XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
N.º da peça: XC6SLX75-2FG676I ✗ Fim de vida| Qtd. | Preço unitário | Total |
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XC6SLX75-2FG676I Visão geral
A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing.
The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint.
The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification.
Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance.
A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.
Alternativas drop-in para XC6SLX75-2FG676I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX75-2FG676I (mesmo formato e footprint) — diferindo em Device Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX75-2FGG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3FG676I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →XC6SLX75T-2FG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75T-2FGG676C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75T-3FGG676C
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XC6SLX75-2FG676I Classificações máximas e características elétricas
| Device Type | FPGA |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Stated Internal Frequency | 667 MHz |
| Maximum Inputs or Outputs | 400 I/O |
| Encapsulamento | 676-BGA |
| Reported Package Dimensions | 23 mm x 23 mm |
| Reported Package Pitch | 1 mm |
| Temperature Designation | I (industrial) |
| Temperatura de operação | 0 C to 85 C; conflicting source also reports -40 C to 100 C |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Programmable Architecture | Field-configurable digital logic |
| Tipo de montagem | Surface mount |
| Manufacturer | AMD / Xilinx |
| Status RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | unknown |
Guia de Configuração de Pinos do XC6SLX75-2FG676I 1 mm
Configuração de pinos para XC6SLX75-2FG676I (pacote 1 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX75-2FG676I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX75-2FG676I é adequado para 6 aplicaçãos: Industrial Control and Automation, Data Acquisition and Instrumentation, Communications Gateway, Digital Signal Processing, Test and Measurement, Embedded Video Processing.
Industrial Control and Automation
The XC6SLX75-2FG676I fits parallel machine-control logic because its Spartan-6 LX device provides 74,637 logic cells and a reported 5,831 configurable logic blocks for state machines, sequencing, and interface arbitration. The stated 667 MHz internal frequency supports demanding control fabrics, while the 676-BGA listing offers a high ball count for digital I/O. In a controller, the FPGA can combine encoder processing, motion sequencing, fault logic, and communications without relying on a single microcontroller. The principal design trade-off is package complexity: a 676-BGA layout requires fine-pitch assembly, escape routing, and careful power delivery. Engineers should validate exact I/O assignments, speed grade, temperature grade, and timing closure with AMD documentation before layout release.
Recomendado
Data Acquisition and Instrumentation
The XC6SLX75-2FG676I is suitable for parallel data-acquisition pipelines that require simultaneous sampling logic, digital filtering, buffering, and control in one FPGA. Its reported 74,637 logic cells can host acquisition state machines and preprocessing, while the stated 667 MHz internal frequency provides timing headroom for pipelined digital operations. The large 676-BGA package can expose many parallel converter, memory, and trigger signals. Compared with a processor-only approach, parallel FPGA logic can maintain predictable throughput and deterministic latency. However, converter interface voltage, clock jitter, pin assignment, and acquisition timing must be verified from the complete device documentation. Signal-integrity layout, isolated clocking, and controlled impedance are as important as raw logic capacity.
Recomendado
Communications Gateway
The Spartan-6 LX XC6SLX75-2FG676I can serve as the protocol and packet-processing fabric in a communications gateway because its reported 74,637 logic cells support parallel framing, FIFO management, checksums, and interface bridging. The stated 667 MHz internal frequency is relevant to wide synchronous data paths, and the high-pin-count package offers more connectivity than a small FPGA. A practical design could place an Ethernet physical-layer interface beside the FPGA and map receive, transmit, and management logic into deterministic parallel pipelines. Verification must include protocol timing, clock-domain crossings, buffer depth, and bitstream support. The trade-off is that software-managed flexibility is lower than on a microprocessor, so firmware-style development is less suitable for rapidly changing network stacks.
Recomendado
Digital Signal Processing
The XC6SLX75-2FG676I is appropriate for fixed-latency digital signal processing when filters, transforms, modulation, or channelization benefit from parallel implementation. The verified device data reports 74,637 logic cells and a 667 MHz stated internal frequency, enabling pipelined arithmetic and wide parallel buses. Designers can distribute DSP stages across the FPGA, use pipelining for clock-rate management, and connect the result directly to converters or memory interfaces. The stated 1.2 V core value identifies the process family but does not provide total design power. Actual throughput and resource utilization must be obtained from synthesis and implementation reports. Clock uncertainty, DSP-to-routing congestion, memory bandwidth, and thermal margins should be evaluated before hardware sign-off.
