XC6SLX150-2FG676I - 147443-Cell Spartan-6 FPGA | AMD
N.º da peça: XC6SLX150-2FG676I ✓ AtivoXC6SLX150-2FG676I Visão geral
A field-programmable gate array is a semiconductor whose digital logic, memory blocks, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic cells and fixed-function blocks into an application-specific parallel-processing system. This makes the device useful when multiple parallel channels, high-speed interfaces, or programmable control logic must be consolidated into one component.
The XC6SLX150 provides 147,443 logic cells, 498 I/O, and a 45 nm CMOS implementation. Its -2 speed grade supports a middle-performance design point for industrial systems, while its 1.2 V core supply corresponds to the family's stated supply architecture. The 676-pin FCBGA package supports dense PCB routing and is suited to multilayer boards where fine-pitch escape routing and ground-plane continuity require careful layout planning.
Spartan-6 LX devices are designed for configurable embedded systems, industrial control, communications, signal processing, and test equipment. Programmable architecture allows firmware-driven changes to logic behavior, interface timing, and parallel processing pipelines without changing the PCB. The large I/O count also permits simultaneous connections to external converters, memories, transceivers, and control peripherals when board-level pin planning supports the device.
Potential uses include industrial data-acquisition systems, programmable logic controllers, video and image-processing front ends, communications gateways, and embedded control platforms. In these applications, the device can consolidate deterministic parallel logic while dedicated companion processors handle operating-system software, networking, or supervisory functions.
PCB design requires strict attention to the 19 mm by 19 mm package geometry and 0.80 mm ball pitch. Use the AMD Spartan-6 package pinout files to assign every pin, place decoupling and configuration resources close to their associated balls, and preserve a continuous return path beneath high-speed and clock nets. Configuration, power sequencing, and thermal management must be validated against the manufacturer design guidance.
This page combines the device identity, package characteristics, family-level alternatives, comparison parameters, and practical implementation guidance. It helps engineers evaluate the XC6SLX150-2FG676I for dense programmable-logic designs while separating verified device facts from parameters that must be confirmed against the complete manufacturer datasheet.
Alternativas drop-in para XC6SLX150-2FG676I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX150-2FG676I (mesmo formato e footprint) — diferindo em Device Type, Package, Temperature Grade, Speed Grade, Lead-Free Status.
XC6SLX150-1FG676I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX150-3FG676I
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX150-2FG676C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX150-3FG676C
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XC6SLX150-1FG676C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC6SLX150-2FG676I Classificações máximas e características elétricas
| Device Type | Spartan-6 LX Field Programmable Gate Array |
| Logic Cells | 147,443 cells |
| User I/O | 498 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| Encapsulamento | 676-pin FCBGA |
| Package Dimensions | 19 mm x 19 mm |
| Ball Pitch | 0.80 mm |
| Temperature Grade | Industrial grade |
| Lead-Free Status | Lead-free |
| Tipo de montagem | Surface mount |
Guia de Configuração de Pinos do XC6SLX150-2FG676I 19 mm x 19 mm
Configuração de pinos para XC6SLX150-2FG676I (pacote 19 mm x 19 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX150-2FG676I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX150-2FG676I é adequado para 6 aplicaçãos: Industrial Data-Acquisition Systems, Programmable Logic Controllers, Communications Gateways, Video and Image-Processing Front Ends, Embedded Test and Measurement Equipment, Automotive and Robust Embedded Control.
Industrial Data-Acquisition Systems
The XC6SLX150-2FG676I fits multi-channel industrial data-acquisition systems that must sample, filter, timestamp, and route many parallel signals. Its 147,443 logic cells provide substantial capacity for parallel pipelines, while 498 I/O can connect converters, digital sensors, memory, and synchronization circuitry. The -2 speed grade offers a practical performance point when the design must complete timing without relying on the fastest Spartan-6 grade. Place the FPGA close to acquisition circuits to limit trace length, and use the AMD Spartan-6 package pinout files to partition clocks, control signals, and high-speed data across the 676-pin FCBGA.
Recomendado
Programmable Logic Controllers
The XC6SLX150-2FG676I is suitable for industrial programmable logic controllers requiring deterministic parallel execution and extensive I/O. The 147,443 logic cells can support multiple control loops, state machines, protocol engines, and diagnostic routines, while 498 I/O expands connectivity beyond a smaller controller. Its industrial-temperature ordering code supports designs intended for extended environmental operation. Engineers should partition safety-critical logic from communication logic, synchronize external asynchronous inputs, and verify timing against the selected -2 device speed grade. The large FBGA also makes uninterrupted thermal planes and carefully controlled return paths essential to reliable operation.
