XC7VX690T-1FFG1157C - Virtex-7 XT FPGA 693K Cells | AMD
N.º da peça: XC7VX690T-1FFG1157C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12000 | $12.000,00 |
| 10 | $11000 | $110.000,00 |
| 100 | $10000 | $1.000.000,00 |
| 500 | $9000 | $4.500.000,00 |
| 1.000 | $8000 | $8.000.000,00 |
XC7VX690T-1FFG1157C Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. FPGAs sit within the broader category of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for prototyping, low-volume production, and applications requiring hardware reconfigurability.
Key features of the XC7VX690T-1FFG1157C include its 693K logic cells, 600 user I/Os, and 54.19 Mb of block RAM. The device operates at a core voltage of 1V and supports a wide range of I/O standards. It includes 80 DSP48E1 slices for high-performance digital signal processing, and up to 80 GTX transceivers for high-speed serial communication. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications.
Technically, the Virtex-7 XT family is optimized for high-bandwidth and high-capacity applications. The 28nm HPL (High-Performance, Low-Power) process technology provides a good balance between performance and power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the FPGA. It also features advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation and distribution.
Typical applications include high-performance computing, data center acceleration, wired and wireless communications, aerospace and defense systems, and medical imaging. The high logic density and transceiver count make it ideal for implementing complex algorithms, protocol processing, and high-throughput data paths. The 600 I/Os provide ample connectivity for external memory interfaces, high-speed ADCs/DACs, and other peripherals.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing and filtering. A robust PCB layout with adequate ground planes and decoupling capacitors is essential for reliable operation at high speeds. The FC-BGA package requires a reflow profile compatible with lead-free soldering.
Alternativas drop-in para XC7VX690T-1FFG1157C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7VX690T-1FFG1157C (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Temperature Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7VX690T-2FFG1157I
✅ Drop-In✓ Em estoque
$560 / unidade
Ver ficha técnica →XC7VX690T-1FFG1157I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7VX690T-2FFG1157C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7VX690T-1FFG1157C
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8000 / unidade
Ver ficha técnica →XC7VX690T-1FFG1157C
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8000 / unidade
Ver ficha técnica →XC7VX690T-1FFG1157C Classificações máximas e características elétricas
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| Number of I/Os | 600 |
| Encapsulamento | 1157-pin FC-BGA (FFG1157) |
| Technology | 28nm |
| Core Voltage | 1V |
| Speed Grade | -1 |
| Temperature Grade | C (Commercial, 0C to +85C) |
| DSP Slices | 3600 |
| GTX Transceivers | 80 |
| Configuration | SRAM-based |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Temperatura de operação | 0C to +85C |
Configuração de pinos do XC7VX690T-1FFG1157C
| Pino A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pino A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pino B1 | VCCINT — Internal core voltage 1V |
| Pino B2 | GND — Ground |
| Pino C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pino C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pino D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pino D2 | GND — Ground |
| Pino E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pino E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pino F1 | VCCO_0 — I/O bank 0 supply voltage |
| Pino F2 | GND — Ground |
Aplicações típicas
XC7VX690T-1FFG1157C é adequado para 6 aplicaçãos: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Data Center Acceleration, Test and Measurement.
High-Performance Computing
The XC7VX690T-1FFG1157C is ideal for high-performance computing applications such as data center acceleration and scientific computing. Its 693K logic cells and 3600 DSP slices enable complex algorithms and parallel processing. The 80 GTX transceivers provide high-speed connectivity for inter-chip and inter-board communication, making it suitable for compute-intensive workloads.
Recomendado
Wired Communications
In wired communications, the XC7VX690T-1FFG1157C excels in implementing high-throughput packet processing, protocol conversion, and network security. Its 80 GTX transceivers support 10G/40G/100G Ethernet and other high-speed serial standards. The large block RAM (54.19 Mb) enables deep packet buffering and flow tables, essential for routers and switches.
Recomendado
Aerospace and Defense
The XC7VX690T-1FFG1157C is suitable for aerospace and defense applications like radar, electronic warfare, and secure communications. Its high logic density and DSP capabilities support complex signal processing algorithms. The commercial temperature grade (0C to +85C) is adequate for many ground-based systems, while the industrial-grade variant is available for harsher environments.
Recomendado
Medical Imaging
For medical imaging systems like CT scanners and ultrasound machines, the XC7VX690T-1FFG1157C provides the computational power needed for real-time image processing and reconstruction. Its 3600 DSP slices accelerate filtering and transform operations, while the 600 I/Os interface with high-speed ADCs and DACs. The device's reliability and long-term availability are critical for medical equipment.
Recomendado
Data Center Acceleration
The XC7VX690T-1FFG1157C is used in data center acceleration for applications like network function virtualization (NFV), storage acceleration, and AI inference. Its high logic density and transceiver count enable offloading of compute-intensive tasks from CPUs. The device supports partial reconfiguration, allowing dynamic updates to acceleration functions without system downtime.
Recomendado
Test and Measurement
In test and measurement equipment, the XC7VX690T-1FFG1157C enables high-speed data acquisition, signal generation, and real-time analysis. Its 600 I/Os connect to high-speed ADCs and DACs, while the DSP slices handle complex waveform processing. The device's reconfigurability allows the same hardware to support multiple test standards and protocols.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7VX690T-1FFG1157C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7VX690T-2FFG1157I | XC7VX690T-1FFG1157I | XC7VX690T-2FFG1157C |
|---|---|---|---|---|
| Package | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 693120 | 693120 | 693120 | 693120 |
| Block RAM | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits |
| Number of I/Os | 600 | 600 | 600 | 600 |
| Speed Grade | -1 | -2 | -1 | -2 |
| Temperature Grade | C (0C to +85C) | I (-40C to +100C) | I (-40C to +100C) | C (0C to +85C) |
| Core Voltage | 1V | 1V | 1V | 1V |
Principais diferenciais
- Higher speed grade option (vs XC7VX690T-1FFG1157C)
- Industrial temperature range (vs XC7VX690T-1FFG1157C)
- Cost-effective baseline (vs XC7VX690T-2FFG1157I)
Notas de projeto
The XC7VX690T-1FFG1157C requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Proper power sequencing is essential to avoid latch-up or damage. Use a dedicated power management IC to ensure correct sequencing and monotonic ramp-up. Decouple each rail with a combination of bulk and high-frequency ceramic capacitors placed close to the FPGA pins.
The XC7VX690T-1FFG1157C can dissipate significant power, especially when using many transceivers and logic resources. A thermal solution, such as a heatsink or active cooling, is required to keep the junction temperature within the specified range (0C to +85C for commercial grade). Use thermal vias under the package to improve heat transfer to the PCB ground plane.
For high-speed signals, maintain controlled impedance traces and minimize stub lengths. Use a solid ground plane and avoid splitting it under the FPGA. Place decoupling capacitors as close as possible to the power pins. For the FC-BGA package, ensure the PCB pad pattern matches the recommended land pattern from AMD to avoid solder joint reliability issues.
Informações de conformidade
RoHS compliance is indicated by distributor listings. Other compliance details are not specified in the provided data.
