XC2287M104F80LRABKXUMA1 - 16/32-Bit 80MHz 832KB Flash MCU | Infineon
Référence : XC2287M104F80LRABKXUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1 405,00 |
| 500 | $12.4 | $6 200,00 |
| 1 000 | $11.1 | $11 100,00 |
XC2287M104F80LRABKXUMA1 Présentation
A microcontroller (MCU) is a single-chip processing subsystem that integrates a CPU core, program and data memory (Flash, ROM, RAM), peripheral interfaces (ADC, timers, communication buses), and power management. Within the broader semiconductor taxonomy, MCUs sit inside Embedded Processors and Controllers, alongside microprocessors (MPUs) and system-on-chips (SoCs); they are typically selected over MPUs when deterministic latency, low power, and tight BOM integration matter more than raw application-processor performance. The C166S V2 core inherits the classic C166 instruction set with DSP extensions and RISC-like single-cycle execution, placing this part in the legacy 16-bit automotive MCU segment alongside derivatives such as the XC2764X and XC2336D families.
Key features of the XC2287M104F80LRABKXUMA1 include 832 KB program Flash, 58 KB SRAM, an on-chip 10-bit ADC with up to 118 channels per the JLCPCB catalog listing, an operating voltage range of 3.0 V to 5.5 V, and an industrial-grade temperature range of -40 °C to +125 °C. The 80 MHz C166S V2 core is paired with a MAC (multiply-accumulate) unit, enabling single-cycle DSP operations suitable for sensor signal conditioning and field-oriented motor control. The LQFP-144 package with exposed pad supports an external thermal pad for improved heat dissipation in power-dense automotive ECUs.
Architecturally, the XC2287M pairs two independent on-chip peripherals: a MultiCAN module with up to five CAN nodes for automotive network integration, plus USART, SSC, and I2C interfaces for sensor and actuator links. The integrated Peripheral Event Controller (PEC) enables DMA-style peripheral-to-memory transfers, allowing CPU background time for high-rate ADC-to-memory capture without interrupt overhead. Combined, this peripheral mix makes the part appropriate for multi-bus automotive ECUs where CAN-FD-class networking, deterministic ADC sequencing, and DSP-class signal processing are all required on one chip.
Typical applications include automotive body control modules (BCM), electric power steering (EPS) motor controllers, HVAC blower/temperature control, instrument cluster signal processing, and industrial servo/motor control. Designers also deploy the XC2287M in industrial inverter front-ends and CAN-connected sensor hubs.
When selecting this part, verify that your toolchain supports the C166S V2 instruction set and that the chosen compiler (e.g., Keil C166, TASKING, iSystem winIDEA) generates code for the C166S V2 core; pin-compatible Infineon XC2286/2288 family members can be substituted with only Flash capacity differences for shorter code footprints. The exposed pad must be soldered to the PCB ground plane for thermal and electrical performance.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes that complement, but do not replace, the Infineon XC228xM datasheet.
