XC7Z030-1FF676I - Dual-Core ARM Zynq SoC | AMD | 676-FCBGA
N.º da peça: XC7Z030-1FF676I ✓ AtivoXC7Z030-1FF676I Visão geral
A Zynq system-on-chip is an FPGA SoC that integrates a hard microcontroller subsystem with programmable FPGA fabric. In the product hierarchy, it is a programmable-logic device, FPGA and CPLD, and heterogeneous SoC combining an ARM processor with Kintex-7 FPGA resources. This integration allows software-controlled functions and hardware data paths to operate in one device while reducing the number of external devices required in an embedded system.
The verified device listing identifies two ARM Cortex-A9 MPCore processors, CoreSight debug support, Kintex-7 FPGA logic, 125K logic cells, and a 667 MHz clock. The 676-FCBGA package provides a high-pin-count interconnect for programmable logic I/O, memory interfaces, high-speed serial links, and processor peripherals. Because the target is a high-density BGA, its footprint, ball map, power distribution, and escape routing must be controlled during PCB layout.
The exact Xilinx ordering code carries meaningful configuration information, but the supplied web records do not expose the complete electrical tables, memory-map details, transceiver characterization, or power-sequencing requirements. Engineers should therefore obtain the official manufacturer datasheet and device-specific design documentation before finalizing voltage rails, decoupling, clocking, PCB stack-up, and signal-integrity simulations. The visible distributor records also contain a naming difference between the requested XC7Z030-1FF676I and the commonly indexed XC7Z030-1FFG676I, which should be reconciled against the manufacturer ordering guide.
Typical Zynq-7000 applications include industrial control and automation, communications equipment, embedded vision, data acquisition, networking appliances, and test systems that benefit from combining an ARM operating environment with parallel programmable logic. In such systems, the processor can manage control software and external interfaces while FPGA fabric implements time-critical data paths, protocol acceleration, signal conditioning, or custom interfaces.
PCB design is the principal implementation consideration for this 676-ball device. Use the manufacturer-defined ball map and escape-routing methodology, provide continuous power and ground planes, and place decoupling capacitors close to the relevant supply balls. Do not infer pin compatibility from package dimensions alone: the AMD support result specifically raises uncertainty between closely related Zynq ordering codes, so ball assignment, voltage levels, and device configuration must be checked before substitution.
This page consolidates verified distributor specifications, documented ordering variants, package information, pricing, and replacement constraints into a design-oriented summary. It also distinguishes verified drop-in candidates from broader functional alternatives and avoids assigning unpublished electrical specifications or an unverified 676-ball pin map.
Alternativas drop-in para XC7Z030-1FF676I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
XC7Z030-1FFG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7Z030-2FFG676I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7Z030-1FFG676C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7Z030-2FFG676C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7Z030-3FFG676I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
XC7Z030-1FF676I Classificações máximas e características elétricas
| Device Type | Zynq-7000 Kintex-7 FPGA SoC |
| Processor Core | 2 x ARM Cortex-A9 MPCore |
| Maximum Processor Frequency | 667 MHz |
| Programmable Logic | Kintex-7 FPGA |
| Logic Cells | 125K logic cells |
| Debug Support | CoreSight |
| Encapsulamento | 676-FCBGA |
| Package Dimensions | 27 mm x 27 mm |
| Contagem de pinos | 676 pins |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do XC7Z030-1FF676I 27 mm x 27 mm
Configuração de pinos para XC7Z030-1FF676I (pacote 27 mm x 27 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XC7Z030-1FF676I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XC7Z030-1FF676I é adequado para 6 aplicaçãos: Industrial Control and Automation, Communications Equipment, Embedded Vision and Image Processing, Data Acquisition and Test Systems, Network Storage and Edge Processing, Programmable Logic Control Platform.
Industrial Control and Automation
The XC7Z030-1FF676I fits industrial controllers that combine deterministic I/O processing with a general-purpose operating environment. Its dual ARM Cortex-A9 cores can execute communications, motion-control, diagnostics, and supervisory software, while the 125K Kintex-7 logic cells can accelerate protocol conversion, timing functions, and parallel condition monitoring. The 676-FCBGA interface provides a high connection count for industrial sensors, actuators, field buses, and service interfaces. Before deployment, verify the exact temperature range, isolation requirements, functional safety strategy, and long-term supply plan; the supplied records do not quantify those device-level limits.
Communications Equipment
The Zynq-7000 architecture is suitable for communications equipment that must partition latency-sensitive packet processing from embedded control software. The dual Cortex-A9 processor supports network stacks, management interfaces, and configuration logic, while 125K Kintex-7 logic cells can implement parallel framing, CRC, filtering, buffering, or custom interface functions. The 667 MHz processor configuration shown in the verified distributor listing provides the processing context for Linux-based or RTOS-based systems. The 676-FCBGA package requires careful escape routing and power delivery, and final transceiver rates and I/O performance must be taken from the official device documentation.
Embedded Vision and Image Processing
The XC7Z030-1FF676I can support embedded vision systems in which pixel acquisition, filtering, and format conversion require parallel hardware while the ARM cores manage camera control and application logic. The 125K programmable logic cells provide resources for time-critical pixel pipelines, and the dual-core processor allows operating-system work and image processing tasks to be partitioned. The 676-FCBGA package offers extensive connectivity for image sensors, memory interfaces, and external processing devices. Actual camera interface rates, DSP-slice count, memory bandwidth, and supported I/O standards are not present in the supplied records and must be verified before interface selection.
