XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
N.º da peça: XC3S200-4FTG256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.8 | $228,00 |
| 100 | $20.9 | $2.090,00 |
| 500 | $18.75 | $9.375,00 |
| 1.000 | $16.4 | $16.400,00 |
XC3S200-4FTG256I Visão geral
A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates.
Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails.
Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1.
Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density.
A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design.
This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para XC3S200-4FTG256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3S200-4FTG256I (mesmo formato e footprint) — diferindo em Block RAM, Family, Logic Cells, Package, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC3S200-4FTG256C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC3S200-4FT256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC3S400-4FTG256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC3S200A-4FTG256I
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →XC3S200AN-4FTG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC3S200-4FTG256I Classificações máximas e características elétricas
| Family | Spartan-3 |
| System Gates | 200,000 |
| Logic Cells | 4,320 |
| Slices | 2,160 |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) |
| Dedicated Multipliers | 4 (18x18) |
| DCM (Digital Clock Manager) | 4 |
| Maximum User I/O | 173 |
| Core Voltage | 1.2 V |
| Speed Grade | -4 |
| Process Technology | 90 nm |
| Encapsulamento | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Temperatura de operação | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount (BGA) |
| Terminal Form | Ball |
| Peak Reflow Time | 30 s |
| Status RoHS | Compliant (G suffix = lead-free) |
Guia de Configuração de Pinos do XC3S200-4FTG256I 256-ball ftbga (ftg256), 17 x 17 mm
Configuração de pinos para XC3S200-4FTG256I (pacote 256-ball ftbga (ftg256), 17 x 17 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC3S200-4FTG256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC3S200-4FTG256I é adequado para 6 aplicaçãos: Industrial Control and Automation, Communication Protocol Bridging, Test and Measurement Instrumentation, Embedded Coprocessing / DSP Assist, Prototype and Low-Volume ASIC Emulation, Security and Surveillance Equipment.
Industrial Control and Automation
The XC3S200-4FTG256I fits industrial controllers because its industrial -40C to +100C rating and 173 user I/Os handle sensor arrays, motor-drive interfaces, and fieldbus bridging on a single programmable device. Its 2,160 slices with fast carry logic implement PWM generators, quadrature encoders, and state machines deterministically, avoiding software jitter of MCU-based designs. Placed between a 5V-tolerant I/O bank (VCCO 3.3V) and power electronics, it glues legacy parallel interfaces to modern systems. Trade-off: no hard processor core, so complex sequencing needs an external MCU or soft-core.
Recomendado
Communication Protocol Bridging
With 173 user I/Os across multiple banks and support for LVTTL, LVCMOS, SSTL, and LVDS standards, the XC3S200-4FTG256I bridges disparate interfaces such as UART, SPI, I2C, parallel buses, and simple serial links. The four Digital Clock Managers deskew and synthesize clocks needed for asynchronous domain crossing, while 216 Kbits of block RAM buffer FIFOs between protocols. Typical deployment: a 3.3V parallel legacy bus translated to a serial backhaul at moderate line rates. The -4 speed grade comfortably supports tens of MHz protocol clocks; very high line rates should move to newer families.
Recomendado
Test and Measurement Instrumentation
Bench instruments, data-acquisition cards, and fixture controllers benefit from the XC3S200-4FTG256I's deterministic timing and JTAG boundary-scan support per IEEE 1149.1. The four 18x18 hardware multipliers implement digital filtering and scaling of ADC samples without consuming fabric resources, while block RAM captures waveform segments at full fabric speed. LVDS-capable I/O banks interface directly to high-speed digitizer front ends. Design consideration: keep clock routing to DCM inputs short and use ground-referenced planes under BGA fanout to preserve signal integrity on capture channels.
Recomendado
Embedded Coprocessing / DSP Assist
The XC3S200-4FTG256I offloads multiply-intensive tasks from host processors using its four dedicated 18x18-bit multipliers, achieving single-cycle MAC operations suitable for FIR filters, correlators, and simple transform engines. The 90nm fabric sustains internal clocks into the hundreds of MHz range (up to approximately 630 MHz cell performance per published family figures), though practical system timing in a 200K-gate design typically runs far lower. With 216 Kbits of dual-port block RAM, coefficient and sample storage stays on-chip. Estimate power via the Xilinx tool since toggle-heavy DSP paths raise core current notably.
