XC6SLX150-2FG676I - 147443-Cell Spartan-6 FPGA | AMD
부품 번호: XC6SLX150-2FG676I ✓ 활성XC6SLX150-2FG676I 개요
A field-programmable gate array is a semiconductor whose digital logic, memory blocks, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic cells and fixed-function blocks into an application-specific parallel-processing system. This makes the device useful when multiple parallel channels, high-speed interfaces, or programmable control logic must be consolidated into one component.
The XC6SLX150 provides 147,443 logic cells, 498 I/O, and a 45 nm CMOS implementation. Its -2 speed grade supports a middle-performance design point for industrial systems, while its 1.2 V core supply corresponds to the family's stated supply architecture. The 676-pin FCBGA package supports dense PCB routing and is suited to multilayer boards where fine-pitch escape routing and ground-plane continuity require careful layout planning.
Spartan-6 LX devices are designed for configurable embedded systems, industrial control, communications, signal processing, and test equipment. Programmable architecture allows firmware-driven changes to logic behavior, interface timing, and parallel processing pipelines without changing the PCB. The large I/O count also permits simultaneous connections to external converters, memories, transceivers, and control peripherals when board-level pin planning supports the device.
Potential uses include industrial data-acquisition systems, programmable logic controllers, video and image-processing front ends, communications gateways, and embedded control platforms. In these applications, the device can consolidate deterministic parallel logic while dedicated companion processors handle operating-system software, networking, or supervisory functions.
PCB design requires strict attention to the 19 mm by 19 mm package geometry and 0.80 mm ball pitch. Use the AMD Spartan-6 package pinout files to assign every pin, place decoupling and configuration resources close to their associated balls, and preserve a continuous return path beneath high-speed and clock nets. Configuration, power sequencing, and thermal management must be validated against the manufacturer design guidance.
This page combines the device identity, package characteristics, family-level alternatives, comparison parameters, and practical implementation guidance. It helps engineers evaluate the XC6SLX150-2FG676I for dense programmable-logic designs while separating verified device facts from parameters that must be confirmed against the complete manufacturer datasheet.
드롭인 대체품: XC6SLX150-2FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX150-2FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package, Temperature Grade, Speed Grade, Lead-Free Status.
XC6SLX150-1FG676I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-3FG676I
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX150-2FG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-3FG676C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC6SLX150-1FG676C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-2FG676I 최대 정격 & 전기적 특성
| Device Type | Spartan-6 LX Field Programmable Gate Array |
| Logic Cells | 147,443 cells |
| User I/O | 498 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -2 |
| 패키지 | 676-pin FCBGA |
| Package Dimensions | 19 mm x 19 mm |
| Ball Pitch | 0.80 mm |
| Temperature Grade | Industrial grade |
| Lead-Free Status | Lead-free |
| 실장 유형 | Surface mount |
XC6SLX150-2FG676I 19 mm x 19 mm 핀 구성 가이드
XC6SLX150-2FG676I(19 mm x 19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX150-2FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX150-2FG676I 적합 용도: 6 애플리케이션s: Industrial Data-Acquisition Systems, Programmable Logic Controllers, Communications Gateways, Video and Image-Processing Front Ends, Embedded Test and Measurement Equipment, Automotive and Robust Embedded Control.
Industrial Data-Acquisition Systems
The XC6SLX150-2FG676I fits multi-channel industrial data-acquisition systems that must sample, filter, timestamp, and route many parallel signals. Its 147,443 logic cells provide substantial capacity for parallel pipelines, while 498 I/O can connect converters, digital sensors, memory, and synchronization circuitry. The -2 speed grade offers a practical performance point when the design must complete timing without relying on the fastest Spartan-6 grade. Place the FPGA close to acquisition circuits to limit trace length, and use the AMD Spartan-6 package pinout files to partition clocks, control signals, and high-speed data across the 676-pin FCBGA.
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Programmable Logic Controllers
The XC6SLX150-2FG676I is suitable for industrial programmable logic controllers requiring deterministic parallel execution and extensive I/O. The 147,443 logic cells can support multiple control loops, state machines, protocol engines, and diagnostic routines, while 498 I/O expands connectivity beyond a smaller controller. Its industrial-temperature ordering code supports designs intended for extended environmental operation. Engineers should partition safety-critical logic from communication logic, synchronize external asynchronous inputs, and verify timing against the selected -2 device speed grade. The large FBGA also makes uninterrupted thermal planes and carefully controlled return paths essential to reliable operation.
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Communications Gateways
The XC6SLX150-2FG676I can implement protocol conversion, packet buffering, and parallel data routing in communications gateways. Its large logic-cell count supports multiple channels and fixed-function blocks for independently operating interfaces, while 498 I/O provides substantial connectivity to transceivers, memory, and control processors. The -2 speed grade is appropriate when moderate throughput and deterministic timing are sufficient but additional performance margin is unnecessary. Keep high-speed transceiver interfaces on controlled layers, route clocks without stubs, and use the official package assignment files to avoid conflicts among several parallel communication domains.
