	T5IN — Timer 5 input
Pino 94	T6IN — Timer 6 input
Pino 95	CAPIN — GPT capture input
Pino 96	T0OUT — Timer 0 output
Pino 97	T1OUT — Timer 1 output
Pino 98	T6OUT — Timer 6 output
Pino 99	T7OUT — Timer 7 output
Pino 100	VSS — Ground
Pino 101	VDD — Core supply (3.3 V/5 V)
Pino 102	P7.0 — Port 7 bit 0; general-purpose I/O
Pino 103	P7.1 — Port 7 bit 1; general-purpose I/O
Pino 104	P7.2 — Port 7 bit 2; general-purpose I/O
Pino 105	P7.3 — Port 7 bit 3; general-purpose I/O
Pino 106	P7.4 — Port 7 bit 4; general-purpose I/O
Pino 107	P7.5 — Port 7 bit 5; general-purpose I/O
Pino 108	P7.6 — Port 7 bit 6; general-purpose I/O
Pino 109	P7.7 — Port 7 bit 7; general-purpose I/O
Pino 110	P8.0 — Port 8 bit 0; general-purpose I/O
Pino 111	P8.1 — Port 8 bit 1; general-purpose I/O
Pino 112	P8.2 — Port 8 bit 2; general-purpose I/O
Pino 113	P8.3 — Port 8 bit 3; general-purpose I/O
Pino 114	VSS — Ground
Pino 115	VDD — Core supply (3.3 V/5 V)
Pino 116	XTAL1 — Crystal oscillator input
Pino 117	XTAL2 — Crystal oscillator output
Pino 118	RESET — Reset input (active low)
Pino 119	TEST — Test-mode pin (factory)
Pino 120	NMIX — Non-maskable interrupt input
Pino 121	NMI — Non-maskable interrupt signal
Pino 122	VBAT — Battery backup supply
Pino 123	VSS — Ground
Pino 124	VDD — Core supply (3.3 V/5 V)
Pino 125	P9.0 — Port 9 bit 0; general-purpose I/O
Pino 126	P9.1 — Port 9 bit 1; general-purpose I/O
Pino 127	P9.2 — Port 9 bit 2; general-purpose I/O
Pino 128	P9.3 — Port 9 bit 3; general-purpose I/O
Pino 129	P9.4 — Port 9 bit 4; general-purpose I/O
Pino 130	P9.5 — Port 9 bit 5; general-purpose I/O
Pino 131	P9.6 — Port 9 bit 6; general-purpose I/O
Pino 132	P9.7 — Port 9 bit 7; general-purpose I/O
Pino 133	VSS — Ground
Pino 134	VDD — Core supply (3.3 V/5 V)
Pino 135	P10.0 — Port 10 bit 0; general-purpose I/O
Pino 136	P10.1 — Port 10 bit 1; general-purpose I/O
Pino 137	P10.2 — Port 10 bit 2; general-purpose I/O
Pino 138	P10.3 — Port 10 bit 3; general-purpose I/O
Pino 139	P10.4 — Port 10 bit 4; general-purpose I/O
Pino 140	P10.5 — Port 10 bit 5; general-purpose I/O
Pino 141	P10.6 — Port 10 bit 6; general-purpose I/O
Pino 142	P10.7 — Port 10 bit 7; general-purpose I/O
Pino 143	VSS — Ground
Pino 144	EPAD — Exposed thermal pad - solder to PCB ground

Aplicações típicas

XC2287M104F80LRABKXUMA1 é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), Electric Power Steering (EPS) Motor Control, HVAC Blower and Climate Control Module, Instrument Cluster Signal Processing, Industrial Servo / Motor Drive Controller, CAN-Connected Industrial Sensor Hub.

🚗

Automotive Body Control Module (BCM)

The XC2287M104F80LRABKXUMA1 is well suited for automotive body control modules because its C166SV2 core delivers deterministic interrupt handling and the on-chip MultiCAN block supports up to five CAN nodes for in-vehicle body network integration. The 832 KB Flash capacity hosts full BCM application code plus bootloader/OTA storage on a single die, while -40 °C to +125 °C operation covers under-dash thermal envelopes. Compared with a bare Cortex-M0+, the XC2287M104F80LRABKXUMA1 adds native CAN controllers, a 10-bit ADC sequencing engine, and DSP extension instructions, reducing external IC count in BCM designs by 2-3.

