XC3S50A-4VQG100I - Spartan-3A 68-I/O FPGA | AMD
부품 번호: XC3S50A-4VQG100I ✗ 단종XC3S50A-4VQG100I 개요
A field-programmable gate array is a digital semiconductor whose configurable logic, interconnect, and I/O resources can be programmed after manufacture. The Spartan-3A family belongs to the FPGA and CPLD product hierarchy and combines programmable logic density with a relatively large I/O count. This balance allows one package to implement control logic, protocol interfaces, data acquisition functions, and peripheral connectivity without requiring a separate microcontroller for every task.
The XC3S50A-4VQG100I provides approximately 50,000 logic gates, 68 user I/O pins, 1,584 logic cells, and a 1.2 V core. Its -4 designation identifies the device speed grade, while the industrial suffix supports operation from -40°C to +100°C. The 100-pin TQFP package also exposes more I/O than smaller FPGA packages and remains practical for conventional board assembly. Exact RAM, block-RAM, clock, and I/O voltage details should be confirmed in the manufacturer datasheet before final design release.
The Spartan-3A architecture is useful when a design requires deterministic parallel logic, flexible pin assignment, and firmware-controlled reconfiguration. Typical implementation patterns include I/O-intensive industrial controllers, data-acquisition front ends, communication protocol converters, motion-control sequencing, and display-interface logic. Parallel processing and dedicated I/O access can reduce the need for external glue logic while preserving a compact embedded footprint.
A key design consideration is power and timing. The 1.2 V core rail must be generated cleanly and decoupled close to the device, while every external I/O voltage must satisfy the selected bank's voltage limits. Designers should also use the exact Spartan-3A pin table when assigning balls or pins, account for configuration and startup behavior, and validate timing with the appropriate Xilinx development tools for the installed device and speed grade.
This page combines the exact device characteristics with package-specific guidance, practical application fit, comparison criteria, and engineering-oriented replacement notes. These details help engineers distinguish direct package-compatible options from alternatives that may require a different footprint, speed grade, temperature grade, or FPGA architecture.
드롭인 대체품: XC3S50A-4VQG100I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC3S50A-4VQG100I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Logic Cells, Configuration Modes, Operating Temperature.
XC3S50A-4VQG100C
✅ 드롭인가격 문의
데이터시트 보기 →XC3S50A-5VQG100I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S50A-4VQG100
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S50A-5VQG100
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S50A-4VQG100C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC3S50A-4VQG100I 최대 정격 & 전기적 특성
| Device Type | Spartan-3A FPGA |
| Logic Cells | 1,584 logic cells |
| Logic Gates | 50,000 gates |
| User I/O Count | 68 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -4 speed grade |
| Industrial Temperature Range | -40°C to +100°C |
| 패키지 | 100-pin TQFP |
| Package Family | TQFP family, surface-mount package |
| 실장 유형 | Surface mount |
| Programmable Logic Type | FPGA |
| I/O Architecture | 68 user I/O pins |
XC3S50A-4VQG100I tqfp family, surface-mount package 핀 구성 가이드
XC3S50A-4VQG100I(tqfp family, surface-mount package 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S50A-4VQG100I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S50A-4VQG100I 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Data-Acquisition Front End, Communication Protocol Converter, Motion and Sequencing Control, Display and Interface Control, Embedded Control and Sensor Hub.
Industrial Automation Controller
The XC3S50A-4VQG100I fits compact industrial controllers that combine deterministic control logic with numerous field-side connections. Its 1,584 logic cells can support sequencing, state machines, diagnostics, and communication-interface control, while 68 user I/O pins provide access to sensors, actuators, status indicators, and bus transceivers. The -40°C to +100°C industrial temperature range makes it better suited than a commercial-grade part to factory equipment operating outside the 0°C to +85°C range. The 100-pin TQFP package is also convenient for conventional PCB assembly. Final qualification still requires checking voltage tolerances, isolation, surge requirements, EMC conditions, and timing margins for the enclosure and attached field interfaces.
추천
Data-Acquisition Front End
The XC3S50A-4VQG100I can implement parallel data capture, channel multiplexing control, filtering, triggering, and interface conversion in a data-acquisition front end. Its 68 user I/O pins give a design enough parallel connections for converters, control signals, status flags, and communications, while the programmable logic permits timing sequences to be adjusted without changing the PCB. The 1.2 V core supply must be generated with low noise, and all external signal levels must comply with the assigned bank's voltage limits. For precision measurement systems, separate analog conditioning from the FPGA, validate acquisition timing at the target -4 speed grade, and review the manufacturer pin table before assigning every bank.
