AMD

XC3S50A-4VQG100I - Spartan-3A 68-I/O FPGA | AMD

N.º da peça: XC3S50A-4VQG100I ✗ Fim de vida
1.2 V Vdss 100-pin TQFP Package -4 speed grade Speed
MOQ: 1 |

XC3S50A-4VQG100I Visão geral

The AMD XC3S50A-4VQG100I is a Spartan-3A field-programmable gate array with 1,584 configurable logic cells, 68 user I/O pins, a 1.2 V core supply, and a 100-pin TQFP package. The device is specified for an industrial temperature range of -40°C to +100°C, making it suitable for temperature-stable programmable control, signal conditioning, interface bridging, and embedded data-processing systems.

A field-programmable gate array is a digital semiconductor whose configurable logic, interconnect, and I/O resources can be programmed after manufacture. The Spartan-3A family belongs to the FPGA and CPLD product hierarchy and combines programmable logic density with a relatively large I/O count. This balance allows one package to implement control logic, protocol interfaces, data acquisition functions, and peripheral connectivity without requiring a separate microcontroller for every task.

The XC3S50A-4VQG100I provides approximately 50,000 logic gates, 68 user I/O pins, 1,584 logic cells, and a 1.2 V core. Its -4 designation identifies the device speed grade, while the industrial suffix supports operation from -40°C to +100°C. The 100-pin TQFP package also exposes more I/O than smaller FPGA packages and remains practical for conventional board assembly. Exact RAM, block-RAM, clock, and I/O voltage details should be confirmed in the manufacturer datasheet before final design release.

The Spartan-3A architecture is useful when a design requires deterministic parallel logic, flexible pin assignment, and firmware-controlled reconfiguration. Typical implementation patterns include I/O-intensive industrial controllers, data-acquisition front ends, communication protocol converters, motion-control sequencing, and display-interface logic. Parallel processing and dedicated I/O access can reduce the need for external glue logic while preserving a compact embedded footprint.

A key design consideration is power and timing. The 1.2 V core rail must be generated cleanly and decoupled close to the device, while every external I/O voltage must satisfy the selected bank's voltage limits. Designers should also use the exact Spartan-3A pin table when assigning balls or pins, account for configuration and startup behavior, and validate timing with the appropriate Xilinx development tools for the installed device and speed grade.

This page combines the exact device characteristics with package-specific guidance, practical application fit, comparison criteria, and engineering-oriented replacement notes. These details help engineers distinguish direct package-compatible options from alternatives that may require a different footprint, speed grade, temperature grade, or FPGA architecture.

Alternativas drop-in para XC3S50A-4VQG100I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com XC3S50A-4VQG100I (mesmo formato e footprint) — diferindo em Device Type, Package, Logic Cells, Configuration Modes, Operating Temperature.

Xilinx
Device Type: Spartan-3 field-programmable gate array (FPGA)
Package: 100-pin TQFP (VQ100)
Logic Cells: 1,584 cells
Comparar com XC3S50A-4VQG100I →
AMD
Device Type: Spartan-3 field-programmable gate array (FPGA)
Package: 100-TQFP
Logic Cells: 1,728 logic cells
Comparar com XC3S50A-4VQG100I →
AMD
Device Type: Spartan-3A field-programmable gate array (FPGA)
Logic Cells: 1,584 cells
Configuration Modes: Master Serial, Master SPI, BPI, Slave Parallel SelectMAP, processor, and Slave Serial
Comparar com XC3S50A-4VQG100I →
AMD
Device Type: Spartan-3A Field Programmable Gate Array (FPGA)
Logic Cells: 1,584 cells
Configuration Modes: Master Serial, Master SPI, BPI, Slave Parallel, SelectMAP, Slave Serial
Comparar com XC3S50A-4VQG100I →
AMD
Device Type: FPGA (Field Programmable Gate Array)
Package: VQFP-100 (TQG100), 14 x 14 mm
Logic Cells: 1,584 cells
Comparar com XC3S50A-4VQG100I →

XC3S50A-4VQG100C

✅ Drop-In
AMD
📦 100-pin TQFP
FPGA (Field Programmable Gate Array) · Spartan-3A (XC3S50A) · 1,584 cells · 176 CLBs · 50,000 gates (50K) · 68 I/O · 250 MHz (-4 speed grade) · 90 nm CMOS

Consulte o preço

Ver ficha técnica →

XC3S50A-5VQG100I

✅ Drop-In
📦 100-pin TQFP
Speed grade changes from -4 to -5 while the -40°C to +100°C temperature range, 1,584 logic cells, 68 I/O, and 100-pin package remain matched.