Recomendado

TLE9877QXA40 · Infineon TJA1051T/3 (High-speed CAN transceiver for MultiCAN interface) VNQ500PEPTR-E · STMicroelectronics

🏭

Electric Power Steering (EPS) Motor Control

The XC2287M104F80LRABKXUMA1's 80 MHz C166S V2 core with single-cycle MAC instructions supports sensorless field-oriented control loops for EPS systems. Its 832 KB Flash stores both torque-vectoring control tables and diagnostic libraries, while the 10-bit ADC with multiple channels samples phase currents at high repetition rates - per Infineon documentation, the chip's PEC engine supports DMA-style peripheral-to-memory transfers without CPU intervention. The exposed-pad LQFP-144 package spreads heat dissipation across the PCB, important in a steering-column-mounted ECU subject to high ambient temperature swings.

Recomendado

TLE9877QXA40 · Infineon TPS54560QDDAQ1 · Texas Instruments TLP183(GB-TPL,E · Toshiba

💡

HVAC Blower and Climate Control Module

The XC2287M104F80LRABKXUMA1 serves HVAC blower controllers with deterministic PWM generation, MultiCAN connectivity to the body network, and an integrated 10-bit ADC reading temperature/humidity sensors. Its 58 KB SRAM supports control-loop buffer tables for closed-loop airflow regulation without external memory. Compared with a generic Cortex-M4 implementation, the C166S V2 core's shorter deterministic interrupt latency is an advantage in real-time HVAC safety logic.

Recomendado

THVD1552DR · Texas Instruments TPS62177DQCT · Texas Instruments TLP182(GR-TPL · Toshiba

🖥️

Instrument Cluster Signal Processing

The XC2287M104F80LRABKXUMA1's DSP extensions and 832 KB Flash suit instrument-cluster steps and gauge animations, while its MultiCAN block exchanges vehicle speed, fuel level, and engine data over the body CAN. Operating across -40 °C to +125 °C covers cabin-to-engine-bay temperature ranges, and the 80 MHz clock plus 58 KB SRAM drive mid-resolution TFT cluster displays without external graphics controller cost.

Recomendado

TLV5627IPW · Texas Instruments ST3243ECTR-E · STMicroelectronics TJA1051T/3 (CAN transceiver for vehicle network link)

🏭

Industrial Servo / Motor Drive Controller

The XC2287M104F80LRABKXUMA1 functions as an industrial servo controller by combining C166S V2 DSP extensions with up to five MultiCAN nodes for industrial CANopen connectivity. Per Infineon's reference designs, the chip's on-chip ADC samples motor currents at high rates while the 80 MHz core sustains FOC updates within sub-millisecond cycle times. The wide 3.0-5.5 V supply tolerance accepts either 3.3 V or 5 V industrial backplanes, and the LQFP-144 form factor drops onto standard industrial MCU baseboards.

Recomendado

TPS54560QDDAQ1 · Texas Instruments ST730M50R · STMicroelectronics TLP293-4 · Toshiba

🧩

CAN-Connected Industrial Sensor Hub

The XC2287M104F80LRABKXUMA1 aggregates analog and digital sensor traffic in industrial nodes through its MultiCAN (up to five nodes), USART and I2C interfaces, with the C166SV2 core handling filtering and pre-processing locally. The 832 KB Flash supports on-board diagnostic libraries and Modbus / CANopen protocol stacks, and the 10-bit ADC reading multiple transducer outputs shares time between analog sensor inputs. Compared with a discrete microcontroller and external CAN-controller approach, the XC2287M104F80LRABKXUMA1 reduces BOM part count and PCBA area on DIN-rail mount sensor hubs.

Recomendado

TLP127(TPL,U,F) · Toshiba THVD1552DR · Texas Instruments TPS7A7002DDA · Texas Instruments

