XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD
N.º da peça: XC6SLX45-N3FG484I ✗ Fim de vidaXC6SLX45-N3FG484I Visão geral
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks with programmable interconnect and block RAM into a flexible parallel-processing engine. The Spartan-6 LX family targets cost-sensitive systems requiring substantial logic density, deterministic parallel operation, and flexible post-build configuration.
The XC6SLX45-N3FG484I provides 43,661 logic cells, 3,411 configurable logic blocks, and 316 I/O in one compact 484-BBGA package. The -3 device designation identifies its performance grade within the Spartan-6 LX family, while the industrial temperature qualification supports operation from -40°C to +100°C. These characteristics make the device useful where many parallel data paths must execute in real time rather than sequentially.
Its architecture can combine configurable logic blocks, block RAM, dedicated digital signal processing resources, and programmable I/O to implement control logic, packet processing, signal acquisition, image processing, and embedded communication systems. The 316 available I/O support interfaces to external memory and peripheral devices, while the 484-ball package supports dense board routing. As an FPGA, the device allows configuration changes to be applied to the same hardware platform when system requirements evolve.
Typical applications include industrial control, networking equipment, test and measurement instrumentation, video and image processing, communications infrastructure, and embedded signal-processing platforms. Designs that benefit from parallel architecture can distribute sampling, filtering, protocol handling, and data transformation across multiple logic paths. The device is particularly appropriate for compact systems requiring high I/O density and substantial programmable logic in one package.
PCB design requires careful BGA layout, layer-stack planning, decoupling, and power-distribution design. Use the AMD Spartan-6 package device pinout files when assigning every ball, and follow the manufacturer's power, configuration, and decoupling recommendations. Thermal performance and signal integrity depend strongly on the PCB stackup, copper density, via strategy, trace lengths, and external memory topology used around the FPGA.
This product page brings together the device identity, electrical and physical characteristics, qualified same-footprint alternatives, comparison parameters, application guidance, and practical PCB considerations. It supports faster engineering review while directing critical pin assignment and configuration decisions to the official AMD documentation and package files.
Alternativas drop-in para XC6SLX45-N3FG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX45-N3FG484I (mesmo formato e footprint) — diferindo em Package, Logic Cells, Block RAM, Family, Operating Temperature.
XC6SLX45-2FGG484I
✅ Drop-InConsulte o preço
Ver ficha técnica →XC6SLX45-3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX45T-2FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX45T-N3FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX45-2FGG484C
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XC6SLX45-N3FG484I Classificações máximas e características elétricas
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 logic cells |
| Configurable Logic Blocks | 3,411 CLBs |
| User I/O | 316 I/O |
| Encapsulamento | 484-BBGA |
| Total Terminals | 484 terminals |
| Terminal Pitch | 1.00 mm |
| Temperatura de operação | -40°C to +100°C |
| Temperature Grade | Industrial |
| Estilo de montagem | Surface Mount |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Technology | CMOS |
| Frequência máxima de clock | 806 MHz |
| Status do ciclo de vida | Obsolete |
| Packaging | Tray |
| Status RoHS | RoHS non-compliant |
Guia de Configuração de Pinos do XC6SLX45-N3FG484I square
Configuração de pinos para XC6SLX45-N3FG484I (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX45-N3FG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX45-N3FG484I é adequado para 6 aplicaçãos: Industrial Control and Automation, Industrial Networking Equipment, Video and Image Processing, Test and Measurement Instrumentation, Communications and Signal Processing, Aerospace and Defense Test Systems.
Industrial Control and Automation
The AMD XC6SLX45-N3FG484I fits industrial controllers that combine sensor acquisition, deterministic control logic, machine communication, and safety-adjacent monitoring in one programmable device. Its 3,411 configurable logic blocks and 43,661 logic cells provide substantial parallel capacity, while 316 I/O can connect sensors, actuators, field buses, and status indicators. The -40°C to +100°C industrial temperature range supports uncontrolled equipment environments better than a commercial-temperature alternative. Place the FPGA near the field-interface circuitry, use the AMD pinout files for every ball assignment, and provide local decoupling and carefully filtered clocking. The main replacement consideration is timing: an XC6SLX45-2FGG484I candidate uses a slower speed grade and should be adopted only after timing analysis confirms adequate margin.
Recomendado
Industrial Networking Equipment
The XC6SLX45-N3FG484I is suitable for network appliances that perform packet classification, buffering, protocol conversion, and traffic shaping in parallel. Its 316 I/O and 43,661 logic cells allow multiple data-processing paths to operate concurrently, while block-level programmable logic can support deterministic interfaces and high-throughput data movement. The industrial temperature range fits factory-edge switches, gateways, and control-network equipment operating between -40°C and +100°C. A board implementation should reserve clean clock resources, follow the manufacturer's decoupling and power-distribution guidance, and use the official Spartan-6 package files to distinguish supply, ground, configuration, and general-purpose balls. Because the exact MPN is obsolete, a same-footprint Spartan-6 LX option can ease continuity planning, but speed-grade changes require fresh static timing analysis.
Recomendado
Video and Image Processing
The AMD XC6SLX45-N3FG484I can implement parallel pixel pipelines, color conversion, filtering, thresholding, and frame-timing logic in programmable hardware. Its 43,661 logic cells provide substantially more parallel capacity than a small microcontroller, allowing multiple rows or pixel lanes to be processed concurrently while reducing dependence on a host processor. The 316 I/O support connections to image sensors, capture devices, displays, and external memory, while the 484-BBGA package supports dense fanout on multilayer boards. Signal integrity is critical: route high-speed memory and interface signals with controlled impedance, avoid unnecessary stubs, and follow AMD's BGA escape and decoupling guidance. The -3 speed grade supports timing-sensitive pipelines, while a -2 replacement should be selected only after confirming that pixel-clock and memory-interface timing remain comfortably within specification.