📋 Alternativa de referência (fora do catálogo)

XC3S50A-4VQG100

✅ Drop-In ⚠️ Especificações não verificadas
📦 100-pin TQFP
The commercial -40°C to +100°C industrial suffix is omitted, making the operating-temperature grade the principal difference while retaining the -4 speed grade and 100-pin package.

📋 Alternativa de referência (fora do catálogo)

XC3S50A-5VQG100

✅ Drop-In ⚠️ Especificações não verificadas
📦 100-pin TQFP
The speed grade increases from -4 to -5 and the industrial temperature suffix is omitted; the 100-pin package remains matched.

📋 Alternativa de referência (fora do catálogo)

XC3S50A-4VQG100C

✅ Drop-In ⚠️ Especificações não verificadas
AMD
📦 100-pin TQFP
FPGA (Field Programmable Gate Array) · Spartan-3A (XC3S50A) · 1,584 cells · 176 CLBs · 50,000 gates (50K) · 68 I/O · 250 MHz (-4 speed grade) · 90 nm CMOS

Consulte o preço

Ver ficha técnica →

XC3S50A-4VQG100I Classificações máximas e características elétricas

Device Type Spartan-3A FPGA
Logic Cells 1,584 logic cells
Logic Gates 50,000 gates
User I/O Count 68 I/O
Core Supply Voltage 1.2 V
Speed Grade -4 speed grade
Industrial Temperature Range -40°C to +100°C
Encapsulamento 100-pin TQFP
Package Family TQFP family, surface-mount package
Tipo de montagem Surface mount
Programmable Logic Type FPGA
I/O Architecture 68 user I/O pins

Guia de Configuração de Pinos do XC3S50A-4VQG100I tqfp family, surface-mount package

Configuração de pinos para XC3S50A-4VQG100I (pacote tqfp family, surface-mount package). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote tqfp family, surface-mount package para XC3S50A-4VQG100I

Nenhum dado detalhado de pinagem disponível para XC3S50A-4VQG100I.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

XC3S50A-4VQG100I é adequado para 6 aplicaçãos: Industrial Automation Controller, Data-Acquisition Front End, Communication Protocol Converter, Motion and Sequencing Control, Display and Interface Control, Embedded Control and Sensor Hub.

🏭

Industrial Automation Controller

The XC3S50A-4VQG100I fits compact industrial controllers that combine deterministic control logic with numerous field-side connections. Its 1,584 logic cells can support sequencing, state machines, diagnostics, and communication-interface control, while 68 user I/O pins provide access to sensors, actuators, status indicators, and bus transceivers. The -40°C to +100°C industrial temperature range makes it better suited than a commercial-grade part to factory equipment operating outside the 0°C to +85°C range. The 100-pin TQFP package is also convenient for conventional PCB assembly. Final qualification still requires checking voltage tolerances, isolation, surge requirements, EMC conditions, and timing margins for the enclosure and attached field interfaces.

📊

Data-Acquisition Front End

The XC3S50A-4VQG100I can implement parallel data capture, channel multiplexing control, filtering, triggering, and interface conversion in a data-acquisition front end. Its 68 user I/O pins give a design enough parallel connections for converters, control signals, status flags, and communications, while the programmable logic permits timing sequences to be adjusted without changing the PCB. The 1.2 V core supply must be generated with low noise, and all external signal levels must comply with the assigned bank's voltage limits. For precision measurement systems, separate analog conditioning from the FPGA, validate acquisition timing at the target -4 speed grade, and review the manufacturer pin table before assigning every bank.

🌐

Communication Protocol Converter

The XC3S50A-4VQG100I is suitable for protocol conversion and routing logic that must translate between legacy serial interfaces, parallel buses, or proprietary control formats. Its 1,584 programmable logic cells allow concurrent state machines, framing logic, buffers, and error handling, while 68 I/O pins support multiple transceiver connections. The -4 speed grade should be checked against the required baud rate, packet latency, and timing margin rather than inferred from logic-cell count alone. A practical implementation isolates the FPGA ground and supplies according to the transceiver requirements, uses controlled-length routes for sensitive signals, and validates protocol timing under worst-case loading and temperature conditions.