Data Acquisition and Test Systems
The combination of programmable FPGA logic and dual ARM Cortex-A9 cores makes the XC7Z030-1FF676I appropriate for high-performance data-acquisition and automated test equipment. FPGA fabric can implement parallel ADCs, counters, trigger logic, waveform capture, and protocol engines, while the processor handles calibration, sequencing, data transfer, and remote control. Its 125K logic cells provide a meaningful implementation area without changing the SoC architecture. The 667 MHz processor clock supports the control side of the system, but analog front-end bandwidth, DAC resolution, sampling rate, and memory-interface details are not specified in the supplied data and require separate component selection.
Network Storage and Edge Processing
The XC7Z030-1FF676I can serve as the processing centerpiece of an edge appliance or network-storage controller that needs dedicated hardware acceleration alongside a hosted operating system. The processor cores can manage storage services, networking, security, and administration, while FPGA logic can accelerate data movement, compression, encryption, packet filtering, or storage-interface functions. The 125K Kintex-7 logic resources provide more parallelism than a conventional microcontroller-only design while retaining a familiar ARM software environment. Deployment decisions must include validated transceiver configuration, memory compatibility, thermal design, security requirements, and the unavailable detailed electrical specifications for the exact ordering code.
Programmable Logic Control Platform
The XC7Z030-1FF676I is well suited to a platform that presents programmable logic to engineers as custom accelerators while retaining ARM-based software control. Logic blocks can implement deterministic state machines, custom interfaces, filter pipelines, or hardware protocols, and the dual Cortex-A9 subsystem can run control code, diagnostics, and network management. The 676-FCBGA package supports a large number of external connections and is appropriate for sophisticated rather than minimal embedded systems. A robust implementation requires manufacturer-defined power sequencing, decoupling, clocking, configuration memories, and a high-density PCB stack-up with the relevant BGA escape and routing rules.
Dados de referência de engenharia para XC7Z030-1FF676I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7Z030-1FFG676I | XC7Z030-2FFG676I | XC7Z030-1FFG676C | XC7Z030-2FFG676C | XC7Z030-3FFG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-FCBGA (27 mm x 27 mm) | 676-FCBGA (27 mm x 27 mm) | 676-FCBGA (27 mm x 27 mm) | 676-FCBGA (27 mm x 27 mm) | 676-FCBGA (27 mm x 27 mm) | 676-FCBGA (27 mm x 27 mm) |
| Device Family | Zynq-7000 Kintex-7 FPGA SoC | Zynq-7000 Kintex-7 FPGA SoC | Zynq-7000 Kintex-7 FPGA SoC | Zynq-7000 Kintex-7 FPGA SoC | Zynq-7000 Kintex-7 FPGA SoC | Zynq-7000 Kintex-7 FPGA SoC |
| Processor Configuration | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Speed Grade | -1 | -1 | -2 | -1 | -2 | -3 |
| Ordering Suffix | I | I | I | C | C | I |
Principais diferenciais
- Directly indexed industrial ordering variant (vs XC7Z030-1FFG676I)
- Higher speed grade in the same package family (vs XC7Z030-2FFG676I)
- Commercial suffix option for cost-sensitive sourcing (vs XC7Z030-1FFG676C)
- Maximum timing-grade option in the same family (vs XC7Z030-3FFG676I)
Notas de projeto
Treat the XC7Z030-1FF676I as a high-density 676-FCBGA design and use only the official AMD/Xilinx escape-routing and ball-map files. The supplied data confirms a 27 mm by 27 mm package but does not provide individual ball assignments. Preserve the recommended ball and row geometry, via-in-pad requirements, solder-mask and paste apertures, and layer-transition rules rather than deriving them from a generic BGA template.
Verify the exact device power rails, current limits, sequencing rules, and decoupling values from the official documentation. The 667 MHz processor and 125K-cell FPGA configuration can make power integrity and thermal performance central to the design. Use the manufacturer-recommended power architecture and placement for high-current and sensitive supply balls; no exact voltage or capacitor values are included in the supplied records, so guessed values should not be used.
Do not treat XC7Z030-1FF676I and XC7Z030-1FFG676I as interchangeable merely because search results use both names, and do not assume that all 676-ball Zynq variants have interchangeable pinouts. AMD's support record specifically questions compatibility between related orderings. Before substitution, compare the ordering table, complete ball maps, supply voltages, exposed connections, configuration method, and every supported I/O standard against the original design.
Complete a thermal budget using actual processor activity, FPGA utilization, I/O loading, board copper, airflow, and the validated power data for the selected ordering code. The 667 MHz processor listing is not a thermal rating, and the supplied data does not include junction-temperature limits or package thermal resistance. Validate the assembled board in its intended enclosure and use the manufacturer's power estimator or supported engineering models rather than extrapolating from processor frequency alone.
Plan high-speed routing only after identifying the actual interfaces enabled in the selected device and package. The supplied records do not disclose transceiver lane counts, maximum data rates, I/O standards, or ball assignments, so generic impedance rules are insufficient. Use the official pinout and timing information, account for package and PCB loss, and perform appropriate pre-layout and post-layout signal-integrity analysis for memory, high-speed serial, and other critical interfaces.
Informações de conformidade
The supplied distributor records do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for the exact XC7Z030-1FF676I. These fields remain unknown rather than being inferred from the manufacturer or package name.
