XC7A12T-3CPG238E - -3 Speed Grade Artix-7 FPGA | Xilinx
N.º da peça: XC7A12T-3CPG238E ✓ AtivoXC7A12T-3CPG238E Visão geral
An FPGA is a semiconductor whose digital logic, interconnect, and configurable I/O blocks are programmed after manufacture. Artix-7 devices belong to the broader FPGA and programmable-logic hierarchy, combining configurable logic, block RAM, DSP resources, and programmable I/O in one package. This makes the XC7A12T-3CPG238E suitable for embedded systems that need hardware-level parallelism and design flexibility without the resource level of a larger FPGA.
The catalog listing identifies 12,800 logic cells, 112 I/O, 238 terminals, and a -3 device speed designation. Its square LFBGA package places the device in the CSBGA-238 package family, providing a dense PCB land pattern suitable for compact industrial, communications, instrumentation, and embedded-control equipment. The part is also identified as RoHS compliant by its assembly listing.
The XC7A12T-3CPG238E shares the XC7A12T device designation and 238-ball package with speed-grade and temperature-grade variants. This common mechanical and logical basis supports simplified product-family planning, although a migration must still account for timing closure, junction-temperature limits, power characteristics, configuration compatibility, and the exact ordering code. The AMD Artix-7 package pinout files should be used to validate every PCB connection before fabrication.
Typical uses include industrial data acquisition, camera and image-processing pipelines, communications interfaces, embedded control, test equipment, and sensor-processing systems. The -3 speed grade is appropriate when timing performance is a principal selection factor. Designers should define clock constraints, pin assignments, power rails, and configuration requirements early in the schematic and PCB-layout process.
PCB implementation requires careful power-plane distribution, decoupling, and escape-routing strategy for the 238-ball BGA. Use the manufacturer package drawing and pinout files for land patterns, ball assignments, thermal-pad treatment, and assembly constraints. Because fine-pitch BGA assembly can hide shorts and opens, inspection methods and soldering profile must match the package requirements.
This product record combines package, logic-resource, ordering-code, and lifecycle information with same-package family comparisons and practical implementation guidance. It also distinguishes mechanical compatibility from timing-grade and environmental differences, helping engineers select a replacement without overlooking the constraints that determine production suitability.
Alternativas drop-in para XC7A12T-3CPG238E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7A12T-3CPG238E (mesmo formato e footprint) — diferindo em Device Type, Logic Cells, Package, Process Technology, Speed Grade.
XC7A12T-2CPG238C
✅ Drop-InConsulte o preço
Ver ficha técnica →XC7A12T-1CPG238C
✅ Drop-InConsulte o preço
Ver ficha técnica →XC7A12T-1CPG238I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7A12T-2CPG238I
✅ Drop-InConsulte o preço
Ver ficha técnica →XC7A12T-L2CPG238E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7A12T-3CPG238E Classificações máximas e características elétricas
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cell Count | 12,800 cells |
| I/O Count | 112 I/O |
| Speed Grade | -3 |
| Encapsulamento | 238-ball LFBGA, CSBGA-238 |
| Terminal Count | 238 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| Tipo de montagem | Surface-mount BGA |
| Programmable Logic Type | FPGA |
| Status RoHS | Compliant |
| Product Series | Artix-7 |
| Device Designation | XC7A12T |
Guia de Configuração de Pinos do XC7A12T-3CPG238E square
Configuração de pinos para XC7A12T-3CPG238E (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC7A12T-3CPG238E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC7A12T-3CPG238E é adequado para 6 aplicaçãos: Industrial Data Acquisition, Industrial Sensor Networking, Communications Interface, Camera and Image Preprocessing, Test and Measurement, Embedded Control Platform.
Industrial Data Acquisition
The XC7A12T-3CPG238E fits compact industrial acquisition systems that must combine parallel sensor interfaces, control logic, and protocol handling in a single programmable device. Its 12,800 logic cells provide capacity for control paths, acquisition sequencing, status logging, and interface translation, while 112 I/O simplify connections to external converters and sensors. The -3 speed designation is useful when acquisition pipelines require tighter timing margins. Place the device in a multilayer PCB with short point-to-point routing, use the official 238-ball land pattern, and keep high-current switching nodes away from sensitive input and clock nets.
Recomendado
Industrial Sensor Networking
The XC7A12T-3CPG238E can support distributed sensor nodes that require deterministic parallel sensing, local filtering, and communications framing. The FPGA's 12,800 logic cells allow engineers to implement acquisition control, threshold logic, data packing, and interface-specific state machines concurrently. Its 112 I/O provide dedicated resources for sensors, interrupts, and communications, while the -3 grade supports timing-sensitive processing. For industrial deployment, review the exact E-grade temperature limits, isolate noisy actuator drivers, provide local decoupling at supply balls, and verify the complete design against the 238-ball package constraints.