⚙️

Motion and Sequencing Control

The XC3S50A-4VQG100I can implement motion sequencing, pulse generation, position tracking, and machine-state control where a compact programmable-logic solution is preferred over a larger processor. Parallel I/O supports limit switches, stepper or solenoid controls, encoder-related signals, and status feedback, while the FPGA's deterministic logic helps coordinate multi-axis sequences. The design must account for output-slew behavior, input thresholds, inductive-load protection, and grounding because these issues are outside the FPGA's internal control logic. The industrial temperature range supports equipment exposed to temperature variation, but enclosure heating, airflow, and motor-return current still require system-level thermal and EMC validation.

📺

Display and Interface Control

The XC3S50A-4VQG100I can serve as the timing and control engine for character, graphics, or custom display interfaces where multiple data lines and control signals must be coordinated. Its 68 I/O pins provide dedicated paths for pixel or segment data, synchronization, chip-select, and panel-control functions, while programmable logic simplifies counter, blanking, and command-sequence implementations. Panel voltage requirements are independent of the FPGA's 1.2 V core, so level translation and interface timing must be designed explicitly. Check the manufacturer's I/O-standard and bank-voltage restrictions, ensure refresh timing meets the -4 grade requirements, and simulate panel initialization to prevent unintended states during power-up.

🧩

Embedded Control and Sensor Hub

The XC3S50A-4VQG100I works well as a programmable sensor hub or embedded control front end that aggregates inputs, performs local logic operations, and presents a simpler interface to a host processor. Its 68 I/O pins can connect digital sensors, interrupt outputs, level indicators, and external peripherals, while 1,584 logic cells can manage debouncing, event filtering, packetization, and status reporting. The industrial temperature range is useful in unattended equipment and temperature-varying installations. Power design should isolate noisy loads, provide stable core voltage, and follow the manufacturer's decoupling layout. Verify every external voltage against the assigned bank's requirements and confirm configuration behavior before using the hub as the sole system controller.

