XC3S400-5FT256C - 400K Spartan-3 FPGA | AMD
N.º da peça: XC3S400-5FT256C ✗ Fim de vidaXC3S400-5FT256C Visão geral
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor used to implement logic functions through downloadable configuration data. In the product hierarchy, an FPGA is a programmable logic device and a semiconductor. Compared with application-specific integrated circuits, an FPGA permits design changes without fabricating a new ASIC, making it useful for prototypes, industrial control, communications, instrumentation, and embedded systems that require parallel processing or flexible I/O.
The XC3S400-5FT256C provides 294,912 configuration bits according to the device listing, 8,064 logic cells, 173 I/O, and 400,000 system gates. Its -5 speed designation identifies the performance grade, while the C suffix denotes the commercial temperature option. A 725 MHz internal clock speed is listed for this device. These resources allow moderately complex control logic, parallel data processing, state machines, and peripheral interfacing to be consolidated in a compact package.
The device uses a 1.2 V core supply and a 256-lead low-profile ball grid array package. The Spartan-3 architecture combines programmable logic and routing with dedicated hard resources that reduce the amount of general-purpose logic needed for memory-intensive and high-speed interface designs. Exact RAM capacity, supported I/O standards, configuration-memory organization, and pin-level functions must be confirmed in the manufacturer datasheet before a board is released.
Typical uses include industrial automation controllers, data-acquisition systems, communication interfaces, video-processing pipelines, instrumentation, and embedded control platforms. The 173 available I/O make the device suitable for designs combining multiple buses, status signals, counters, and serial links. For systems requiring more parallel data paths, designers can also evaluate larger devices in the same family or migrate to a newer FPGA architecture when board area and power budgets permit.
PCB implementation requires careful attention to the 256-ball footprint, power rails, decoupling, configuration interface, and high-speed routing. Place decoupling capacitors close to the supply and ground balls, route configuration signals away from sensitive inputs, and follow the manufacturer layout and pinout guidance. A complete 256-pin assignment cannot be reproduced reliably without the package pin table, so the datasheet should remain the controlling document during schematic and layout review.
This page combines the exact XC3S400-5FT256C device identifiers, verified distributor technical summaries, package and pinout guidance, a practical same-footprint alternative, and engineering notes for programming, layout, migration, and sourcing. It is intended to accelerate initial engineering decisions while directing final component and pin decisions to the manufacturer documentation.
Alternativas drop-in para XC3S400-5FT256C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3S400-5FT256C (mesmo formato e footprint) — diferindo em Core Supply Voltage, Lead-Free Status, Logic Cells, Package Type, Temperature Grade.
XC3S400-4FT256I
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XC3S400-5FT256C Classificações máximas e características elétricas
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 400,000 gates |
| Logic Cells | 8,064 cells |
| Configuration Bits | 294,912 bits |
| Internal Clock Speed | 725 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Count | 173 I/O |
| Package Type | 256-LBGA |
| Terminal Count | 256 terminals |
| Process Technology | 90 nm |
| Speed Grade | -5 |
| Temperature Grade | Commercial |
| Tipo de montagem | Surface Mount |
| Lead-Free Status | Lead-free |
Guia de Configuração de Pinos do XC3S400-5FT256C 256-lbga
Configuração de pinos para XC3S400-5FT256C (pacote 256-lbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC3S400-5FT256C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC3S400-5FT256C é adequado para 6 aplicaçãos: Industrial Automation Controller, Data-Acquisition Front End, Communication Interface Equipment, Video and Image Processing, Instrumentation and Signal Conditioning, Embedded Control Platform.
Industrial Automation Controller
The XC3S400-5FT256C fits an industrial automation controller because its 173 I/O provide ample connections for sensors, actuators, interlocks, and communications while 8,064 logic cells support multiple state machines and control paths. The device operates from a 1.2 V core supply and is built on 90 nm Spartan-3 technology. Place it beside the field-interface circuitry, use separate I/O supply domains where required, and keep switching-node routing away from precision analog inputs. The commercial C temperature suffix must be checked against the cabinet environment; otherwise, specify an industrial-grade option. Timing should be closed at the -5 grade before configuration data is released for production.
Recomendado
Data-Acquisition Front End
The XC3S400-5FT256C can coordinate parallel acquisition, digital filtering, and data transfer because its 8,064 logic cells and listed 725 MHz internal clock support time-sensitive control logic around external converters. The 173 I/O can accommodate converter data buses, capture strobes, channel enables, and status signals. Use dedicated clock and configuration routing practices to prevent logic or switching noise from corrupting low-level measurements. The 256-LBGA footprint also demands careful layer assignment, via placement, and independent return-path planning. Validate acquisition timing with the actual converter latency and FPGA timing constraints rather than relying only on the nominal internal clock figure.