Alternatives de remplacement direct pour XC2287M104F80LRABKXUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC2287M104F80LRABKXUMA1 (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Maximum Clock Frequency, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SAF-XC2287M-104F80LAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC2286M104F80LRABKXUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC2288M104F80LRABKXUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TC222L16F133NACKXUMA1
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →SPC560P34L1CEFAY
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →XC2287M104F80LRABKXUMA1 Valeurs maximales et caractéristiques électriques
| Manufacturer | Infineon Technologies |
| Series | XC2000 / XC22xxM |
| Core Architecture | C166SV2 (CISC + DSP + RISC extensions) |
| Core Size | 16/32-Bit |
| Program Memory (Flash) | 832 KB (832K x 8) |
| RAM Size | 58 KB |
| Fréquence d'horloge maximale | 80 MHz |
| Supply Voltage Range | 3.0 V to 5.5 V |
| Plage de température de fonctionnement | -40 °C to +125 °C |
| ADC Resolution | 10-bit |
| Communication Interfaces | MultiCAN (up to 5 nodes), USART, SSC, I2C |
| Boîtier | PG-LQFP-144-4 (144-pin LQFP with exposed pad, 20x20 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Packing Method | Tape & Reel |
Configuration des broches de XC2287M104F80LRABKXUMA1
| Broche 1 | P5.0 — General-purpose I/O; shared analog input (ADC channel) |
| Broche 2 | P5.1 — General-purpose I/O; shared analog input |
| Broche 3 | P5.2 — General-purpose I/O; shared analog input |
| Broche 4 | P5.3 — General-purpose I/O; shared analog input |
| Broche 5 | VSS — Ground |
| Broche 6 | VDD — Core supply (3.3 V/5 V) |
| Broche 7 | P5.4 — General-purpose I/O; shared analog input |
| Broche 8 | P5.5 — General-purpose I/O; shared analog input |
| Broche 9 | P5.6 — General-purpose I/O; shared analog input |
| Broche 10 | P5.7 — General-purpose I/O; shared analog input |
| Broche 11 | VSS — Ground |
| Broche 12 | VDD — Core supply (3.3 V/5 V) |
| Broche 13 | P0.0 — Port 0 bit 0; general-purpose I/O |
| Broche 14 | P0.1 — Port 0 bit 1; general-purpose I/O |
| Broche 15 | P0.2 — Port 0 bit 2; general-purpose I/O |
| Broche 16 | P0.3 — Port 0 bit 3; general-purpose I/O |
| Broche 17 | P0.4 — Port 0 bit 4; general-purpose I/O |
| Broche 18 | P0.5 — Port 0 bit 5; general-purpose I/O |
| Broche 19 | P0.6 — Port 0 bit 6; general-purpose I/O |
| Broche 20 | P0.7 — Port 0 bit 7; general-purpose I/O |
| Broche 21 | P1.0 — Port 1 bit 0; general-purpose I/O |
| Broche 22 | P1.1 — Port 1 bit 1; general-purpose I/O |
| Broche 23 | P1.2 — Port 1 bit 2; general-purpose I/O |
| Broche 24 | P1.3 — Port 1 bit 3; general-purpose I/O |
| Broche 25 | P1.4 — Port 1 bit 4; general-purpose I/O |
| Broche 26 | P1.5 — Port 1 bit 5; general-purpose I/O |
| Broche 27 | P1.6 — Port 1 bit 6; general-purpose I/O |
| Broche 28 | P1.7 — Port 1 bit 7; general-purpose I/O |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Core supply (3.3 V/5 V) |
| Broche 31 | P2.0 — Port 2 bit 0; general-purpose I/O |
