XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
MPN: XC3S200-4FTG256I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $22.8 | $228.00 |
| 100 | $20.9 | $2,090.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $16.4 | $16,400.00 |
XC3S200-4FTG256I Overview
A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates.
Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails.
Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1.
Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density.
A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design.
This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for XC3S200-4FTG256I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC3S200-4FTG256C
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XC3S200-4FT256I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XC3S400-4FTG256I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XC3S200A-4FTG256I
β Drop-Inπ Reference alternative (not in catalog)
XC3S200AN-4FTG256I
β Drop-Inπ Reference alternative (not in catalog)
XC3S200-4FTG256I Maximum Ratings & Electrical Characteristics
| Family | Spartan-3 |
| System Gates | 200,000 |
| Logic Cells | 4,320 |
| Slices | 2,160 |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) |
| Dedicated Multipliers | 4 (18x18) |
| DCM (Digital Clock Manager) | 4 |
| Maximum User I/O | 173 |
| Core Voltage | 1.2 V |
| Speed Grade | -4 |
| Process Technology | 90 nm |
| Package | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Peak Reflow Time | 30 s |
| RoHS Status | Compliant (G suffix = lead-free) |
XC3S200-4FTG256I 256-ball ftbga (ftg256), 17 x 17 mm Pin Configuration Guide
Pin configuration for XC3S200-4FTG256I (256-ball ftbga (ftg256), 17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S200-4FTG256I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S200-4FTG256I is suitable for 6 applications: Industrial Control and Automation, Communication Protocol Bridging, Test and Measurement Instrumentation, Embedded Coprocessing / DSP Assist, Prototype and Low-Volume ASIC Emulation, Security and Surveillance Equipment.
Industrial Control and Automation
The XC3S200-4FTG256I fits industrial controllers because its industrial -40C to +100C rating and 173 user I/Os handle sensor arrays, motor-drive interfaces, and fieldbus bridging on a single programmable device. Its 2,160 slices with fast carry logic implement PWM generators, quadrature encoders, and state machines deterministically, avoiding software jitter of MCU-based designs. Placed between a 5V-tolerant I/O bank (VCCO 3.3V) and power electronics, it glues legacy parallel interfaces to modern systems. Trade-off: no hard processor core, so complex sequencing needs an external MCU or soft-core.
Recommended
Communication Protocol Bridging
With 173 user I/Os across multiple banks and support for LVTTL, LVCMOS, SSTL, and LVDS standards, the XC3S200-4FTG256I bridges disparate interfaces such as UART, SPI, I2C, parallel buses, and simple serial links. The four Digital Clock Managers deskew and synthesize clocks needed for asynchronous domain crossing, while 216 Kbits of block RAM buffer FIFOs between protocols. Typical deployment: a 3.3V parallel legacy bus translated to a serial backhaul at moderate line rates. The -4 speed grade comfortably supports tens of MHz protocol clocks; very high line rates should move to newer families.
Recommended
Test and Measurement Instrumentation
Bench instruments, data-acquisition cards, and fixture controllers benefit from the XC3S200-4FTG256I's deterministic timing and JTAG boundary-scan support per IEEE 1149.1. The four 18x18 hardware multipliers implement digital filtering and scaling of ADC samples without consuming fabric resources, while block RAM captures waveform segments at full fabric speed. LVDS-capable I/O banks interface directly to high-speed digitizer front ends. Design consideration: keep clock routing to DCM inputs short and use ground-referenced planes under BGA fanout to preserve signal integrity on capture channels.
Recommended
Embedded Coprocessing / DSP Assist
The XC3S200-4FTG256I offloads multiply-intensive tasks from host processors using its four dedicated 18x18-bit multipliers, achieving single-cycle MAC operations suitable for FIR filters, correlators, and simple transform engines. The 90nm fabric sustains internal clocks into the hundreds of MHz range (up to approximately 630 MHz cell performance per published family figures), though practical system timing in a 200K-gate design typically runs far lower. With 216 Kbits of dual-port block RAM, coefficient and sample storage stays on-chip. Estimate power via the Xilinx tool since toggle-heavy DSP paths raise core current notably.
