XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx
N.º da peça: XC3S200-4FT256C ✓ AtivoXC3S200-4FT256C Visão geral
A field-programmable gate array is a programmable logic device in which configurable logic blocks, programmable input/output blocks, and programmable interconnect form a user-defined digital circuit. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs and mask-programmable logic. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured after manufacture to implement control, interface, protocol, signal-processing, or security functions in parallel.
The Spartan-3 architecture provides 480 configurable logic blocks and 4320 cells according to the supplied distributor and comparison data. Its 256-ball package supports 256 terminals for device configuration, power, clocking, and user I/O. The -4 designation identifies the performance grade, while the commercial C suffix corresponds to the stated 0°C to 85°C operating-temperature range. A maximum supply voltage of 1.26 V and a nominal 1.2 V FPGA supply are also reported in the available data.
The 90 nm Spartan-3 process supports a useful balance of logic capacity, static power, dynamic performance, and manufacturing cost. At up to 630 MHz, the XC3S200-4FT256C can satisfy clock-domain requirements that are more demanding than simple glue logic while remaining smaller and less complex than a high-end FPGA. Exact timing, I/O standards, supported memory interfaces, configuration options, and core-current limits require confirmation in the complete manufacturer datasheet before a new design is released.
Typical uses include industrial control and automation, communications equipment, embedded test systems, consumer products, instrumentation, and compact control modules. Its parallel programmable resources can implement multiple finite-state machines, data acquisition logic, communication bridges, and auxiliary processors concurrently. The 256-terminal package also makes the device suitable for designs requiring more configuration and user I/O than a small CPLD, although board density and routing must be assessed at the schematic and PCB stages.
Designers should treat the package, voltage rails, decoupling, configuration interface, clocking, and I/O standards as a coordinated system rather than isolated specifications. Place bypass capacitors close to the supply pins, preserve the required configuration path, and verify every ball assignment against the exact package drawing. Because the supplied snippets contain inconsistent secondary descriptions of package and cell data, the authoritative manufacturer pinout and datasheet should control any production implementation.
This page combines the verified distributor specifications with engineering-focused application guidance, design notes, parameter comparisons, and same-family drop-in candidates. It also distinguishes confirmed values from unavailable electrical details, helping engineers identify the correct replacement without mistaking a similar FPGA for a guaranteed production substitute.
Alternativas drop-in para XC3S200-4FT256C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC3S200-4FT256C (mesmo formato e footprint) — diferindo em Logic Cells, Operating Temperature, Package, System Gates.
XC3S200-4FTG256C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC3S200-5FTG256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC3S200-4FTG256I
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XC3S200-5FTG256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC3S200AN-4FTG256C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC3S200-4FT256C Classificações máximas e características elétricas
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 200000 |
| Logic Cells | 4320 |
| Configurable Logic Blocks | 480 |
| Frequência máxima de clock | 630 MHz |
| Nominal Core Supply Voltage | 1.2 V |
| Maximum Supply Voltage | 1.26 V |
| Process Technology | 90 nm |
| Encapsulamento | 256-LBGA |
| Number of Terminals | 256 |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperatura de operação | 0°C to 85°C |
| Speed Grade | -4 |
| Temperature Grade | Commercial |
| Lead-Free Status | Lead free |
| Typical Application | Cost-sensitive high-performance programmable logic |
Guia de Configuração de Pinos do XC3S200-4FT256C square
Configuração de pinos para XC3S200-4FT256C (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC3S200-4FT256C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC3S200-4FT256C é adequado para 6 aplicaçãos: Industrial Control and Automation, Communications Bridge and Protocol Converter, Data Acquisition and Signal Conditioning, Embedded Test and Measurement, Consumer and Embedded Control Products, Networked Edge and Interface Equipment.
Industrial Control and Automation
XC3S200-4FT256C fits compact industrial controllers because its 4320 logic cells can host multiple parallel control tasks, while its stated 630 MHz maximum frequency provides useful timing capability for signal processing. The device can implement sequencers, machine interfaces, interlocks, and communication bridges without relying on a single fixed-function microcontroller. Its 0°C to 85°C commercial-temperature range suits controlled cabinets rather than extended outdoor environments. The 256-LBGA package also provides numerous ball connections for configuration and user I/O, although careful decoupling and signal-integrity layout remain necessary.
Recomendado
Communications Bridge and Protocol Converter
The XC3S200-4FT256C can bridge dissimilar serial interfaces by running protocol engines and packet buffering in parallel FPGA fabric. Its 200000 system gates and 480 configurable logic blocks provide substantially more parallelism than a simple state-machine controller, while the 630 MHz class supports common serial-interface timing. Engineers can implement UART, SPI, parallel-to-serial conversion, framing logic, and test instrumentation in one programmable device. The principal design tradeoff is that high-speed interfaces still require disciplined clocking, controlled-impedance routing, and verified I/O standards.
