XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
N.º da peça: XC6SLX75-3FG676C ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
XC6SLX75-3FG676C Visão geral
A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream.
The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation.
Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation.
The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet.
This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.
Alternativas drop-in para XC6SLX75-3FG676C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC6SLX75-3FG676C (mesmo formato e footprint) — diferindo em Ball Pitch, Device Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC6SLX75-3FGG676C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3FG676I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →XC6SLX75T-3FG676C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-N3FGG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX100-3FGG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC6SLX75-3FG676C Classificações máximas e características elétricas
| Device Type | FPGA |
| Device Family | Spartan-6 LX |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Internal Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Speed Grade | -3 |
| Temperatura de operação | 0°C to 85°C (32°F to 185°F) |
| Package Type | 676-BGA |
| Package Description | FBGA-676 |
| Package Dimensions | 27 mm × 27 mm |
| Ball Pitch | 1.0 mm |
| Terminal Count | 676 terminals |
| Package Family | FBGA |
| Tipo de montagem | Surface mount |
Guia de Configuração de Pinos do XC6SLX75-3FG676C fbga
Configuração de pinos para XC6SLX75-3FG676C (pacote fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC6SLX75-3FG676C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC6SLX75-3FG676C é adequado para 6 aplicaçãos: Industrial Automation Controllers, Automotive Infotainment Bridging, Communication Interface Aggregation, Video and Display Processing, Embedded Data Acquisition, Consumer and Industrial Bridging.
Industrial Automation Controllers
The XC6SLX75-3FG676C fits industrial automation controllers that combine sequential logic, communication interfaces, and parallel control functions in one programmable device. Its 74,637 logic cells and 5,831 CLBs provide substantial capacity for motion sequencing, interlocks, data acquisition front ends, and supervisory control. The listed 667 MHz internal frequency supports demanding control architectures, while the -3 grade is described as the highest-performance Spartan-6 LX speed grade. Designers must confirm actual clocking resources, I/O voltage domains, timing margins, and industrial EMC requirements before production release.
Recomendado
Automotive Infotainment Bridging
The XC6SLX75-3FG676C is a candidate for automotive infotainment bridging systems that require programmable protocol conversion, display timing, control logic, and interface aggregation. The supplied Spartan-6 family description specifically identifies automotive infotainment and advanced bridging as application areas, and the device supplies 74,637 logic cells in a 676-ball FBGA package. Its commercial 0°C to 85°C range and lack of a verified automotive qualification claim in the supplied data mean that deployment requires separate environmental, EMC, functional-safety, and lifecycle qualification.
Recomendado
Communication Interface Aggregation
The XC6SLX75-3FG676C can be used to aggregate multiple communication interfaces when a system needs programmable framing, buffering, protocol conversion, and control alongside external transceivers. The large 676-ball package provides substantial physical I/O capability compared with a lower-pin-count FPGA, while the Spartan-6 LX logic fabric can implement protocol state machines and data-path control. The design should reserve timing margin for clock-domain crossings, use board-level differential-pair discipline, and verify supported I/O standards against the manufacturer datasheet.
Recomendado
Video and Display Processing
The XC6SLX75-3FG676C is suitable for embedded video timing, pixel-format conversion, control, or interface logic where programmable parallelism is valuable. Its 74,637 logic cells and 5,831 CLBs can support timing generators, overlays, scalers, and synchronization logic, while the high-pin-count FBGA package facilitates connections to external memory or display devices. Actual video throughput depends on the selected Spartan-6 memory resources, I/O standards, clocking architecture, and board-level signal integrity, which are not fully quantified in the supplied data.
Recomendado
Embedded Data Acquisition
The XC6SLX75-3FG676C can implement acquisition control, digital filtering, timestamping, and data packing around external analog-to-digital converters. Its programmable logic density allows sensor channels to be combined with calibration tables, buffer management, and communication framing in a single FPGA. The -3 speed grade is relevant for timing-sensitive parallel interfaces, but the final sample rate must be calculated from the selected clock, I/O timing, external converter latency, and PCB channel skew. Use the official pinout and I/O specifications before assigning converter data pins.
Recomendado
Consumer and Industrial Bridging
The XC6SLX75-3FG676C is appropriate for high-volume bridging products that require flexible logic, interface adaptation, and post-manufacture configuration changes. The Spartan-6 LX family is described in the supplied material as offering system integration for high-volume applications, and the device provides 74,637 logic cells in a 676-ball package. It can consolidate protocol converters, control logic, and timing blocks, reducing the need for separate programmable devices. The 1.0 mm FBGA pitch requires fine-line PCB capability, and production designs should include configuration storage, clock jitter analysis, and thermal validation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC6SLX75-3FG676C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC6SLX75-3FGG676C | XC6SLX75-3FG676I | XC6SLX75T-3FG676C | XC6SLX75-N3FGG676I | XC6SLX100-3FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -3 | -3 | -3 | -3 | -N3 | -3 |
| Application Class | Spartan-6 LX programmable logic | Spartan-6 LX programmable logic | Spartan-6 LX programmable logic | Spartan-6 LX programmable logic | Spartan-6 LX programmable logic | Higher-density Spartan-6 LX programmable logic |
Principais diferenciais
- High programmable-logic capacity for a 676-ball FPGA (vs XC6SLX75-3FGG676C)
- Higher-density alternative available in the same package family (vs XC6SLX100-3FGG676I)
- Commercial temperature designation in the verified listing (vs XC6SLX75-3FG676I)
Notas de projeto
Estimated: the listed package uses a 1.0 mm ball pitch and approximately 27 mm by 27 mm dimensions. Treat this as a fine-pitch FBGA layout problem: use a manufacturer-approved land pattern, preserve ball-to-ball clearances, provide adequate escape routing for power and configuration signals, and validate every layer transition with the PCB fabricator. Do not substitute a generic BGA footprint.
Do not assign the XC6SLX75-3FG676C supply rails from the abbreviated distributor listings alone. The verified data does not include the complete power-pin table or voltage limits. Before schematic capture, obtain the official Spartan-6 LX data sheet and separate core, auxiliary, I/O, and configuration supplies exactly as specified by AMD, including sequencing, decoupling, and power-up requirements.
Use short, continuous clock paths and isolate noisy switching or conversion paths from precision external interfaces. For high-speed fabric or memory connections, use the manufacturer’s recommended I/O standards, controlled-impedance routing, and timing constraints. Because the supplied data does not quantify I/O standards or edge rates, the final constraints must be generated from the verified device data and the selected FPGA clocking architecture.
Estimated: actual FPGA power depends on utilized logic, I/O activity, configuration method, core voltage, and ambient temperature, so a numerical power figure cannot be derived from the supplied data. Build a thermal budget using the vendor power estimator for the actual bitstream and worst-case I/O activity. A 676-ball FBGA can be thermally capable, but package performance still depends on PCB copper, via structures, airflow, and the device’s operating mode.
Do not treat an MPN with a similar 676-BGA package as automatically interchangeable. The suffix may encode speed grade, temperature grade, lead finish, configuration, or ordering identity. Verify the exact package drawing, pin table, configuration pins, electrical limits, clock resources, and timing grade before approving XC6SLX75-3FGG676C or any other listed candidate as a drop-in replacement.
Informações de conformidade
The supplied data identifies the Spartan-6 LX family and automotive infotainment as an application context, but it does not provide verified compliance statements for this exact ordering code. Compliance must be confirmed from the current manufacturer product documentation or supplier records.
