AMD

XC7Z030-1FF676I - Dual-Core ARM Zynq SoC | AMD | 676-FCBGA

Name: XC7Z030-1FF676I - Dual-Core ARM Zynq SoC | AMD | 676-FCBGA
Brand: AMD
SKU: XC7Z030-1FF676I

MPN： XC7Z030-1FF676I ✓ 啟用中

676-FCBGA Package 667 MHz Speed

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MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

XC7Z030-1FF676I 概覽

The AMD XC7Z030-1FF676I is a Zynq-7000 Kintex-7 system-on-chip combining a dual-core ARM Cortex-A9 MPCore processor with programmable Kintex-7 FPGA logic, 125K logic cells, a 667 MHz processor clock, and a 676-ball FCBGA package measuring 27 mm by 27 mm. The matched industrial-ordering designation XC7Z030-1FFG676I is listed by DigiKey with the same 125K logic-cell and 667 MHz configuration in the 676-FCBGA package.

A Zynq system-on-chip is an FPGA SoC that integrates a hard microcontroller subsystem with programmable FPGA fabric. In the product hierarchy, it is a programmable-logic device, FPGA and CPLD, and heterogeneous SoC combining an ARM processor with Kintex-7 FPGA resources. This integration allows software-controlled functions and hardware data paths to operate in one device while reducing the number of external devices required in an embedded system.

The verified device listing identifies two ARM Cortex-A9 MPCore processors, CoreSight debug support, Kintex-7 FPGA logic, 125K logic cells, and a 667 MHz clock. The 676-FCBGA package provides a high-pin-count interconnect for programmable logic I/O, memory interfaces, high-speed serial links, and processor peripherals. Because the target is a high-density BGA, its footprint, ball map, power distribution, and escape routing must be controlled during PCB layout.

The exact Xilinx ordering code carries meaningful configuration information, but the supplied web records do not expose the complete electrical tables, memory-map details, transceiver characterization, or power-sequencing requirements. Engineers should therefore obtain the official manufacturer datasheet and device-specific design documentation before finalizing voltage rails, decoupling, clocking, PCB stack-up, and signal-integrity simulations. The visible distributor records also contain a naming difference between the requested XC7Z030-1FF676I and the commonly indexed XC7Z030-1FFG676I, which should be reconciled against the manufacturer ordering guide.

Typical Zynq-7000 applications include industrial control and automation, communications equipment, embedded vision, data acquisition, networking appliances, and test systems that benefit from combining an ARM operating environment with parallel programmable logic. In such systems, the processor can manage control software and external interfaces while FPGA fabric implements time-critical data paths, protocol acceleration, signal conditioning, or custom interfaces.

PCB design is the principal implementation consideration for this 676-ball device. Use the manufacturer-defined ball map and escape-routing methodology, provide continuous power and ground planes, and place decoupling capacitors close to the relevant supply balls. Do not infer pin compatibility from package dimensions alone: the AMD support result specifically raises uncertainty between closely related Zynq ordering codes, so ball assignment, voltage levels, and device configuration must be checked before substitution.

This page consolidates verified distributor specifications, documented ordering variants, package information, pricing, and replacement constraints into a design-oriented summary. It also distinguishes verified drop-in candidates from broader functional alternatives and avoids assigning unpublished electrical specifications or an unverified 676-ball pin map.

直接替換替代品，適用於 XC7Z030-1FF676I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

XC7Z030-1FFG676I

✅ 直接替換

📦 676-FCBGA (27 mm x 27 mm)

Closely matched -1 Zynq-7000 ordering variant with 125K logic cells and 667 MHz; the exact ordering fields must be reconciled because DigiKey uses the additional G designation.

📋 參考替代品（不在目錄中）

XC7Z030-2FFG676I

✅ 直接替換

📦 676-FCBGA (27 mm x 27 mm)

Uses a 2 speed grade rather than the target's -1 speed grade; performance and power limits must be checked even though the package family is retained.

📋 參考替代品（不在目錄中）

XC7Z030-1FFG676C

✅ 直接替換

📦 676-FCBGA (27 mm x 27 mm)

Uses the C ordering suffix instead of the target industrial suffix; the grade or commercial-temperature differences may exceed the allowed drop-in range if the original design relies on industrial operation.

📋 參考替代品（不在目錄中）

XC7Z030-2FFG676C

✅ 直接替換 ⚠️ 規格未經驗證

📦 676-FCBGA (27 mm x 27 mm)

Combines a 2 speed grade with the C ordering suffix; it can differ from the target in both performance and temperature-grade requirements while retaining the 676-FCBGA footprint.