Recomendado
Data Acquisition and Signal Conditioning
XC3S200-4FT256C is useful in data-acquisition systems that need parallel sampling control, digital filtering, buffering, and interface conversion. Its 4320 logic cells can execute several fixed-point or state-based operations concurrently, while the 200000-gate capacity provides room for control and status logic. The stated 1.2 V core supply and 630 MHz maximum clock make it suitable for moderate-rate digital processing when analog front-end conversion is handled separately. Engineers should use the exact datasheet timing and I/O specifications to establish the actual sampling pipeline and external clock margins.
Recomendado
Embedded Test and Measurement
The programmable architecture of XC3S200-4FT256C supports flexible test engines, pattern generators, counters, acquisition channels, and communication ports that can be updated without changing hardware. Its 4320 cells and 630 MHz maximum frequency allow parallel acquisition and stimulus functions to coexist, making it appropriate for compact automated test equipment. A configurable FPGA also simplifies protocol upgrades when the instrument firmware and bitstream are changed together. For accurate measurements, designers should isolate analog paths, terminate clocks correctly, and consult the manufacturer timing tables for synchronous interface margins.
Recomendado
Consumer and Embedded Control Products
XC3S200-4FT256C addresses cost-sensitive consumer electronics that need configurable logic, display timing, keypad scanning, motor sequencing, or peripheral adaptation. The Spartan-3 family was explicitly described in the supplied datasheet result as targeting high-volume, cost-sensitive consumer applications. Its 4320 cells provide enough parallelism for dedicated control functions while maintaining a relatively compact 256-LBGA footprint. The commercial 0°C to 85°C temperature range limits indoor use, and production designs must account for configuration storage, boot behavior, supply sequencing, and long-term device availability.
Recomendado
Networked Edge and Interface Equipment
XC3S200-4FT256C can serve as the programmable logic core in compact networking equipment, adding local packet processing, status display, and peripheral interfaces. The 200000 system gates allow dedicated datapaths to run concurrently, while the 630 MHz maximum frequency can support common edge-processing tasks and clocked bus logic. It is especially useful where a fixed interface combination is supplemented by programmable features or where product variants can share a common hardware platform. A practical implementation must preserve Ethernet PHY timing, isolate sensitive signals, and provide deterministic power and reset sequencing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC3S200-4FT256C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC3S200-4FTG256C | XC3S200-5FTG256C | XC3S200-4FTG256I | XC3S200-5FTG256I | XC3S200AN-4FTG256C |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) | 256-LBGA (FTBGA-256) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3A |
| Speed Grade | -4 | -4 | -5 | -4 | -5 | -4 |
| Temperature Grade | Commercial, 0°C to 85°C | Commercial | Commercial | Industrial | Industrial | Commercial |
| Core Supply | 1.2 V nominal; 1.26 V maximum | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principais diferenciais
- Commercial-grade -4 configuration with a 630 MHz stated maximum clock (vs XC3S200-5FTG256I)
- Original Spartan-3 device with 4320 logic cells (vs XC3S200AN-4FTG256C)
- Commercial-temperature operation matches controlled indoor equipment (vs XC3S200-4FTG256I)
- 200K Spartan-3 density in a 256-LBGA package (vs XC3S200-5FTG256C)
Notas de projeto
Verify the core and I/O supply requirements against the exact manufacturer datasheet before routing the PCB. The supplied data identifies a 1.2 V nominal core supply and a 1.26 V maximum voltage, but it does not expose current limits or power-consumption tables. Place the required bypass capacitors at the associated supply and ground balls using the manufacturer placement guidance, and provide clean sequencing so that configuration and I/O rails do not exceed their limits.
Do not infer the 256-ball pinout from a generic 256-LBGA drawing. The supplied snippets confirm a square 256-ball package, while the FTBGA-256 outline is not available as a canonical package diagram in the library. Use the manufacturer package drawing and pin table for every power, configuration, clock, and user-I/O connection. Confirm ball pitch, solder-mask clearance, thermal-via pattern, and PCB stack-up before releasing fabrication files.
Route clocks and high-speed interfaces with short, continuous paths and return vias beneath the signal path. The stated maximum clock frequency of 630 MHz is a device capability rather than a guaranteed board-level operating rate, so timing closure must include the selected package, PCB stack-up, I/O standard, and external load. Add source-series damping where required by the output-edge data and validate signal integrity with simulation or measurement before production.
A shared package name does not by itself prove drop-in compatibility. Before substituting any listed candidate, compare the complete ball map, supported I/O standards, configuration pins, core voltage, speed grade, temperature range, timing constraints, and bitstream support. The XC3S200-4FT256C is a 200K-gate Spartan-3 device with 4320 cells, so a replacement that changes family revision, density, speed grade, or temperature grade can affect design timing and qualification even when the package remains 256-LBGA.
Informações de conformidade
The DigChip snippet identifies the listed component as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals, or automotive-qualification statement was supplied, so those fields remain unknown.
