XC7VX415T-2FFG1158I - Virtex-7 XT FPGA 412K Logic Cells | AMD
MPN: XC7VX415T-2FFG1158I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9864.2 | $9,864.20 |
| 10 | $9500 | $95,000.00 |
| 100 | $9100 | $910,000.00 |
| 500 | $8700 | $4,350,000.00 |
| 1,000 | $8300 | $8,300,000.00 |
Drop-in alternatives for XC7VX415T-2FFG1158I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7VX415T-2FFG1158C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7VX415T-2FFG1158I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 412160 |
| Block RAM | 32440320 bits |
| Number of I/Os | 350 |
| Number of Transceivers | 48 GTH |
| Integrated PCIe | PCIe Gen3 x8 |
| Process Technology | 28 nm HKMG |
| Core Voltage | 1 V |
| Package | 1156-BBGA, FCBGA (FFG1158) |
| Number of Pins | 1158 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C to +100°C (Tj) |
| Speed Grade | -2 |
| Packaging | Tray |
| Category | FPGAs (Field Programmable Gate Array) |
XC7VX415T-2FFG1158I Pin Configuration
| Pin A1 | GND — Ground |
| Pin A2 | IO_L1P_T0 — User I/O bank 0 |
| Pin A3 | IO_L1N_T0 — User I/O bank 0 |
| Pin B1 | VCCINT — Internal core voltage 1V |
| Pin B2 | IO_L2P_T0 — User I/O bank 0 |
| Pin B3 | IO_L2N_T0 — User I/O bank 0 |
| Pin C1 | GND — Ground |
| Pin C2 | IO_L3P_T0 — User I/O bank 0 |
| Pin C3 | IO_L3N_T0 — User I/O bank 0 |
| Pin D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pin D2 | IO_L4P_T0 — User I/O bank 0 |
| Pin D3 | IO_L4N_T0 — User I/O bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX415T-2FFG1158I is suitable for 6 applications: High-Performance Computing, Wired Communications, Aerospace and Defense, Test and Measurement, Medical Imaging, Data Center Acceleration.
High-Performance Computing
The XC7VX415T-2FFG1158I excels in high-performance computing (HPC) applications such as data center acceleration, scientific computing, and financial modeling. Its 412,160 logic cells and 48 GTH transceivers enable massive parallel processing and high-speed data movement. The integrated PCIe Gen3 x8 block provides a direct, high-bandwidth interface to host processors, reducing latency and simplifying system integration. With 32.4 Mb of block RAM, it can handle large datasets on-chip, minimizing external memory traffic. The 28 nm process ensures a balance of performance and power efficiency, critical for densely packed server environments. Designers can leverage the device's DSP slices for floating-point operations and signal processing, making it a versatile choice for HPC workloads.
Recommended
Wired Communications
In wired communications, the XC7VX415T-2FFG1158I is ideal for network processors, switches, and routers. Its 48 GTH transceivers support high-speed serial protocols like 100GbE, OTN, and Interlaken, enabling line-rate packet processing. The integrated PCIe Gen3 x8 block facilitates connection to host CPUs for control plane functions. The device's large logic capacity allows implementation of complex packet classification, traffic management, and encryption engines. The 350 user I/Os provide ample connectivity for external PHYs and memory interfaces. The industrial temperature range ensures reliable operation in central office and data center environments. Designers can achieve low latency and high throughput, essential for modern communication infrastructure.
Recommended
Aerospace and Defense
The XC7VX415T-2FFG1158I is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C Tj) ensures operation in harsh environments. The 412K logic cells enable complex signal processing algorithms, including FFTs, beamforming, and pulse compression. The 48 GTH transceivers support high-speed data links for sensor fusion and data distribution. The device's security features, including bitstream encryption, protect intellectual property and prevent tampering. The 1156-ball FCBGA package provides a robust mechanical interface for vibration-prone environments. Designers can implement redundant systems and fault-tolerant architectures using the device's reconfigurability.