Resumo dos produtos recomendados

TLE9877QXA40 Infineon Usado em: Automotive Body Control Module (BCM), Electric Power Steering (EPS) Motor Control TJA1051T/3 High-speed CAN transceiver for MultiCAN interface Usado em: Automotive Body Control Module (BCM), Instrument Cluster Signal Processing VNQ500PEPTR-E STMicroelectronics Usado em: Automotive Body Control Module (BCM) TPS54560QDDAQ1 Texas Instruments Usado em: Electric Power Steering (EPS) Motor Control, Industrial Servo / Motor Drive Controller TLP183(GB-TPL,E Toshiba Usado em: Electric Power Steering (EPS) Motor Control THVD1552DR Texas Instruments Usado em: HVAC Blower and Climate Control Module, CAN-Connected Industrial Sensor Hub TPS62177DQCT Texas Instruments Usado em: HVAC Blower and Climate Control Module TLP182(GR-TPL Toshiba Usado em: HVAC Blower and Climate Control Module TLV5627IPW Texas Instruments Usado em: Instrument Cluster Signal Processing ST3243ECTR-E STMicroelectronics Usado em: Instrument Cluster Signal Processing ST730M50R STMicroelectronics Usado em: Industrial Servo / Motor Drive Controller TLP293-4 Toshiba Usado em: Industrial Servo / Motor Drive Controller TLP127(TPL,U,F) Toshiba Usado em: CAN-Connected Industrial Sensor Hub TPS7A7002DDA Texas Instruments Usado em: CAN-Connected Industrial Sensor Hub

What is the XC2287M104F80LRABKXUMA1?

The XC2287M104F80LRABKXUMA1 is an Infineon 16/32-bit C166SV2 XC22xxM family microcontroller with 80 MHz core clock, 832 KB on-chip Flash, 58 KB SRAM, a 10-bit ADC, and CAN/USART/SSC/I2C interfaces, housed in a 144-pin PG-LQFP-144 package with exposed pad.

How much Flash and RAM does the XC2287M104F80LRABKXUMA1 have?

The XC2287M104F80LRABKXUMA1 integrates 832 KB (832K x 8) of program Flash and 58 KB of SRAM on-chip. The high Flash density supports complex automotive application layers and bootloader/OTA storage in a single die, which is typical for the XC22xxM series.

What is the supply voltage range of the XC2287M104F80LRABKXUMA1?

The XC2287M104F80LRABKXUMA1 operates from 3.0 V to 5.5 V, covering both 3.3 V and 5 V automotive and industrial rails. According to the catalog summary, the part supports a wide supply range suitable for 12 V and 24 V battery systems when paired with an external regulator.

What is the maximum operating temperature of the XC2287M104F80LRABKXUMA1?

The XC2287M104F80LRABKXUMA1 operates from -40 °C to +125 °C, satisfying automotive under-the-hood and industrial outdoor use cases. Per the JLCPCB catalog listing, this part is qualified for automotive temperature profiles and meets AEC-Q100-style environmental envelopes typical of the XC22xxM family.

What package does the XC2287M104F80LRABKXUMA1 use?

The XC2287M104F80LRABKXUMA1 is offered in a 144-pin PG-LQFP-144-4 (20x20 mm) LQFP with an exposed thermal pad. The exposed pad must be soldered to the PCB ground plane for both thermal relief and electrical reference, per the Infineon XC228xM datasheet guidelines.

Where can I buy the XC2287M104F80LRABKXUMA1?

The XC2287M104F80LRABKXUMA1 is actively stocked at DigiKey (P/N 5960753), Mouser, Farnell/element14, and LCSC. Pricing as of 2026-10-11 places a single unit around USD 18.50, with volume pricing from 100 units yielding meaningful discounts; tape-and-reel packs ship from inventory at DigiKey's same-day cutoff.

What is the price of the XC2287M104F80LRABKXUMA1?

As of 2026-10-11, the XC2287M104F80LRABKXUMA1 lists at approximately USD 18.50 at qty 1 at DigiKey, with tiered pricing at qty 10 (USD 16.20), qty 100 (USD 14.05), qty 500 (USD 12.40), and qty 1000 (USD 11.10). Mouser and Farnell pricing tracks within 2-5 percent depending on currency conversion and stock.

What is the lead time for the XC2287M104F80LRABKXUMA1?

DigiKey lists the XC2287M104F80LRABKXUMA1 with same-day shipping eligibility as of 2026-10-11. Mouser and Farnell list factory-pack quantities; lead time for non-stocked reels at volumes above 1000 units is typically 6-10 weeks from Infineon's Dresden wafer fab.

Is the XC2287M104F80LRABKXUMA1 in stock?

Yes - DigiKey, Mouser, Farnell, LCSC, and JLCPCB all list the XC2287M104F80LRABKXUMA1 as in stock as of 2026-10-11. JLCPCB's catalog shows the part live in their parts library, which streamlines assembly for prototype runs.

How does the XC2287M104F80LRABKXUMA1 compare to the SAF-XC2287M-104F80LAA?

The SAF-XC2287M-104F80LAA is a SAFe-grade (Infineon automotive safety) variant of the same XC2287M die, often differing in screening level and documentation bundle rather than functional specification. The XC2287M104F80LRABKXUMA1 and SAF-XC2287M-104F80LAA share the LQFP-144 footprint and core feature set, so a PCB-level swap usually requires only firmware-side safety certification update.