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Communication Protocol Converter
The XC3S50A-4VQG100I is suitable for protocol conversion and routing logic that must translate between legacy serial interfaces, parallel buses, or proprietary control formats. Its 1,584 programmable logic cells allow concurrent state machines, framing logic, buffers, and error handling, while 68 I/O pins support multiple transceiver connections. The -4 speed grade should be checked against the required baud rate, packet latency, and timing margin rather than inferred from logic-cell count alone. A practical implementation isolates the FPGA ground and supplies according to the transceiver requirements, uses controlled-length routes for sensitive signals, and validates protocol timing under worst-case loading and temperature conditions.
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Motion and Sequencing Control
The XC3S50A-4VQG100I can implement motion sequencing, pulse generation, position tracking, and machine-state control where a compact programmable-logic solution is preferred over a larger processor. Parallel I/O supports limit switches, stepper or solenoid controls, encoder-related signals, and status feedback, while the FPGA's deterministic logic helps coordinate multi-axis sequences. The design must account for output-slew behavior, input thresholds, inductive-load protection, and grounding because these issues are outside the FPGA's internal control logic. The industrial temperature range supports equipment exposed to temperature variation, but enclosure heating, airflow, and motor-return current still require system-level thermal and EMC validation.
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Display and Interface Control
The XC3S50A-4VQG100I can serve as the timing and control engine for character, graphics, or custom display interfaces where multiple data lines and control signals must be coordinated. Its 68 I/O pins provide dedicated paths for pixel or segment data, synchronization, chip-select, and panel-control functions, while programmable logic simplifies counter, blanking, and command-sequence implementations. Panel voltage requirements are independent of the FPGA's 1.2 V core, so level translation and interface timing must be designed explicitly. Check the manufacturer's I/O-standard and bank-voltage restrictions, ensure refresh timing meets the -4 grade requirements, and simulate panel initialization to prevent unintended states during power-up.
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Embedded Control and Sensor Hub
The XC3S50A-4VQG100I works well as a programmable sensor hub or embedded control front end that aggregates inputs, performs local logic operations, and presents a simpler interface to a host processor. Its 68 I/O pins can connect digital sensors, interrupt outputs, level indicators, and external peripherals, while 1,584 logic cells can manage debouncing, event filtering, packetization, and status reporting. The industrial temperature range is useful in unattended equipment and temperature-varying installations. Power design should isolate noisy loads, provide stable core voltage, and follow the manufacturer's decoupling layout. Verify every external voltage against the assigned bank's requirements and confirm configuration behavior before using the hub as the sole system controller.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC3S50A-4VQG100I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S50A-4VQG100C | XC3S50A-5VQG100I | XC3S50A-4VQG100 | XC3S50A-5VQG100 |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| FPGA Family | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A |
| Logic Cells | 1,584 logic cells | 1,584 logic cells | 1,584 logic cells | 1,584 logic cells | 1,584 logic cells |
| Logic Gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates |
| User I/O | 68 I/O | 68 I/O | 68 I/O | 68 I/O | 68 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -4 | -4 | -5 | -4 | -5 |
| Temperature Grade | Industrial, -40°C to +100°C | Commercial, 0°C to +85°C | Industrial, -40°C to +100°C | Commercial, 0°C to +85°C | Commercial, 0°C to +85°C |
주요 차별점
- Industrial temperature coverage (vs XC3S50A-4VQG100C)
- Broader timing selection within the same footprint (vs XC3S50A-5VQG100I)
- Package-compatible family flexibility (vs XC3S50A-4VQG100)
설계 노트
The XC3S50A-4VQG100I uses a 1.2 V core supply, so power conversion and decoupling must be designed against the manufacturer's recommended schematic and layout. Place the required bulk and bypass capacitors at the specified power pins, minimize loop area, and isolate switching-regulator energy from the core. Confirm that every external I/O voltage is valid for the assigned bank rather than assuming that all 68 I/O pins support the same voltage range.
Assign the 100-pin TQFP footprint from the exact package drawing and pin table rather than from a generic TQFP symbol. Check pin-1 orientation, pin numbering, power pins, configuration pins, and exposed thermal or ground features against the selected manufacturer documentation. A symbol mismatch can create a physically valid but electrically incorrect board, so compare the final PCB library directly with the datasheet drawing.
Review each I/O bank's supported standards, drive strength, slew behavior, and voltage limits before assigning external signals. For high-speed interfaces, use controlled-impedance routing, provide a continuous reference plane, minimize stubs, and place any required series termination close to the driver. Add interface-device hold-up and recovery requirements to system timing analysis, particularly when the FPGA controls a transceiver's enable signal.
Do not substitute a commercial-temperature XC3S50A-4VQG100C for the industrial XC3S50A-4VQG100I without confirming that the complete product environment remains within 0°C to +85°C. Likewise, a -5 speed-grade alternative may change timing characteristics even though it retains the 100-pin footprint. Verify the pin table, I/O limits, timing margin, configuration method, and firmware image compatibility before approving any replacement.
규정 준수 정보
No definitive RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status was identified for the exact MPN. Confirm current declarations with AMD or the authorized supply channel.