What are the key specifications of XC3S50A-4VQG100I that engineers should know?
The XC3S50A-4VQG100I is a Spartan-3A FPGA with 1,584 logic cells, approximately 50,000 logic gates, 68 user I/O pins, a 1.2 V core supply, and a 100-pin TQFP package. According to the AMD and Xilinx product listing, it also carries an industrial temperature range of -40°C to +100°C. The -4 code identifies the speed grade, while the final I suffix identifies the industrial-temperature version. Exact configuration-pin, memory, PLL, and bank-voltage details must be confirmed in the manufacturer datasheet.
What is the operating temperature range of XC3S50A-4VQG100I?
The XC3S50A-4VQG100I is specified for an industrial temperature range of -40°C to +100°C. This makes it appropriate for factory automation, industrial communication equipment, and temperature-varied embedded installations where a commercial-temperature FPGA would not cover the full environmental requirement. The manufacturer datasheet should also be checked for junction-temperature limits and any derating rules associated with the 100-pin TQFP package.
Where can I download the XC3S50A-4VQG100I datasheet PDF?
The XC3S50A-4VQG100I datasheet can be accessed through the AMD/Xilinx datasheet listing at Octopart, which links to Spartan-3A technical documentation. Review the complete manufacturer datasheet for the 100-pin pin table, configuration requirements, supported I/O standards, DC operating limits, and AC timing characteristics. Use the exact XC3S50A-4VQG100I ordering code when checking grade, package, and temperature-specific limits.
Where can I find the XC3S50A-4VQG100I pinout?
The XC3S50A-4VQG100I pinout is defined in the Spartan-3A manufacturer datasheet and must be matched to the 100-pin TQFP footprint. Use the pin-description table to identify configuration pins, power rails, grounds, and user I/O before assigning PCB nets. Because package drawing orientation and exposed-pad details can vary by documentation revision, the symbol and pin numbering used by the installed FPGA design tool should also be cross-checked.
Is XC3S50A-4VQG100I suitable for industrial automation and data acquisition?
Yes, the XC3S50A-4VQG100I is suitable for many industrial automation and data-acquisition designs because it combines 1,584 logic cells with 68 user I/O pins and a -40°C to +100°C industrial temperature range. Its programmable architecture supports parallel acquisition logic, control sequencing, and interface adaptation. The design must still verify signal levels, timing margins, isolation requirements, and analog front-end specifications for the particular industrial system.
What can replace the XC3S50A-4VQG100I?
The closest package-compatible replacements are the Spartan-3A variants that retain the 100-pin TQFP footprint, including XC3S50A-4VQG100C and XC3S50A-5VQG100I. XC3S50A-4VQG100C keeps the -4 speed grade but changes the temperature grade to commercial, while XC3S50A-5VQG100I keeps the industrial temperature range but uses the faster -5 grade. Verify pin compatibility, voltage limits, timing, and lifecycle requirements before replacing the installed device.
Is XC3S50A-4VQG100I the same as XC3S50A-4VQG100C?
No, XC3S50A-4VQG100I and XC3S50A-4VQG100C share the Spartan-3A device family, -4 speed grade, and 100-pin VQFP package, but their temperature grades differ. The I version is specified from -40°C to +100°C, whereas the C version is commercial, normally covering 0°C to +85°C. The C version is therefore not a temperature-equivalent substitute for installations that require industrial-range operation.
When should I choose XC3S50A-4VQG100I over XC3S50A-5VQG100I?
Choose XC3S50A-4VQG100I when the -4 speed grade meets the design's timing requirements and the operating environment requires the industrial temperature range of -40°C to +100°C. Choose XC3S50A-5VQG100I when additional timing margin is valuable and the same 100-pin footprint can be retained. The faster grade does not change the package, so compatibility must still be confirmed from its manufacturer datasheet and timing analysis.
XC3S50A-4VQG100I vs XC3S50A-4VQG100C: which is better for an industrial controller?
XC3S50A-4VQG100I is normally the better choice for an industrial controller exposed to temperatures below 0°C or above 85°C because it provides a -40°C to +100°C operating range. XC3S50A-4VQG100C retains the same family and 100-pin package but uses the commercial temperature grade. If the enclosure remains within 0°C to +85°C and the -4 timing grade is sufficient, the C version may reduce qualification requirements, although availability and lifecycle conditions should be checked.
What is the best AMD/Xilinx equivalent for XC3S50A-4VQG100I?
The most direct AMD/Xilinx equivalents are Spartan-3A variants with the same 100-pin package and matching density: XC3S50A-4VQG100C for a commercial-temperature installation and XC3S50A-5VQG100I for a faster industrial installation. These are package-level drop-in candidates, not unconditional functional equivalents. The replacement decision must confirm the exact pinout, I/O standards, configuration behavior, speed grade, temperature range, and lifecycle status.
Where to buy XC3S50A-4VQG100I online?
Use the Request a Quote form on this page to request XC3S50A-4VQG100I availability, lot traceability, and delivery options. The form allows the requested quantity, target price, and shipment details to be submitted without relying on a static marketplace listing. Because availability can change rapidly, engineers should request a current quotation rather than assume that the product's historical distributor count reflects current stock.
What is the price of XC3S50A-4VQG100I?
The current XC3S50A-4VQG100I price is generated through the Request a Quote form on this page. Pricing can vary with quantity, order form, traceability, packaging, and market conditions, so a static price would age quickly. Include your forecast quantities, target price, and required inspection or traceability documents in the request to obtain a commercially useful response.
What is the lead time for XC3S50A-4VQG100I?
The current lead time for XC3S50A-4VQG100I should be requested through the Request a Quote form on this page. For an FPGA that may have an extended or constrained supply lifecycle, include production schedule, annual usage, acceptable substitute window, and traceability requirements. This helps the supply team confirm whether a single-unit prototype and a planned production quantity have the same delivery profile.
Is XC3S50A-4VQG100I in stock?
Current XC3S50A-4VQG100I stock should be confirmed through the Request a Quote form on this page. Historical distributor snippets may describe availability at the time of retrieval and cannot establish present inventory. Include the required quantity, packaging preference, date code requirement, and production horizon so that the response reflects an actionable supply commitment.
How does XC3S50A-4VQG100I compare with XC3S50A-4VQG100C for PCB replacement?
XC3S50A-4VQG100I and XC3S50A-4VQG100C use the same 100-pin VQFP family package, so their PCB footprints can be matched for replacement. Their principal difference is temperature grade: the I version covers -40°C to +100°C, while the C version covers the commercial range of 0°C to +85°C. Package equality does not make them interchangeable across the entire operating envelope, particularly in industrial or outdoor equipment.
How should I power and decouple the XC3S50A-4VQG100I?
Power the XC3S50A-4VQG100I from a clean 1.2 V core rail and place the required bypass capacitors close to its power and ground pins according to the manufacturer layout guidance. External I/O rails must remain within the voltage limits of the assigned I/O bank. Because exact capacitor values, rail sequencing, and allowed I/O combinations are device-specific, use the manufacturer datasheet and reference design rather than applying values from a different FPGA.