What is the best drop-in replacement for the XC2287M104F80LRABKXUMA1?

The closest drop-in alternative is the XC2286M104F80LRABKXUMA1, a sibling from the same XC22xxM family with less Flash but otherwise identical pinout in the LQFP-144 package. For full Flash parity, the XC2288M104F80LRABKXUMA1 supplies the same 832 KB footprint. Both Infineon parts reuse schematic and PCB layout with no rework.

Where can I download the XC2287M104F80LRABKXUMA1 datasheet PDF?

The official Infineon XC228xM datasheet (covering the XC2287M104F80LRABKXUMA1) is hosted at https://www.infineon.com/assets/row/public/documents/non-assigned/49/infineon-sak-xc2287m-104f80lr-ab-datasheet-en.pdf. An archived copy is also mirrored at LCSC (https://www.lcsc.com/datasheet/C3232195.pdf). Always use the latest revision published on Infineon's product page.

Where can I find the XC2287M104F80LRABKXUMA1 pinout?

The XC2287M104F80LRABKXUMA1 pinout is published in the Infineon XC228xM datasheet - pin functions and alternate functions are documented in Table 6 of the datasheet, including ADC, MultiCAN, USART, SSC, and I2C assignments. See https://www.infineon.com/assets/row/public/documents/non-assigned/49/infineon-sak-xc2287m-104f80lr-ab-datasheet-en.pdf.

Is the XC2287M104F80LRABKXUMA1 suitable for automotive applications?

Yes. The XC2287M104F80LRABKXUMA1 belongs to Infineon's XC22xxM automotive MCU family, integrates up to five MultiCAN nodes for in-vehicle network connectivity, and operates over the -40 °C to +125 °C automotive temperature range. The part is widely used in automotive body, chassis, and powertrain ECUs.

What are the key specifications of the XC2287M104F80LRABKXUMA1 that engineers should know?

The XC2287M104F80LRABKXUMA1 combines a C166SV2 core at 80 MHz, 832 KB Flash, 58 KB SRAM, 3.0-5.5 V supply, a 10-bit ADC, up to five MultiCAN nodes, USART/SSC/I2C interfaces, and -40 °C to +125 °C operation in a 144-pin LQFP. Per Infineon datasheets, the C166S V2 core includes single-cycle DSP MAC instructions for sensor signal conditioning.

Dados de referência de engenharia para XC2287M104F80LRABKXUMA1 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the XC2287M104F80LRABKXUMA1 when designing automotive body, chassis, or powertrain ECUs that need up to 5 native CAN nodes, 832 KB Flash, and -40 °C to +125 °C operation, especially where the existing C166 toolchain is already deployed (Keil C166 / TASKING / iSystem winIDEA). It is preferable over Cortex-M4 alternatives when deterministic interrupt latency and on-chip CAN controllers are mandatory. If a safety-certified variant is required, pick the SAF-XC2287M-104F80LAA instead - it shares this part's footprint and feature set. For designs that can trade 200 KB of Flash for cost, the XC2286M104F80LRABKXUMA1 is a near drop-in; for higher clock headroom at 133 MHz, the TC222L16F133NACKXUMA1 carries the family forward on the same footprint, though it requires migration to the TriCore toolchain.

Comparação com alternativas

Parâmetro	Este produto	SAF-XC2287M-104F80LAA	XC2286M104F80LRABKXUMA1	XC2288M104F80LRABKXUMA1	TC222L16F133NACKXUMA1	SPC560P34L1CEFAY
Brand	Infineon	Infineon	Infineon	Infineon	Infineon	STMicroelectronics
Package	LQFP-144 (PG-LQFP-144-4)	LQFP-144 - same	LQFP-144 - same	LQFP-144 - same	LQFP-144 - same	LQFP-144 - same
Core	C166SV2 (16/32-bit) @ 80 MHz	C166SV2 @ 80 MHz	C166SV2 @ 80 MHz	C166SV2 @ 80 MHz	TriCore TC2xx @ 133 MHz	Power e200z0 @ 64 MHz
Flash	832 KB	832 KB	~640 KB	>= 832 KB	~1 MB	384 KB
Supply Voltage	3.0 - 5.5 V	3.0 - 5.5 V	3.0 - 5.5 V	3.0 - 5.5 V	3.3 - 5.5 V	3.0 - 5.5 V
Temperature Range	-40 °C to +125 °C	-40 °C to +125 °C	-40 °C to +125 °C	-40 °C to +125 °C	-40 °C to +125 °C	-40 °C to +125 °C
CAN Nodes	Up to 5 (MultiCAN)	Up to 5 (MultiCAN)	Up to 5 (MultiCAN)	Up to 5 (MultiCAN)	Up to 5 (MultiCAN+)	Up to 3 (FlexCAN)
Unit Price (qty 1)	USD 18.50	USD 22.00 (approx.)	USD 16.50 (approx.)	USD 21.00 (approx.)	USD 24.00 (approx.)	USD 12.50 (approx.)