Recommended
Test and Measurement
The XC7VX415T-2FFG1158I is a powerful platform for test and measurement equipment, including oscilloscopes, logic analyzers, and signal generators. Its high logic density and 48 GTH transceivers enable high-speed data acquisition and generation. The integrated PCIe Gen3 x8 block allows seamless connection to host PCs for data analysis and control. The device's reconfigurability enables firmware updates and feature enhancements without hardware changes. The 350 I/Os provide flexibility for interfacing with ADCs, DACs, and other analog front-ends. The industrial temperature range ensures stable operation in lab and production environments. Designers can achieve high measurement accuracy and throughput, essential for advanced test systems.
Recommended
Medical Imaging
The XC7VX415T-2FFG1158I is used in medical imaging systems such as CT scanners, MRI, and ultrasound. Its 412K logic cells and DSP slices enable real-time image reconstruction and processing. The 48 GTH transceivers support high-speed data transfer from sensors and detectors. The integrated PCIe Gen3 x8 block facilitates connection to host processors for image display and storage. The device's low latency is critical for real-time imaging applications. The industrial temperature range ensures reliable operation in clinical environments. Designers can implement advanced algorithms like filtered back-projection and beamforming, improving image quality and diagnostic accuracy.
Recommended
Data Center Acceleration
The XC7VX415T-2FFG1158I is a key component in data center acceleration cards for workloads like AI inference, video transcoding, and database acceleration. Its 412K logic cells and 48 GTH transceivers enable high-throughput processing. The integrated PCIe Gen3 x8 block provides a standard interface to servers, simplifying deployment. The device's reconfigurability allows adaptation to evolving algorithms and standards. The 32.4 Mb block RAM supports on-chip caching, reducing memory latency. The 28 nm process offers a good balance of performance and power, important for power-constrained data centers. Designers can achieve significant speedups over CPU-only implementations, improving overall system efficiency.
Recommended
Recommended Products Summary
Engineering reference data for XC7VX415T-2FFG1158I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX415T-2FFG1158C | XC7VX690T-2FFG1761C | XC7V2000T-1FFG1927C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA - same | 1761-BBGA, FCBGA - different | 1927-BBGA, FCBGA - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 412160 | 412160 | 693120 | 1954560 |
| Block RAM (bits) | 32440320 | 32440320 | 52920000 | 46593600 |
| Number of I/Os | 350 | 350 | 850 | 1200 |
| Transceivers | 48 GTH | 48 GTH | 80 GTH | 96 GTH |
| Integrated PCIe | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 |
| Temperature Range | -40°C to +100°C (Tj) | 0°C to +85°C (Tj) | 0°C to +85°C (Tj) | 0°C to +85°C (Tj) |
Key Differentiators
- Industrial temperature range (vs XC7VX415T-2FFG1158C)
- Balanced logic and I/O in a smaller package (vs XC7VX690T-2FFG1761C)
- Cost-effective for mid-range capacity (vs XC7V2000T-1FFG1927C)
Design Notes
The XC7VX415T-2FFG1158I requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for I/O banks. Use dedicated power regulators with adequate current capability. Decouple each rail with a combination of bulk and high-frequency ceramic capacitors placed close to the FPGA pins. Follow AMD's power distribution network (PDN) guidelines to minimize voltage ripple and ensure reliable operation.
The FCBGA package can dissipate significant power, especially with high logic utilization and transceiver activity. Ensure adequate thermal management by using a heatsink and forced airflow. The thermal resistance (theta_JA) depends on PCB design and airflow; use thermal vias under the package to improve heat transfer to the PCB. Monitor junction temperature to stay within the -40°C to +100°C range.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Follow AMD's layout guidelines for GTH transceivers, including AC coupling capacitors and proper reference plane routing. For the PCIe block, ensure differential pair routing meets PCIe Gen3 specifications. Use a high-quality PCB material like Megtron 6 for high-speed signals.
Compliance Information
Compliance information not explicitly provided in the verified web data. Contact AMD or distributor for RoHS/REACH status.
