XC7VX415T-2FFG1158I - Virtex-7 XT FPGA 412K Logic Cells | AMD
N.º da peça: XC7VX415T-2FFG1158I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9864.2 | $9.864,20 |
| 10 | $9500 | $95.000,00 |
| 100 | $9100 | $910.000,00 |
| 500 | $8700 | $4.350.000,00 |
| 1.000 | $8300 | $8.300.000,00 |
XC7VX415T-2FFG1158I Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement complex digital logic functions. They are a key category within programmable logic devices (PLDs), which also include CPLDs. FPGAs sit between ASICs (application-specific integrated circuits) and general-purpose processors in the semiconductor hierarchy, offering a balance of performance, flexibility, and time-to-market.
Key features of the XC7VX415T-2FFG1158I include 48 GTH transceivers, an integrated PCIe Gen3 x8 block, and support for DDR3/DDR4 memory interfaces. The device operates at a core voltage of 1V and supports a wide range of I/O standards. The -2 speed grade indicates a high-performance variant, while the 'I' suffix denotes an industrial temperature range of -40°C to +100°C (Tj).
Architecturally, the Virtex-7 XT family is optimized for high-bandwidth applications, with a balanced ratio of logic, DSP slices, and block RAM. The 28 nm process technology enables high logic density and low power consumption. The integrated PCIe block and high-speed transceivers reduce the need for external PHY components, simplifying board design and reducing BOM cost.
Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and test and measurement equipment. The device's high logic capacity and transceiver count make it suitable for protocol processing, beamforming, and radar signal processing.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a robust PCB layout with adequate vias for thermal dissipation. The device's configuration via JTAG or SPI flash should be planned early in the design cycle.
Alternativas drop-in para XC7VX415T-2FFG1158I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7VX415T-2FFG1158I (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7VX415T-2FFG1158C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7VX415T-2FFG1158I Classificações máximas e características elétricas
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| Block RAM | 32440320 bits |
| Number of I/Os | 350 |
| Number of Transceivers | 48 GTH |
| Integrated PCIe | PCIe Gen3 x8 |
| Process Technology | 28 nm HKMG |
| Core Voltage | 1 V |
| Encapsulamento | 1156-BBGA, FCBGA (FFG1158) |
| Número de pinos | 1158 |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40°C to +100°C (Tj) |
| Speed Grade | -2 |
| Packaging | Tray |
| Categoria | FPGAs (Field Programmable Gate Array) |
Configuração de pinos do XC7VX415T-2FFG1158I
| Pino A1 | GND — Ground |
| Pino A2 | IO_L1P_T0 — User I/O bank 0 |
| Pino A3 | IO_L1N_T0 — User I/O bank 0 |
| Pino B1 | VCCINT — Internal core voltage 1V |
| Pino B2 | IO_L2P_T0 — User I/O bank 0 |
| Pino B3 | IO_L2N_T0 — User I/O bank 0 |
| Pino C1 | GND — Ground |
| Pino C2 | IO_L3P_T0 — User I/O bank 0 |
| Pino C3 | IO_L3N_T0 — User I/O bank 0 |
| Pino D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pino D2 | IO_L4P_T0 — User I/O bank 0 |
| Pino D3 | IO_L4N_T0 — User I/O bank 0 |
Aplicações típicas
XC7VX415T-2FFG1158I é adequado para 6 aplicaçãos: High-Performance Computing, Wired Communications, Aerospace and Defense, Test and Measurement, Medical Imaging, Data Center Acceleration.
High-Performance Computing
The XC7VX415T-2FFG1158I excels in high-performance computing (HPC) applications such as data center acceleration, scientific computing, and financial modeling. Its 412,160 logic cells and 48 GTH transceivers enable massive parallel processing and high-speed data movement. The integrated PCIe Gen3 x8 block provides a direct, high-bandwidth interface to host processors, reducing latency and simplifying system integration. With 32.4 Mb of block RAM, it can handle large datasets on-chip, minimizing external memory traffic. The 28 nm process ensures a balance of performance and power efficiency, critical for densely packed server environments. Designers can leverage the device's DSP slices for floating-point operations and signal processing, making it a versatile choice for HPC workloads.
Recomendado
Wired Communications
In wired communications, the XC7VX415T-2FFG1158I is ideal for network processors, switches, and routers. Its 48 GTH transceivers support high-speed serial protocols like 100GbE, OTN, and Interlaken, enabling line-rate packet processing. The integrated PCIe Gen3 x8 block facilitates connection to host CPUs for control plane functions. The device's large logic capacity allows implementation of complex packet classification, traffic management, and encryption engines. The 350 user I/Os provide ample connectivity for external PHYs and memory interfaces. The industrial temperature range ensures reliable operation in central office and data center environments. Designers can achieve low latency and high throughput, essential for modern communication infrastructure.