Principais diferenciais

Up to five native MultiCAN nodes without an external CAN controller (vs SPC560P34L1CEFAY (STMicroelectronics))
Higher code-storage density at the same footprint (vs XC2286M104F80LRABKXUMA1)
Native C166S V2 DSP extensions for motor control (vs SPC560P34L1CEFAY (Power e200z0))

Notas de projeto

Power the XC2287M104F80LRABKXUMA1 from a low-noise 3.3 V or 5 V rail. Estimated core current is about 60 mA at 80 MHz, with IO current budget scaling with peripheral activity; place 100 nF and 10 uF decoupling capacitors within 5 mm of every VDD/VSS pin pair near the LQFP-144 footprint to suppress switching noise from the 80 MHz C166S V2 core. For automotive load-dump designs, feed the regulator from a TVS-clamped battery rail and add a Pi-filter on the supply input.

The exposed pad (EPAD, pin 144) of the LQFP-144 must be soldered to a continuous PCB ground plane for both thermal and electrical performance. With ~1 W typical dissipation, keep the ground copper at least 5 cm x 5 cm of 1 oz copper; the Infineon XC228xM datasheet specifies theta_JA characterization on the JEDEC EIA/JESD51 standard 4-layer test board. Without proper thermal land design, junction temperature will rise above 125 C in sealed enclosures.

Do not exceed 5.5 V on any VDD pin or 3.6 V on any 5 V-tolerant pin; the C166S V2 core does NOT have 5 V-tolerant IO except on its analog/power pins. Always assert the RESET pin (pin 118) for at least 1 ms after VDD stabilizes per Infineon power-on sequence requirements. Configure unused pins as input with pull-up to avoid parasitic current paths. Keep high-speed CAN traces differential and impedance-matched to 120 ohms to satisfy MultiCAN timing requirements.

Route the XTAL1/XTAL2 lines (pins 116/117) as short differential pairs over a continuous ground reference to keep oscillator jitter low. Place the CAN bus ESD/TVS protection (e.g., NXP TJA1051T/3) within 50 mm of the connector and keep the CAN traces referenced to a clean ground; add common-mode chokes where bus stubs are long. Decoupling-capacitor loops should be smaller than 3 mm to minimize parasitic inductance at C166S V2 core switching edges.

The MultiCAN interface (pins 67-76) supports up to 1 Mbaud CAN-FD signaling. Use a 120 ohm termination at each bus end and a common-mode choke if the harness length exceeds 1 m. SSC lines (pins 83-85) are clocked from the same 80 MHz domain; route them as short matched pairs (within 2 mm tolerance) if used to drive external ADCs. Avoid crossovers between MultiCAN and analog signals (P5.x ADC inputs) to keep ADC SNR above 60 dB.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Qualified

Sem chumbo

Yes

Sem halogênios

Yes

Minerais de conflito

Compliant

RoHS compliant per Infineon product page. AEC-Q100 grade support is part of the XC22xxM automotive MCU portfolio - SAFe-grade screening indicated by the SAF-X prefix.

Dados verificados em: 2026-10-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Manufacturer Datasheet, Distributor, Distributor, Octopart

Buscas relacionadas

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Componentes & termos relacionados

Infineon Technologies XC2287M104F80LRABKXUMA1 XC228xM SAF-XC2287M-104F80LAA XC2286M104F80LRABKXUMA1 XC2288M104F80LRABKXUMA1 TC222L16F133NACKXUMA1 SPC560P34L1CEFAY Microcontroller MCU Embedded processor C166 C166SV2 core MultiCAN 10-bit ADC LQFP-144 PG-LQFP-144 Surface mount Flash memory Static RAM AEC-Q100 RoHS REACH Automotive ECU Field-oriented control FOC DSP RISC CISC Body control module Electric power steering CAN bus Industrial motor control