Recomendado
Prototype and Low-Volume ASIC Emulation
For prototyping custom digital logic before ASIC commitment, the XC3S200-4FTG256I provides 200,000 system gates of reprogrammable fabric on a reflow-friendly 17x17mm FTBGA footprint. Designers iterate via JTAG in minutes, and the same board serves low-volume production runs, amortizing NRE costs. Industrial temperature rating supports lab and field trials alike. Configuration flexibility (Master/Slave Serial, SelectMAP) allows remote field updates with Platform Flash PROMs. The main limitation is capacity: designs approaching full utilization of 4,320 logic cells should route to the pin-compatible XC3S400 to preserve margin.
Recomendado
Security and Surveillance Equipment
Video-over-IP encoders, access-control panels, and camera interface boards use the XC3S200-4FTG256I to implement camera timing capture, packetization, and tamper-detection logic. LVDS I/O banks accept camera sensor links, while block RAM provides line buffers; the four 18x18 multipliers support simple image preprocessing. Industrial temperature range suits outdoor enclosures where uncontrolled environments drop below 0C. Power design: 1.2V core plus per-bank VCCO from a compact DC-DC/LDO pair keeps thermal output low in sealed housings, an advantage over hotter-running larger FPGAs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3S200-4FTG256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC3S200-4FTG256C | XC3S200-4FT256I | XC3S400-4FTG256I | XC3S200A-4FTG256I |
|---|---|---|---|---|---|
| Package | 256-ball FTBGA (FTG256), 17 x 17 mm | 256-ball FTBGA (FTG256) - same | 256-ball FBGA (FT256, tin-lead) | 256-ball FTBGA (FTG256) - same | 256-ball FTBGA (FTG256) - same |
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| System Gates | 200,000 | 200,000 | 200,000 | 400,000 | 200,000 |
| Maximum User I/O | 173 | 173 | 173 | 264 | 195 |
| Block RAM | 216 Kbit | 216 Kbit | 216 Kbit | 288 Kbit | 288 Kbit |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Bitstream Compatibility | Spartan-3 fabric | Identical | Identical | Same family, recompile required | Different generation, recompile required |
Principais diferenciais
- Identical fabric with wider temperature tolerance (vs XC3S200-4FTG256C)
- Lower cost with equal footprint vs larger fabric (vs XC3S400-4FTG256I)
- No bitstream migration required vs Spartan-3A (vs XC3S200A-4FTG256I)
Notas de projeto
Supply three rails to the FTG256 device: 1.2V VCCINT for the core, 2.5V VCCAUX for auxiliary circuits, and per-bank VCCO matched to the I/O standards used (typically 3.3V/2.5V/1.8V). Estimated: core current scales with clock frequency and toggle rate; a mid-activity design at 50 MHz may draw on the order of 100-300 mA, but always run the Xilinx XPower estimator with your actual design for sizing. Decouple each rail with a bulk capacitor plus several 0.1uF ceramics placed at the BGA via fanout.
The 17x17mm FTBGA with 1.0mm ball pitch requires careful escape routing: use via-in-pad or dog-bone fanout on outer rows and route inner balls on inner layers. Define a solid ground plane directly under the die area to return high-frequency currents. Solder mask-defined pads with NSMD geometry per the Xilinx package user guide improve joint reliability. Follow the manufacturer peak-reflow profile (30 seconds maximum at peak temperature per package data) for lead-free FTG256 assembly.
Group I/O by bank so VCCO rails match standards - mixing 3.3V and 2.5V standards on one bank is impossible. For LVDS pairs, maintain 100-ohm differential impedance and length-match within a few millimeters. Connect each DCM input to a clean clock through a short route; jitter beyond DCM correction range causes lock failure at startup. Reserve JTAG access on every production board; it is the only recovery path if configuration corruption occurs in the field.
Spartan-3 bitstreams are NOT compatible with Spartan-3A/3E devices, and the XC3S200 cannot be swapped for the XC3S400 without recompiling. Do not leave configuration mode pins M0-M2 floating - tie them per the chosen scheme. Budget power-up: VCCINT must reach regulation before configuration begins, and the done pin should be observed before releasing system reset. Finally, since Spartan-3 is a mature family, second-source your configuration PROM and plan a Spartan-3A migration path.
Informações de conformidade
The G suffix in FTG256 denotes the lead-free, RoHS-compliant package version. REACH, halogen-free, and conflict-minerals status were not stated in the provided data.