Recomendado
Communications Gateways
The XC6SLX150-2FG676I can implement protocol conversion, packet buffering, and parallel data routing in communications gateways. Its large logic-cell count supports multiple channels and fixed-function blocks for independently operating interfaces, while 498 I/O provides substantial connectivity to transceivers, memory, and control processors. The -2 speed grade is appropriate when moderate throughput and deterministic timing are sufficient but additional performance margin is unnecessary. Keep high-speed transceiver interfaces on controlled layers, route clocks without stubs, and use the official package assignment files to avoid conflicts among several parallel communication domains.
Recomendado
Video and Image-Processing Front Ends
The XC6SLX150-2FG676I offers enough programmable logic for image preprocessing, pixel routing, timing generation, and parallel sensor-interface handling. The 498-I/O count can accommodate multiple data buses and control signals, while the 147,443-cell device provides considerable parallelism for line buffers and filtering stages. The -2 grade should be selected only after timing analysis confirms that image-path delays meet the frame-rate requirement. For camera or display interfaces, minimize data-bus skew, provide continuous reference planes, and separate noisy switching regions from sensitive inputs to preserve signal integrity.
Recomendado
Embedded Test and Measurement Equipment
The XC6SLX150-2FG676I is well suited to programmable test equipment requiring flexible sequencing, timing generation, and parallel result analysis. Its 147,443 logic cells can host multiple acquisition channels, digital pattern engines, and control logic, while 498 I/O connects instruments, memories, and communication interfaces. The -2 speed grade provides a balance between timing capability and design complexity. For accurate results, use dedicated clock and reset distribution, add test-point access to critical nodes, and validate output timing against the target instrument rather than relying only on nominal device frequency.
Recomendado
Automotive and Robust Embedded Control
The XC6SLX150-2FG676I can support robust embedded control architectures involving parallel logic, local communication, and deterministic I/O. Although it is an FPGA rather than a microcontroller, it can execute fixed control functions independently or complement a processor through a tightly defined hardware interface. The 498 I/O offers room for multiple sensors and actuator drivers, while the industrial-temperature suffix addresses extended operating conditions. Qualification for a specific automotive program must be confirmed separately because the verified device listing does not identify AEC-Q100 qualification. The design should include watchdog behavior, fail-safe outputs, brownout analysis, and thorough environmental verification.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX150-2FG676I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX150-1FG676I | XC6SLX150-3FG676I | XC6SLX150-2FG676C | XC6SLX150-3FG676C | XC6SLX150-1FG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA |
| Logic Cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells |
| User I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -2 | -1 | -3 | -2 | -3 | -1 |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Commercial | Commercial |
| Package Dimensions | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm |
Principais diferenciais
- Provides a balanced -2 speed grade within the Spartan-6 LX performance range (vs XC6SLX150-1FG676I)
- Carries the industrial-temperature ordering designation (vs XC6SLX150-2FG676C)
- Targets the middle -2 performance point rather than the -3 option (vs XC6SLX150-3FG676I)
Notas de projeto
The 676-pin FCBGA has a 0.80 mm ball pitch, so escape routing and power-grid density require deliberate multilayer planning. Follow the official AMD package pinout files for every ball assignment, maintain a continuous ground reference beneath signal paths, and use short connections between decoupling capacitors and power balls. Confirm land pattern, solder-mask definition, paste apertures, and assembly orientation against the manufacturer package drawing before fabrication release.
Plan the 1.2 V core rail as a switched supply with sequencing and ramp control that satisfies the Spartan-6 configuration requirements. Place bulk and high-frequency decoupling at the relevant power-ball groups, minimize loop area, and keep unrelated noisy circuitry away from sensitive supplies. Validate brownout behavior, startup timing, and the configuration sequence because incorrect sequencing can prevent the FPGA from entering a valid operating state.
A large FCBGA needs an intentional thermal strategy rather than isolated thermal vias. Use the manufacturer thermal model to determine copper area, via distribution, airflow, and board construction. Spread heat across the package, maintain uninterrupted ground planes, and avoid concentrating heavy computation in one region unless the design has been analyzed for local temperature gradients. Validate junction temperature with a representative worst-case workload and ambient condition.
The 498-I/O device can create dense simultaneous-switching-output activity, making return-path discontinuity and clock skew major risks. Route high-speed buses and clocks over continuous references, use matched-length techniques where required, and keep configuration and programming signals away from sensitive inputs. Review the design for simultaneous output switching, bus skew, crosstalk, and bank-specific I/O constraints before releasing the layout.
Do not substitute a related XC6SLX150 ordering code solely because its ball count matches. The final characters encode meaningful differences in package, speed grade, and temperature range; using the wrong variant can alter timing, environmental suitability, or procurement requirements. Verify the complete MPN against the schematic, BOM, PCB notes, and assembly drawing, then rerun timing analysis after any speed-grade change.
Informações de conformidade
The verified device listing identifies the package as lead-free. No separate RoHS, REACH, halogen-free, conflict-minerals, or automotive-qualification declaration was established.