Recomendado
Aerospace and Defense
The XC7VX415T-2FFG1158I is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C Tj) ensures operation in harsh environments. The 412K logic cells enable complex signal processing algorithms, including FFTs, beamforming, and pulse compression. The 48 GTH transceivers support high-speed data links for sensor fusion and data distribution. The device's security features, including bitstream encryption, protect intellectual property and prevent tampering. The 1156-ball FCBGA package provides a robust mechanical interface for vibration-prone environments. Designers can implement redundant systems and fault-tolerant architectures using the device's reconfigurability.
Recomendado
Test and Measurement
The XC7VX415T-2FFG1158I is a powerful platform for test and measurement equipment, including oscilloscopes, logic analyzers, and signal generators. Its high logic density and 48 GTH transceivers enable high-speed data acquisition and generation. The integrated PCIe Gen3 x8 block allows seamless connection to host PCs for data analysis and control. The device's reconfigurability enables firmware updates and feature enhancements without hardware changes. The 350 I/Os provide flexibility for interfacing with ADCs, DACs, and other analog front-ends. The industrial temperature range ensures stable operation in lab and production environments. Designers can achieve high measurement accuracy and throughput, essential for advanced test systems.
Recomendado
Medical Imaging
The XC7VX415T-2FFG1158I is used in medical imaging systems such as CT scanners, MRI, and ultrasound. Its 412K logic cells and DSP slices enable real-time image reconstruction and processing. The 48 GTH transceivers support high-speed data transfer from sensors and detectors. The integrated PCIe Gen3 x8 block facilitates connection to host processors for image display and storage. The device's low latency is critical for real-time imaging applications. The industrial temperature range ensures reliable operation in clinical environments. Designers can implement advanced algorithms like filtered back-projection and beamforming, improving image quality and diagnostic accuracy.
Recomendado
Data Center Acceleration
The XC7VX415T-2FFG1158I is a key component in data center acceleration cards for workloads like AI inference, video transcoding, and database acceleration. Its 412K logic cells and 48 GTH transceivers enable high-throughput processing. The integrated PCIe Gen3 x8 block provides a standard interface to servers, simplifying deployment. The device's reconfigurability allows adaptation to evolving algorithms and standards. The 32.4 Mb block RAM supports on-chip caching, reducing memory latency. The 28 nm process offers a good balance of performance and power, important for power-constrained data centers. Designers can achieve significant speedups over CPU-only implementations, improving overall system efficiency.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7VX415T-2FFG1158I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7VX415T-2FFG1158C | XC7VX690T-2FFG1761C | XC7V2000T-1FFG1927C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1761-BBGA, FCBGA - different | 1927-BBGA, FCBGA - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 693120 | 1954560 |
| Block RAM (bits) | 32440320 | 32440320 | 52920000 | 46593600 |
| Number of I/Os | 350 | 350 | 850 | 1200 |
| Transceivers | 48 GTH | 48 GTH | 80 GTH | 96 GTH |
| Integrated PCIe | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 |
| Temperature Range | -40°C to +100°C (Tj) | 0°C to +85°C (Tj) | 0°C to +85°C (Tj) | 0°C to +85°C (Tj) |
Principais diferenciais
- Industrial temperature range (vs XC7VX415T-2FFG1158C)
- Balanced logic and I/O in a smaller package (vs XC7VX690T-2FFG1761C)
- Cost-effective for mid-range capacity (vs XC7V2000T-1FFG1927C)
Notas de projeto
The XC7VX415T-2FFG1158I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for I/O banks. Use dedicated power regulators with adequate current capability. Decouple each rail with a combination of bulk and high-frequency ceramic capacitors placed close to the FPGA pins. Follow AMD's power distribution network (PDN) guidelines to minimize voltage ripple and ensure reliable operation.
The FCBGA package can dissipate significant power, especially with high logic utilization and transceiver activity. Ensure adequate thermal management by using a heatsink and forced airflow. The thermal resistance (theta_JA) depends on PCB design and airflow; use thermal vias under the package to improve heat transfer to the PCB. Monitor junction temperature to stay within the -40°C to +100°C range.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Follow AMD's layout guidelines for GTH transceivers, including AC coupling capacitors and proper reference plane routing. For the PCIe block, ensure differential pair routing meets PCIe Gen3 specifications. Use a high-quality PCB material like Megtron 6 for high-speed signals.
Informações de conformidade
Compliance information not explicitly provided in the verified web data. Contact AMD or distributor for RoHS/REACH status.