Recomendado
Test and Measurement
The XC6SLX75-2FG676I can implement deterministic pattern generation, timing control, capture logic, and analysis pipelines for test and measurement equipment. Its reported 74,637 logic cells allow multiple parallel channels to be handled in hardware, while the stated 667 MHz internal frequency supports tightly timed digital sequences. The 676-BGA package provides a high connection count for instruments that combine acquisition, stimulus, and trigger functions. For laboratory-grade performance, clock distribution, jitter, analog front-end isolation, calibration, and deterministic I/O timing are critical. FPGA power also depends on utilization and I/O switching, so thermal design should be based on post-implementation estimates rather than the 1.2 V core value alone.
Recomendado
Embedded Video Processing
The XC6SLX75-2FG676I can support embedded image pipelines that require parallel pixel movement, thresholding, filtering, or interface timing. The reported 74,637 logic cells provide substantial parallel capacity, and the stated 667 MHz internal frequency can support synchronous video-clock domains when timing margins permit. A practical design could include a camera-interface bridge, line buffer control, region processing, and a display or memory output stage. The 676-BGA package offers many I/O for external memory and converters, but source data conflicts on the exact reported I/O count, so engineers must use the official package files. Practical constraints include external memory bandwidth, pixel-clock uncertainty, power consumption, and placement of high-speed interfaces on the BGA perimeter.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX75-2FG676I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX75-2FGG676I | XC6SLX75-3FG676I | XC6SLX75T-2FG676I | XC6SLX75T-2FGG676C | XC6SLX75T-3FGG676C |
|---|---|---|---|---|---|---|
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Package | 676-BGA | 676-BGA | 676-BGA | 676-FBGA | 676-FBGA | 676-FBGA |
| Speed Grade | -2 | -2 | -3, described as higher performance | -2 | -2 | -3 |
| Temperature Suffix | I, industrial | I, industrial | I, industrial | I, industrial | C, commercial | C, commercial |
Principais diferenciais
- Target uses the -2 speed grade rather than the faster -3 ordering (vs XC6SLX75-3FG676I)
- Industrial I temperature suffix (vs XC6SLX75T-2FGG676C)
- Direct listing identifies a 676-BGA package (vs XC6SLX75T-2FG676I)
Notas de projeto
Do not release the 676-BGA footprint from distributor snippets alone. One verified secondary source labels the target FBGA-484, while DigiKey and Mouser identify 676-BGA. Download the official AMD Spartan-6 package pinout file, compare every ball location and package outline, and have the layout reviewed for power, ground, configuration pins, clock inputs, and high-speed escape routing before fabrication.
Design the power tree from the exact Spartan-6 power and ground pins in the official package file rather than from the reported 1.2 V core value alone. Decouple each supply group according to AMD recommendations, use multiple power and ground connections, and provide distribution appropriate for a 676-BGA device. Validate voltage sequencing, startup current, I/O supply requirements, and power-supply tolerance using the selected device documentation.
Route configuration, JTAG, clocks, and any memory or transceiver interfaces as constrained signals from the beginning of schematic capture. Use the official package pinout and AMD timing data to identify high-speed pins, preserve clock jitter margin, and apply length matching only to interfaces that require it. Complete post-route static timing and signal-integrity simulation before programming production hardware.
FPGA power depends on the implemented design rather than device name alone. After implementation, review utilization, toggle activity, clock frequency, RAM, DSP, and I/O estimates to identify hot paths. Use the board stackup, copper planes, vias, airflow, and ambient conditions in a thermal assessment. Do not substitute the reported 1.2 V core voltage for a measured or vendor-supported junction-temperature limit.
The most immediate risk is ordering or footprint confusion between non-G FG676, G FGG676, T-device, speed-grade, and temperature-suffix variants. Create a controlled BOM entry using the exact manufacturer ordering code, then validate pin compatibility, resource compatibility, timing, temperature, and bitstream behavior. A shared package name alone does not prove that all five listed alternatives are safe drop-ins for an already released PCB.
Informações de conformidade
The supplied verified data does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for this orderable MPN.