Recomendado
Communication Interface Equipment
The XC3S400-5FT256C is appropriate for communication equipment that needs parallel data movement, framing logic, buffers, and protocol coordination. Its 173 I/O allow implementation of multiple byte-wide buses, while the programmable Spartan-3 architecture supports concurrent transmit and receive paths. The -5 speed grade provides additional timing margin for moderately demanding parallel logic, subject to normal static timing analysis. Keep high-speed clock and data traces short, use controlled-impedance routing where required, and isolate switching interfaces from sensitive clock inputs. Confirm the exact I/O standards, drive strength, and timing limits in the manufacturer datasheet before assigning external connector signals.
Recomendado
Video and Image Processing
The XC3S400-5FT256C can implement parallel video timing, pixel manipulation, color processing, and test-pattern generation in cost-sensitive systems. Its 8,064 logic cells and 173 I/O are suitable for pipeline-based architectures that process words or small parallel groups of pixels. The listed 725 MHz internal clock and -5 grade provide useful timing margin, but video timing must still be constrained against the actual output clock and external display interface. Use a dedicated clock-capacitor network, provide regulated core and I/O supplies, and route high-speed pixel buses with continuous reference planes. Validate the design with representative video timing rather than relying on nominal gate counts.
Recomendado
Instrumentation and Signal Conditioning
The XC3S400-5FT256C suits laboratory instrumentation requiring configurable sequencing, calibration tables, timing control, and digital filtering. The device can coordinate ADC data capture, trigger logic, relay control, and display or communications updates through its 173 I/O. Its 1.2 V core operation reduces supply complexity relative to older FPGA families, while programmable logic allows measurement algorithms to be revised without changing the PCB. Keep analog and digital return currents separated, place bypass capacitors at the supply balls, and use the manufacturer pin table to distinguish any dedicated configuration or clock pins from general I/O. Validate trigger jitter and settling behavior across the intended measurement bandwidth.
Recomendado
Embedded Control Platform
The XC3S400-5FT256C works as a central programmable controller for embedded systems that combine sequential logic, counters, memory, status monitoring, and multiple peripheral interfaces. The 400,000-system-gate device provides enough parallel resources for a control backplane, while the 256-LBGA package supports compact multilayer boards. Program startup behavior and configuration storage according to the manufacturer guidance, and make the reset path deterministic with suitable pull components. If the product must remain in production, evaluate long-term sourcing early and confirm whether the -5 commercial grade remains acceptable for the deployment environment. A same-footprint industrial-grade option may simplify thermal planning if timing constraints allow.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3S400-5FT256C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC3S400-4FT256I |
|---|---|---|
| Package | 256-LBGA | 256-LBGA |
| Brand | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 |
| System Gates | 400,000 gates | 400,000 gates |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Speed Grade | -5 | -4 |
| Temperature Suffix | Commercial | Industrial |
Principais diferenciais
- Higher same-family speed grade (vs XC3S400-4FT256I)
- Commercial-temperature configuration (vs XC3S400-4FT256I)
- Direct same-package migration path (vs XC3S400-4FT256I)
Notas de projeto
Treat the 256-LBGA footprint as a high-density routed package. Follow the manufacturer land pattern and escape-routing guidance exactly, inspect the completed board with a suitable BGA microscope, and avoid mixing package families that use similar ball counts. Keep configuration, clock, and high-speed I/O escape paths short, while providing uninterrupted reference planes beneath the device.
Decouple the 1.2 V core rail directly at the appropriate supply balls and distribute core and I/O supplies according to the manufacturer power architecture. The FPGA can create high current transitions during configuration and high-speed operation, so use adequate bulk storage near the device and low-ESR local bypass capacitors. Confirm every supply tolerance, sequencing rule, and permitted operating combination in the manufacturer datasheet.
Route clocks as short, continuous paths and place configuration or oscillator components where the implementation guide recommends. Use controlled-impedance routing for external high-speed interfaces and maintain a continuous return path beneath each signal. Check input thresholds and output timing against the actual board-level load, trace length, connector, and clock uncertainty rather than using nominal FPGA clock speed alone.
The closest same-footprint option, XC3S400-4FT256I, is not automatically equivalent in timing or temperature grade. Review all timing reports at the selected speed grade, reconfirm the commercial-versus-industrial environmental requirement, and verify that the configuration bitstream and device identifier are correct. Do not assign PCB nets until the complete 256-ball pin table has been checked.
Informações de conformidade
The commercial listing identifies the device as lead-free. No specific RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification statement is included for this exact MPN.