Recommended
Prototype and Low-Volume ASIC Emulation
For prototyping custom digital logic before ASIC commitment, the XC3S200-4FTG256I provides 200,000 system gates of reprogrammable fabric on a reflow-friendly 17x17mm FTBGA footprint. Designers iterate via JTAG in minutes, and the same board serves low-volume production runs, amortizing NRE costs. Industrial temperature rating supports lab and field trials alike. Configuration flexibility (Master/Slave Serial, SelectMAP) allows remote field updates with Platform Flash PROMs. The main limitation is capacity: designs approaching full utilization of 4,320 logic cells should route to the pin-compatible XC3S400 to preserve margin.
Recommended
Security and Surveillance Equipment
Video-over-IP encoders, access-control panels, and camera interface boards use the XC3S200-4FTG256I to implement camera timing capture, packetization, and tamper-detection logic. LVDS I/O banks accept camera sensor links, while block RAM provides line buffers; the four 18x18 multipliers support simple image preprocessing. Industrial temperature range suits outdoor enclosures where uncontrolled environments drop below 0C. Power design: 1.2V core plus per-bank VCCO from a compact DC-DC/LDO pair keeps thermal output low in sealed housings, an advantage over hotter-running larger FPGAs.
Recommended
Recommended Products Summary
Engineering reference data for XC3S200-4FTG256I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S200-4FTG256C | XC3S200-4FT256I | XC3S400-4FTG256I | XC3S200A-4FTG256I |
|---|---|---|---|---|---|
| Package | 256-ball FTBGA (FTG256), 17 x 17 mm | 256-ball FTBGA (FTG256) - same | 256-ball FBGA (FT256, tin-lead) | 256-ball FTBGA (FTG256) - same | 256-ball FTBGA (FTG256) - same |
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| System Gates | 200,000 | 200,000 | 200,000 | 400,000 | 200,000 |
| Maximum User I/O | 173 | 173 | 173 | 264 | 195 |
| Block RAM | 216 Kbit | 216 Kbit | 216 Kbit | 288 Kbit | 288 Kbit |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Bitstream Compatibility | Spartan-3 fabric | Identical | Identical | Same family, recompile required | Different generation, recompile required |
Key Differentiators
- Identical fabric with wider temperature tolerance (vs XC3S200-4FTG256C)
- Lower cost with equal footprint vs larger fabric (vs XC3S400-4FTG256I)
- No bitstream migration required vs Spartan-3A (vs XC3S200A-4FTG256I)
Design Notes
Supply three rails to the FTG256 device: 1.2V VCCINT for the core, 2.5V VCCAUX for auxiliary circuits, and per-bank VCCO matched to the I/O standards used (typically 3.3V/2.5V/1.8V). Estimated: core current scales with clock frequency and toggle rate; a mid-activity design at 50 MHz may draw on the order of 100-300 mA, but always run the Xilinx XPower estimator with your actual design for sizing. Decouple each rail with a bulk capacitor plus several 0.1uF ceramics placed at the BGA via fanout.
The 17x17mm FTBGA with 1.0mm ball pitch requires careful escape routing: use via-in-pad or dog-bone fanout on outer rows and route inner balls on inner layers. Define a solid ground plane directly under the die area to return high-frequency currents. Solder mask-defined pads with NSMD geometry per the Xilinx package user guide improve joint reliability. Follow the manufacturer peak-reflow profile (30 seconds maximum at peak temperature per package data) for lead-free FTG256 assembly.
Group I/O by bank so VCCO rails match standards - mixing 3.3V and 2.5V standards on one bank is impossible. For LVDS pairs, maintain 100-ohm differential impedance and length-match within a few millimeters. Connect each DCM input to a clean clock through a short route; jitter beyond DCM correction range causes lock failure at startup. Reserve JTAG access on every production board; it is the only recovery path if configuration corruption occurs in the field.
Spartan-3 bitstreams are NOT compatible with Spartan-3A/3E devices, and the XC3S200 cannot be swapped for the XC3S400 without recompiling. Do not leave configuration mode pins M0-M2 floating - tie them per the chosen scheme. Budget power-up: VCCINT must reach regulation before configuration begins, and the done pin should be observed before releasing system reset. Finally, since Spartan-3 is a mature family, second-source your configuration PROM and plan a Spartan-3A migration path.
Compliance Information
The G suffix in FTG256 denotes the lead-free, RoHS-compliant package version. REACH, halogen-free, and conflict-minerals status were not stated in the provided data.