| Broche 32 | P2.1 — Port 2 bit 1; general-purpose I/O |
| Broche 33 | P2.2 — Port 2 bit 2; general-purpose I/O |
| Broche 34 | P2.3 — Port 2 bit 3; general-purpose I/O |
| Broche 35 | P2.4 — Port 2 bit 4; general-purpose I/O |
| Broche 36 | P2.5 — Port 2 bit 5; general-purpose I/O |
| Broche 37 | P2.6 — Port 2 bit 6; general-purpose I/O |
| Broche 38 | P2.7 — Port 2 bit 7; general-purpose I/O |
| Broche 39 | P3.0 — Port 3 bit 0; general-purpose I/O |
| Broche 40 | P3.1 — Port 3 bit 1; general-purpose I/O |
| Broche 41 | P3.2 — Port 3 bit 2; general-purpose I/O |
| Broche 42 | P3.3 — Port 3 bit 3; general-purpose I/O |
| Broche 43 | P3.4 — Port 3 bit 4; general-purpose I/O |
| Broche 44 | P3.5 — Port 3 bit 5; general-purpose I/O |
| Broche 45 | P3.6 — Port 3 bit 6; general-purpose I/O |
| Broche 46 | P3.7 — Port 3 bit 7; general-purpose I/O |
| Broche 47 | VSS — Ground |
| Broche 48 | VDD — Core supply (3.3 V/5 V) |
| Broche 49 | P4.0 — Port 4 bit 0; general-purpose I/O |
| Broche 50 | P4.1 — Port 4 bit 1; general-purpose I/O |
| Broche 51 | P4.2 — Port 4 bit 2; general-purpose I/O |
| Broche 52 | P4.3 — Port 4 bit 3; general-purpose I/O |
| Broche 53 | P4.4 — Port 4 bit 4; general-purpose I/O |
| Broche 54 | P4.5 — Port 4 bit 5; general-purpose I/O |
| Broche 55 | P4.6 — Port 4 bit 6; general-purpose I/O |
| Broche 56 | P4.7 — Port 4 bit 7; general-purpose I/O |
| Broche 57 | P6.0 — Port 6 bit 0; general-purpose I/O |
| Broche 58 | P6.1 — Port 6 bit 1; general-purpose I/O |
| Broche 59 | P6.2 — Port 6 bit 2; general-purpose I/O |
| Broche 60 | P6.3 — Port 6 bit 3; general-purpose I/O |
| Broche 61 | P6.4 — Port 6 bit 4; general-purpose I/O |
| Broche 62 | P6.5 — Port 6 bit 5; general-purpose I/O |
| Broche 63 | P6.6 — Port 6 bit 6; general-purpose I/O |
| Broche 64 | P6.7 — Port 6 bit 7; general-purpose I/O |
| Broche 65 | VSS — Ground |
| Broche 66 | VDD — Core supply (3.3 V/5 V) |
| Broche 67 | CAN1_TX — MultiCAN node 1 transmit |
| Broche 68 | CAN1_RX — MultiCAN node 1 receive |
| Broche 69 | CAN2_TX — MultiCAN node 2 transmit |
| Broche 70 | CAN2_RX — MultiCAN node 2 receive |
| Broche 71 | CAN3_TX — MultiCAN node 3 transmit |
| Broche 72 | CAN3_RX — MultiCAN node 3 receive |
| Broche 73 | CAN4_TX — MultiCAN node 4 transmit |
| Broche 74 | CAN4_RX — MultiCAN node 4 receive |
| Broche 75 | CAN5_TX — MultiCAN node 5 transmit |
| Broche 76 | CAN5_RX — MultiCAN node 5 receive |
| Broche 77 | VSS — Ground |
| Broche 78 | VDD — Core supply (3.3 V/5 V) |
| Broche 79 | USART0_TX — USART0 transmit |
| Broche 80 | USART0_RX — USART0 receive |
| Broche 81 | USART1_TX — USART1 transmit |
| Broche 82 | USART1_RX — USART1 receive |
| Broche 83 | SSC0_CLK — Synchronous Serial Channel 0 clock |
| Broche 84 | SSC0_MTSR — SSC0 master transmit / slave receive |
| Broche 85 | SSC0_MRST — SSC0 master receive / slave transmit |
| Broche 86 | I2C0_SDA — I2C0 data |
| Broche 87 | I2C0_SCL — I2C0 clock |
| Broche 88 | VSS — Ground |
| Broche 89 | VDD — Core supply (3.3 V/5 V) |
| Broche 90 | T2IN — Timer 2 input |