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Video and Image-Processing Front Ends
The XC6SLX150-2FG676I offers enough programmable logic for image preprocessing, pixel routing, timing generation, and parallel sensor-interface handling. The 498-I/O count can accommodate multiple data buses and control signals, while the 147,443-cell device provides considerable parallelism for line buffers and filtering stages. The -2 grade should be selected only after timing analysis confirms that image-path delays meet the frame-rate requirement. For camera or display interfaces, minimize data-bus skew, provide continuous reference planes, and separate noisy switching regions from sensitive inputs to preserve signal integrity.
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Embedded Test and Measurement Equipment
The XC6SLX150-2FG676I is well suited to programmable test equipment requiring flexible sequencing, timing generation, and parallel result analysis. Its 147,443 logic cells can host multiple acquisition channels, digital pattern engines, and control logic, while 498 I/O connects instruments, memories, and communication interfaces. The -2 speed grade provides a balance between timing capability and design complexity. For accurate results, use dedicated clock and reset distribution, add test-point access to critical nodes, and validate output timing against the target instrument rather than relying only on nominal device frequency.
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Automotive and Robust Embedded Control
The XC6SLX150-2FG676I can support robust embedded control architectures involving parallel logic, local communication, and deterministic I/O. Although it is an FPGA rather than a microcontroller, it can execute fixed control functions independently or complement a processor through a tightly defined hardware interface. The 498 I/O offers room for multiple sensors and actuator drivers, while the industrial-temperature suffix addresses extended operating conditions. Qualification for a specific automotive program must be confirmed separately because the verified device listing does not identify AEC-Q100 qualification. The design should include watchdog behavior, fail-safe outputs, brownout analysis, and thorough environmental verification.
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추천 제품 요약
엔지니어링 참조 데이터: XC6SLX150-2FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX150-1FG676I | XC6SLX150-3FG676I | XC6SLX150-2FG676C | XC6SLX150-3FG676C | XC6SLX150-1FG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA |
| Logic Cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells |
| User I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O | 498 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -2 | -1 | -3 | -2 | -3 | -1 |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Commercial | Commercial |
| Package Dimensions | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm | 19 mm x 19 mm |
주요 차별점
- Provides a balanced -2 speed grade within the Spartan-6 LX performance range (vs XC6SLX150-1FG676I)
- Carries the industrial-temperature ordering designation (vs XC6SLX150-2FG676C)
- Targets the middle -2 performance point rather than the -3 option (vs XC6SLX150-3FG676I)
설계 노트
The 676-pin FCBGA has a 0.80 mm ball pitch, so escape routing and power-grid density require deliberate multilayer planning. Follow the official AMD package pinout files for every ball assignment, maintain a continuous ground reference beneath signal paths, and use short connections between decoupling capacitors and power balls. Confirm land pattern, solder-mask definition, paste apertures, and assembly orientation against the manufacturer package drawing before fabrication release.
Plan the 1.2 V core rail as a switched supply with sequencing and ramp control that satisfies the Spartan-6 configuration requirements. Place bulk and high-frequency decoupling at the relevant power-ball groups, minimize loop area, and keep unrelated noisy circuitry away from sensitive supplies. Validate brownout behavior, startup timing, and the configuration sequence because incorrect sequencing can prevent the FPGA from entering a valid operating state.
A large FCBGA needs an intentional thermal strategy rather than isolated thermal vias. Use the manufacturer thermal model to determine copper area, via distribution, airflow, and board construction. Spread heat across the package, maintain uninterrupted ground planes, and avoid concentrating heavy computation in one region unless the design has been analyzed for local temperature gradients. Validate junction temperature with a representative worst-case workload and ambient condition.
The 498-I/O device can create dense simultaneous-switching-output activity, making return-path discontinuity and clock skew major risks. Route high-speed buses and clocks over continuous references, use matched-length techniques where required, and keep configuration and programming signals away from sensitive inputs. Review the design for simultaneous output switching, bus skew, crosstalk, and bank-specific I/O constraints before releasing the layout.
Do not substitute a related XC6SLX150 ordering code solely because its ball count matches. The final characters encode meaningful differences in package, speed grade, and temperature range; using the wrong variant can alter timing, environmental suitability, or procurement requirements. Verify the complete MPN against the schematic, BOM, PCB notes, and assembly drawing, then rerun timing analysis after any speed-grade change.
규정 준수 정보
The verified device listing identifies the package as lead-free. No separate RoHS, REACH, halogen-free, conflict-minerals, or automotive-qualification declaration was established.