Dados de referência de engenharia para XC3S50A-4VQG100I — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the XC3S50A-4VQG100I when a Spartan-3A design needs the -4 speed grade, 1,584 logic cells, 68 user I/O pins, and industrial operation from -40°C to +100°C in a 100-pin TQFP footprint. Select XC3S50A-4VQG100C only when the finished equipment remains within 0°C to +85°C and commercial-grade qualification is appropriate. Select XC3S50A-5VQG100I when the same industrial temperature range is required but additional timing margin is useful; however, the faster grade requires fresh timing validation. The suffix variations XC3S50A-4VQG100 and XC3S50A-5VQG100 retain the package for procurement flexibility but omit the explicit industrial-temperature suffix. Because configuration behavior, I/O-bank restrictions, timing, and tool support are device-specific, confirm every replacement against the manufacturer datasheet before production use.

Comparação com alternativas

Parâmetro Este produto XC3S50A-4VQG100C XC3S50A-5VQG100I XC3S50A-4VQG100 XC3S50A-5VQG100
Brand AMD AMD AMD AMD AMD
Package 100-pin TQFP 100-pin TQFP - same 100-pin TQFP - same 100-pin TQFP - same 100-pin TQFP - same
FPGA Family Spartan-3A Spartan-3A Spartan-3A Spartan-3A Spartan-3A
Logic Cells 1,584 logic cells 1,584 logic cells 1,584 logic cells 1,584 logic cells 1,584 logic cells
Logic Gates 50,000 gates 50,000 gates 50,000 gates 50,000 gates 50,000 gates
User I/O 68 I/O 68 I/O 68 I/O 68 I/O 68 I/O
Core Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Speed Grade -4 -4 -5 -4 -5
Temperature Grade Industrial, -40°C to +100°C Commercial, 0°C to +85°C Industrial, -40°C to +100°C Commercial, 0°C to +85°C Commercial, 0°C to +85°C

Principais diferenciais

  • Industrial temperature coverage (vs XC3S50A-4VQG100C)
  • Broader timing selection within the same footprint (vs XC3S50A-5VQG100I)
  • Package-compatible family flexibility (vs XC3S50A-4VQG100)

Notas de projeto

The XC3S50A-4VQG100I uses a 1.2 V core supply, so power conversion and decoupling must be designed against the manufacturer's recommended schematic and layout. Place the required bulk and bypass capacitors at the specified power pins, minimize loop area, and isolate switching-regulator energy from the core. Confirm that every external I/O voltage is valid for the assigned bank rather than assuming that all 68 I/O pins support the same voltage range.

Assign the 100-pin TQFP footprint from the exact package drawing and pin table rather than from a generic TQFP symbol. Check pin-1 orientation, pin numbering, power pins, configuration pins, and exposed thermal or ground features against the selected manufacturer documentation. A symbol mismatch can create a physically valid but electrically incorrect board, so compare the final PCB library directly with the datasheet drawing.

Review each I/O bank's supported standards, drive strength, slew behavior, and voltage limits before assigning external signals. For high-speed interfaces, use controlled-impedance routing, provide a continuous reference plane, minimize stubs, and place any required series termination close to the driver. Add interface-device hold-up and recovery requirements to system timing analysis, particularly when the FPGA controls a transceiver's enable signal.

Do not substitute a commercial-temperature XC3S50A-4VQG100C for the industrial XC3S50A-4VQG100I without confirming that the complete product environment remains within 0°C to +85°C. Likewise, a -5 speed-grade alternative may change timing characteristics even though it retains the 100-pin footprint. Verify the pin table, I/O limits, timing margin, configuration method, and firmware image compatibility before approving any replacement.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

No definitive RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was identified for the exact MPN. Confirm current declarations with AMD or the authorized supply channel.

Dados verificados em: 2026-11-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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Componentes & termos relacionados

AMD Xilinx XC3S50A-4VQG100I XC3S50A-4VQG100C XC3S50A-5VQG100I Spartan-3A FPGA CPLD field-programmable gate array configurable logic cell logic gate user I/O 1.2 V core supply 100-pin TQFP TQFP family surface-mount package industrial temperature grade commercial temperature grade speed grade programmable logic data acquisition industrial automation protocol conversion motion control sensor hub
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