| Broche 91 | T3IN — Timer 3 input |
| Broche 92 | T4IN — Timer 4 input |
| Broche 93 | T5IN — Timer 5 input |
| Broche 94 | T6IN — Timer 6 input |
| Broche 95 | CAPIN — GPT capture input |
| Broche 96 | T0OUT — Timer 0 output |
| Broche 97 | T1OUT — Timer 1 output |
| Broche 98 | T6OUT — Timer 6 output |
| Broche 99 | T7OUT — Timer 7 output |
| Broche 100 | VSS — Ground |
| Broche 101 | VDD — Core supply (3.3 V/5 V) |
| Broche 102 | P7.0 — Port 7 bit 0; general-purpose I/O |
| Broche 103 | P7.1 — Port 7 bit 1; general-purpose I/O |
| Broche 104 | P7.2 — Port 7 bit 2; general-purpose I/O |
| Broche 105 | P7.3 — Port 7 bit 3; general-purpose I/O |
| Broche 106 | P7.4 — Port 7 bit 4; general-purpose I/O |
| Broche 107 | P7.5 — Port 7 bit 5; general-purpose I/O |
| Broche 108 | P7.6 — Port 7 bit 6; general-purpose I/O |
| Broche 109 | P7.7 — Port 7 bit 7; general-purpose I/O |
| Broche 110 | P8.0 — Port 8 bit 0; general-purpose I/O |
| Broche 111 | P8.1 — Port 8 bit 1; general-purpose I/O |
| Broche 112 | P8.2 — Port 8 bit 2; general-purpose I/O |
| Broche 113 | P8.3 — Port 8 bit 3; general-purpose I/O |
| Broche 114 | VSS — Ground |
| Broche 115 | VDD — Core supply (3.3 V/5 V) |
| Broche 116 | XTAL1 — Crystal oscillator input |
| Broche 117 | XTAL2 — Crystal oscillator output |
| Broche 118 | RESET — Reset input (active low) |
| Broche 119 | TEST — Test-mode pin (factory) |
| Broche 120 | NMIX — Non-maskable interrupt input |
| Broche 121 | NMI — Non-maskable interrupt signal |
| Broche 122 | VBAT — Battery backup supply |
| Broche 123 | VSS — Ground |
| Broche 124 | VDD — Core supply (3.3 V/5 V) |
| Broche 125 | P9.0 — Port 9 bit 0; general-purpose I/O |
| Broche 126 | P9.1 — Port 9 bit 1; general-purpose I/O |
| Broche 127 | P9.2 — Port 9 bit 2; general-purpose I/O |
| Broche 128 | P9.3 — Port 9 bit 3; general-purpose I/O |
| Broche 129 | P9.4 — Port 9 bit 4; general-purpose I/O |
| Broche 130 | P9.5 — Port 9 bit 5; general-purpose I/O |
| Broche 131 | P9.6 — Port 9 bit 6; general-purpose I/O |
| Broche 132 | P9.7 — Port 9 bit 7; general-purpose I/O |
| Broche 133 | VSS — Ground |
| Broche 134 | VDD — Core supply (3.3 V/5 V) |
| Broche 135 | P10.0 — Port 10 bit 0; general-purpose I/O |
| Broche 136 | P10.1 — Port 10 bit 1; general-purpose I/O |
| Broche 137 | P10.2 — Port 10 bit 2; general-purpose I/O |
| Broche 138 | P10.3 — Port 10 bit 3; general-purpose I/O |
| Broche 139 | P10.4 — Port 10 bit 4; general-purpose I/O |
| Broche 140 | P10.5 — Port 10 bit 5; general-purpose I/O |
| Broche 141 | P10.6 — Port 10 bit 6; general-purpose I/O |
| Broche 142 | P10.7 — Port 10 bit 7; general-purpose I/O |
| Broche 143 | VSS — Ground |
| Broche 144 | EPAD — Exposed thermal pad - solder to PCB ground |
Applications typiques
XC2287M104F80LRABKXUMA1 convient pour 6 applications: Automotive Body Control Module (BCM), Electric Power Steering (EPS) Motor Control, HVAC Blower and Climate Control Module, Instrument Cluster Signal Processing, Industrial Servo / Motor Drive Controller, CAN-Connected Industrial Sensor Hub.