Recomendado
Test and Measurement Instrumentation
The XC6SLX45-N3FG484I is well suited to acquisition, timing, waveform-processing, and instrument-control logic because parallel FPGA resources can sample and transform multiple channels concurrently. Its 316 I/O can support digital triggers, status buses, control interfaces, and external test-data paths, while the -40°C to +100°C range supports industrial bench and rack equipment. A practical instrument design should separate sensitive analog inputs from the FPGA, use clocking with controlled jitter and fanout, and provide a stable configuration path for repeatable instrument startup. The 484-BBGA footprint also requires careful power-plane segmentation because high-speed switching and sensitive clock distribution share the same substrate. For lifecycle transitions, the same-family XC6SLX45-3FGG484I can preserve the -3 performance class, but pin names, configuration compatibility, and timing reports must be reconciled before release.
Recomendado
Communications and Signal Processing
The AMD XC6SLX45-N3FG484I can implement digital filtering, modulation, demodulation, packet handling, and interface conversion as parallel pipelines. Its large configurable logic capacity supports concurrent channels and fixed-function logic that would otherwise require several programmable devices, while 316 I/O provide connectivity to transceivers, memory, and control processors. The -3 speed designation is relevant when clock rates, pipeline delays, and I/O timing leave limited margin, although actual performance still depends on design and device timing constraints. Layout should keep clock and sensitive data routes short, maintain continuous return paths, and avoid routing high-speed signals across power-plane splits. A same-footprint XC6SLX45-2FGG484I alternative may simplify obsolete-part continuity, but it should enter the design only after post-route timing analysis confirms that the lower speed grade does not alter system throughput.
Recomendado
Aerospace and Defense Test Systems
The XC6SLX45-N3FG484I can support compact ground-support, data-acquisition, communications, and simulation systems where programmable parallel logic and high I/O density are valuable. Its industrial temperature range of -40°C to +100°C supports many controlled equipment environments, although aerospace deployment requires system-level environmental and qualification assessment beyond the component rating. The 316 I/O can serve acquisition channels, trigger interfaces, memory connections, and control links, while 43,661 logic cells permit concurrent processing of test vectors and telemetry. Engineers should use the official AMD package files, preserve configuration integrity, and design the PCB for controlled impedance, low-noise power distribution, and dependable thermal performance. Any lifecycle replacement must be reviewed for application, reliability, and qualification requirements rather than treated solely as a footprint-compatible substitution.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX45-N3FG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX45-2FGG484I | XC6SLX45-3FGG484I | XC6SLX45T-2FGG484I | XC6SLX45T-N3FGG484I | XC6SLX45-2FGG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Series | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX T | Spartan-6 LX T | Spartan-6 LX |
| Speed Designation | N3 | -2 | -3 | -2 | N3 | -2 |
| Logic Cells | 43,661 logic cells | 43,661 logic cells | 43,661 logic cells | 43,661 logic cells | 43,661 logic cells | 43,661 logic cells |
| Configurable Logic Blocks | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs | 3,411 CLBs |
| User I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O |
| Technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Principais diferenciais
- Retains the N3 performance designation (vs XC6SLX45-2FGG484I)
- Industrial operating-temperature classification (vs XC6SLX45-2FGG484C)
- Full Spartan-6 LX logic capacity with 316 I/O (vs XC6SLX45T-N3FGG484I)
Notas de projeto
Use AMD's Spartan-6 package device pinout files as the authoritative source for all 484 ball assignments. Plan escape routing according to the selected PCB stackup, preserve BGA pad-to-via geometry symmetry, and place local decoupling capacitors at the associated supply balls. Keep configuration pins and their supporting pull components away from high-speed routing zones. The component's 1.00 mm terminal pitch makes manufacturing capability, solder-mask definition, and pad registration important parts of the board qualification.
Separate sensitive clock distribution from high-current switching paths and provide continuous reference planes beneath controlled-impedance interfaces. Use short, symmetric routes for memory and high-speed I/O, control via stitching where appropriate, and avoid vias or plane transitions in timing-critical paths. Validate the escape topology with the PCB fabrication capability and the device pinout file before releasing the layout. A mechanically valid BGA footprint is not sufficient if ball names, power grouping, or configuration functions are assigned incorrectly.
Do not treat all XC6SLX45 484-ball devices as automatic replacements. A -2 speed candidate may alter achievable timing even though it shares the Spartan-6 LX architecture and package class, while commercial-temperature options may not meet an industrial environmental requirement. Before substitution, compare the exact speed, temperature, package, device-marking, configuration, and qualification requirements, then rerun synthesis, place-and-route, and static timing analysis. Preserve a formal equivalence record for production traceability.
Implement the supply rails as a low-impedance distribution network with adequate plane or polygon area and local bulk and high-frequency decoupling. Keep the regulator and power-conversion circuitry away from high-speed clock and data return paths to minimize coupling. Because the exact core and I/O voltage values are not stated in the product record, use the AMD datasheet for the selected speed and temperature option when setting voltage tolerances, power sequencing, and ramp requirements. Avoid substituting supply limits from a different family member without checking the official electrical tables.
Informações de conformidade
The product record identifies the XC6SLX45-N3FG484I as RoHS non-compliant. No explicit REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status is stated for this MPN. AEC-Q100 is marked not applicable because the FPGA is not identified as an automotive-qualified device.