Recomendado
Communications Interface
The XC7A12T-3CPG238E is suitable for protocol converters and communications front ends that benefit from programmable parallel data paths. Its 12,800 logic cells can support framing, CRC generation, channel alignment, buffering, and supervisory logic, while 112 I/O allow high-throughput source-synchronous interfaces. The -3 speed designation helps preserve margin in clocked datapaths. Engineers should use the manufacturer package pinout to select clock-capable and regular I/O pins, keep input and output timing constraints synchronized, and route clocks with controlled return paths to minimize data corruption and electromagnetic interference.
Recomendado
Camera and Image Preprocessing
The XC7A12T-3CPG238E can implement camera-facing pixel transport, timing generation, preprocessing, and capture control in compact embedded vision systems. Its configurable logic allows parallel pixel lanes and control signals to be synchronized, while the 12,800-cell resource level is suitable for moderate pipeline stages and interface adapters rather than unrestricted image processing. The -3 grade supports demanding clock domains. Keep sensor data traces short and matched, terminate clocks according to the interface specification, isolate switching outputs, and validate setup and hold timing for every source-synchronous path before hardware release.
Recomendado
Test and Measurement
The XC7A12T-3CPG238E can implement deterministic timing, sequence, and protocol logic for compact test and measurement instruments. The 12,800 logic cells allow parallel execution of acquisition sequences, trigger matrices, status checks, and data-format conversion, while 112 I/O provide connections to instruments and fixtures. Its -3 designation supports timing-sensitive control paths and counters. Designers should isolate high-energy switching stages, use controlled clock distribution, validate input thresholds and output timing for every supported I/O standard, and reserve the configuration pins exactly as defined by the manufacturer package documentation.
Recomendado
Embedded Control Platform
The XC7A12T-3CPG238E works well as the programmable control core of an embedded equipment platform, combining peripheral bridges, state machines, timing, and supervisory logic in one device. Its 12,800 logic cells and 112 I/O are well matched to medium-complexity control boards requiring flexible pin assignment. The -3 speed grade provides additional timing margin for coordinated control paths. A robust implementation should separate sensitive analog and reference circuitry from FPGA supply currents, use multiple local bypass capacitors as specified by the device guidance, provide clean configuration startup, and test boundary scan and production programming procedures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7A12T-3CPG238E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7A12T-2CPG238C | XC7A12T-1CPG238C | XC7A12T-1CPG238I | XC7A12T-2CPG238I | XC7A12T-L2CPG238E |
|---|---|---|---|---|---|---|
| Brand | Xilinx Inc. | Xilinx Inc. | Xilinx Inc. | Xilinx Inc. | Xilinx Inc. | Xilinx Inc. |
| Package | 238-LFBGA, CSBGA-238 | 238-LFBGA, CSPBGA-238 - same package family | 238-LFBGA, CSPBGA-238 - same package family | 238-LFBGA, CSPBGA-238 - same package family | 238-LFBGA, CSPBGA-238 - same package family | 238-LFBGA, CSBGA-238 - same package family |
| Speed Designation | -3 | -2 | -1 | -1 | -2 | L2 |
| Temperature Suffix | E | C | C | I | I | E |
Principais diferenciais
- Higher -3 speed designation within the same XC7A12T package family (vs XC7A12T-2CPG238C)
- Extended E suffix for the target ordering code (vs XC7A12T-2CPG238C)
- Compatibility with the established XC7A12T-2CPG238C platform (vs XC7A12T-2CPG238C)
- Retains the E suffix while offering an L2 ordering option (vs XC7A12T-L2CPG238E)
Notas de projeto
Build the PCB from the official Artix-7 238-ball package drawing and pinout file rather than a generic CSBGA footprint. Confirm ball coordinates, exposed thermal-pad requirements, solder-mask and paste details, and assembly tolerances before release. Provide clean escape routing from all BGA balls and inspect fine-pitch assemblies with X-ray or an equivalent process capable of detecting bridged balls.
Separate FPGA core, I/O, and auxiliary supply routing as required by the device power architecture, and place local high-frequency decoupling directly at the relevant package balls. Keep high-current switching supplies and external regulators physically separated from sensitive clock and user-I/O routing. Validate voltage tolerances, power-up sequencing, and startup current before applying the power rails in hardware.
Assign clocks only to pins qualified for the intended clocking function, constrain all clock domains explicitly, and maintain controlled return paths beneath high-speed interfaces. Keep source-synchronous data routing short and length-matched where required by the external device. Review every pin against the Artix-7 package pinout because a valid package position does not guarantee support for every I/O standard.
Do not treat a shared 238-ball footprint as proof of an interchangeable production part. The speed designation, temperature suffix, configuration requirements, timing limits, power behavior, and qualification can change across ordering codes. For every proposed migration, regenerate constraints and bitstreams, rerun timing and power signoff, verify the manufacturing test plan, and confirm the exact ordering code before purchase.
Informações de conformidade
The assembly listing identifies the exact XC7A12T-3CPG238E as RoHS compliant. No explicit REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification declaration was identified.