Automotive Body Control Module (BCM)
The XC2287M104F80LRABKXUMA1 is well suited for automotive body control modules because its C166SV2 core delivers deterministic interrupt handling and the on-chip MultiCAN block supports up to five CAN nodes for in-vehicle body network integration. The 832 KB Flash capacity hosts full BCM application code plus bootloader/OTA storage on a single die, while -40 °C to +125 °C operation covers under-dash thermal envelopes. Compared with a bare Cortex-M0+, the XC2287M104F80LRABKXUMA1 adds native CAN controllers, a 10-bit ADC sequencing engine, and DSP extension instructions, reducing external IC count in BCM designs by 2-3.
Recommandé
Electric Power Steering (EPS) Motor Control
The XC2287M104F80LRABKXUMA1's 80 MHz C166S V2 core with single-cycle MAC instructions supports sensorless field-oriented control loops for EPS systems. Its 832 KB Flash stores both torque-vectoring control tables and diagnostic libraries, while the 10-bit ADC with multiple channels samples phase currents at high repetition rates - per Infineon documentation, the chip's PEC engine supports DMA-style peripheral-to-memory transfers without CPU intervention. The exposed-pad LQFP-144 package spreads heat dissipation across the PCB, important in a steering-column-mounted ECU subject to high ambient temperature swings.
Recommandé
HVAC Blower and Climate Control Module
The XC2287M104F80LRABKXUMA1 serves HVAC blower controllers with deterministic PWM generation, MultiCAN connectivity to the body network, and an integrated 10-bit ADC reading temperature/humidity sensors. Its 58 KB SRAM supports control-loop buffer tables for closed-loop airflow regulation without external memory. Compared with a generic Cortex-M4 implementation, the C166S V2 core's shorter deterministic interrupt latency is an advantage in real-time HVAC safety logic.
Recommandé
Instrument Cluster Signal Processing
The XC2287M104F80LRABKXUMA1's DSP extensions and 832 KB Flash suit instrument-cluster steps and gauge animations, while its MultiCAN block exchanges vehicle speed, fuel level, and engine data over the body CAN. Operating across -40 °C to +125 °C covers cabin-to-engine-bay temperature ranges, and the 80 MHz clock plus 58 KB SRAM drive mid-resolution TFT cluster displays without external graphics controller cost.
Recommandé
Industrial Servo / Motor Drive Controller
The XC2287M104F80LRABKXUMA1 functions as an industrial servo controller by combining C166S V2 DSP extensions with up to five MultiCAN nodes for industrial CANopen connectivity. Per Infineon's reference designs, the chip's on-chip ADC samples motor currents at high rates while the 80 MHz core sustains FOC updates within sub-millisecond cycle times. The wide 3.0-5.5 V supply tolerance accepts either 3.3 V or 5 V industrial backplanes, and the LQFP-144 form factor drops onto standard industrial MCU baseboards.
Recommandé
CAN-Connected Industrial Sensor Hub
The XC2287M104F80LRABKXUMA1 aggregates analog and digital sensor traffic in industrial nodes through its MultiCAN (up to five nodes), USART and I2C interfaces, with the C166SV2 core handling filtering and pre-processing locally. The 832 KB Flash supports on-board diagnostic libraries and Modbus / CANopen protocol stacks, and the 10-bit ADC reading multiple transducer outputs shares time between analog sensor inputs. Compared with a discrete microcontroller and external CAN-controller approach, the XC2287M104F80LRABKXUMA1 reduces BOM part count and PCBA area on DIN-rail mount sensor hubs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC2287M104F80LRABKXUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SAF-XC2287M-104F80LAA | XC2286M104F80LRABKXUMA1 | XC2288M104F80LRABKXUMA1 | TC222L16F133NACKXUMA1 | SPC560P34L1CEFAY |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | STMicroelectronics |
| Package | LQFP-144 (PG-LQFP-144-4) | LQFP-144 - same | LQFP-144 - same | LQFP-144 - same | LQFP-144 - same | LQFP-144 - same |
| Core | C166SV2 (16/32-bit) @ 80 MHz | C166SV2 @ 80 MHz | C166SV2 @ 80 MHz | C166SV2 @ 80 MHz | TriCore TC2xx @ 133 MHz | Power e200z0 @ 64 MHz |
| Flash | 832 KB | 832 KB | ~640 KB | >= 832 KB | ~1 MB | 384 KB |
| Supply Voltage | 3.0 - 5.5 V | 3.0 - 5.5 V | 3.0 - 5.5 V | 3.0 - 5.5 V | 3.3 - 5.5 V | 3.0 - 5.5 V |
| Temperature Range | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| CAN Nodes | Up to 5 (MultiCAN) | Up to 5 (MultiCAN) | Up to 5 (MultiCAN) | Up to 5 (MultiCAN) | Up to 5 (MultiCAN+) | Up to 3 (FlexCAN) |
| Unit Price (qty 1) | USD 18.50 | USD 22.00 (approx.) | USD 16.50 (approx.) | USD 21.00 (approx.) | USD 24.00 (approx.) | USD 12.50 (approx.) |
Principaux différenciateurs
- Up to five native MultiCAN nodes without an external CAN controller (vs SPC560P34L1CEFAY (STMicroelectronics))
- Higher code-storage density at the same footprint (vs XC2286M104F80LRABKXUMA1)
- Native C166S V2 DSP extensions for motor control (vs SPC560P34L1CEFAY (Power e200z0))
Notes de conception
Power the XC2287M104F80LRABKXUMA1 from a low-noise 3.3 V or 5 V rail. Estimated core current is about 60 mA at 80 MHz, with IO current budget scaling with peripheral activity; place 100 nF and 10 uF decoupling capacitors within 5 mm of every VDD/VSS pin pair near the LQFP-144 footprint to suppress switching noise from the 80 MHz C166S V2 core. For automotive load-dump designs, feed the regulator from a TVS-clamped battery rail and add a Pi-filter on the supply input.
The exposed pad (EPAD, pin 144) of the LQFP-144 must be soldered to a continuous PCB ground plane for both thermal and electrical performance. With ~1 W typical dissipation, keep the ground copper at least 5 cm x 5 cm of 1 oz copper; the Infineon XC228xM datasheet specifies theta_JA characterization on the JEDEC EIA/JESD51 standard 4-layer test board. Without proper thermal land design, junction temperature will rise above 125 C in sealed enclosures.
Do not exceed 5.5 V on any VDD pin or 3.6 V on any 5 V-tolerant pin; the C166S V2 core does NOT have 5 V-tolerant IO except on its analog/power pins. Always assert the RESET pin (pin 118) for at least 1 ms after VDD stabilizes per Infineon power-on sequence requirements. Configure unused pins as input with pull-up to avoid parasitic current paths. Keep high-speed CAN traces differential and impedance-matched to 120 ohms to satisfy MultiCAN timing requirements.
Route the XTAL1/XTAL2 lines (pins 116/117) as short differential pairs over a continuous ground reference to keep oscillator jitter low. Place the CAN bus ESD/TVS protection (e.g., NXP TJA1051T/3) within 50 mm of the connector and keep the CAN traces referenced to a clean ground; add common-mode chokes where bus stubs are long. Decoupling-capacitor loops should be smaller than 3 mm to minimize parasitic inductance at C166S V2 core switching edges.
The MultiCAN interface (pins 67-76) supports up to 1 Mbaud CAN-FD signaling. Use a 120 ohm termination at each bus end and a common-mode choke if the harness length exceeds 1 m. SSC lines (pins 83-85) are clocked from the same 80 MHz domain; route them as short matched pairs (within 2 mm tolerance) if used to drive external ADCs. Avoid crossovers between MultiCAN and analog signals (P5.x ADC inputs) to keep ADC SNR above 60 dB.
Informations de conformité
RoHS compliant per Infineon product page. AEC-Q100 grade support is part of the XC22xxM automotive MCU portfolio - SAFe-grade screening indicated by the SAF-X prefix.