📋 參考替代品（不在目錄中）

XC7Z030-3FFG676I

✅ 直接替換 ⚠️ 規格未經驗證

📦 676-FCBGA (27 mm x 27 mm)

Uses a 3 speed grade rather than the target's -1 speed grade; timing margin improves but power, configuration, and device-limit comparisons are required.

📋 參考替代品（不在目錄中）

XC7Z030-1FF676I 最大額定值與電氣特性

Device Type	Zynq-7000 Kintex-7 FPGA SoC
Processor Core	2 x ARM Cortex-A9 MPCore
Maximum Processor Frequency	667 MHz
Programmable Logic	Kintex-7 FPGA
Logic Cells	125K logic cells
Debug Support	CoreSight
封裝	676-FCBGA
Package Dimensions	27 mm x 27 mm
腳位數	676 pins
安裝類型	Surface Mount

XC7Z030-1FF676I 27 mm x 27 mm 腳位配置指南

XC7Z030-1FF676I（27 mm x 27 mm 封裝）的腳位配置。此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

無詳細腳位定義資料： XC7Z030-1FF676I.

請參閱資料表以查看完整腳位配置。

典型應用

XC7Z030-1FF676I 適用於 6 應用s: Industrial Control and Automation, Communications Equipment, Embedded Vision and Image Processing, Data Acquisition and Test Systems, Network Storage and Edge Processing, Programmable Logic Control Platform.

🏭

Industrial Control and Automation

The XC7Z030-1FF676I fits industrial controllers that combine deterministic I/O processing with a general-purpose operating environment. Its dual ARM Cortex-A9 cores can execute communications, motion-control, diagnostics, and supervisory software, while the 125K Kintex-7 logic cells can accelerate protocol conversion, timing functions, and parallel condition monitoring. The 676-FCBGA interface provides a high connection count for industrial sensors, actuators, field buses, and service interfaces. Before deployment, verify the exact temperature range, isolation requirements, functional safety strategy, and long-term supply plan; the supplied records do not quantify those device-level limits.

🌐

Communications Equipment

The Zynq-7000 architecture is suitable for communications equipment that must partition latency-sensitive packet processing from embedded control software. The dual Cortex-A9 processor supports network stacks, management interfaces, and configuration logic, while 125K Kintex-7 logic cells can implement parallel framing, CRC, filtering, buffering, or custom interface functions. The 667 MHz processor configuration shown in the verified distributor listing provides the processing context for Linux-based or RTOS-based systems. The 676-FCBGA package requires careful escape routing and power delivery, and final transceiver rates and I/O performance must be taken from the official device documentation.

📷

Embedded Vision and Image Processing

The XC7Z030-1FF676I can support embedded vision systems in which pixel acquisition, filtering, and format conversion require parallel hardware while the ARM cores manage camera control and application logic. The 125K programmable logic cells provide resources for time-critical pixel pipelines, and the dual-core processor allows operating-system work and image processing tasks to be partitioned. The 676-FCBGA package offers extensive connectivity for image sensors, memory interfaces, and external processing devices. Actual camera interface rates, DSP-slice count, memory bandwidth, and supported I/O standards are not present in the supplied records and must be verified before interface selection.

🖥️

Data Acquisition and Test Systems

The combination of programmable FPGA logic and dual ARM Cortex-A9 cores makes the XC7Z030-1FF676I appropriate for high-performance data-acquisition and automated test equipment. FPGA fabric can implement parallel ADCs, counters, trigger logic, waveform capture, and protocol engines, while the processor handles calibration, sequencing, data transfer, and remote control. Its 125K logic cells provide a meaningful implementation area without changing the SoC architecture. The 667 MHz processor clock supports the control side of the system, but analog front-end bandwidth, DAC resolution, sampling rate, and memory-interface details are not specified in the supplied data and require separate component selection.

🖥️

Network Storage and Edge Processing

The XC7Z030-1FF676I can serve as the processing centerpiece of an edge appliance or network-storage controller that needs dedicated hardware acceleration alongside a hosted operating system. The processor cores can manage storage services, networking, security, and administration, while FPGA logic can accelerate data movement, compression, encryption, packet filtering, or storage-interface functions. The 125K Kintex-7 logic resources provide more parallelism than a conventional microcontroller-only design while retaining a familiar ARM software environment. Deployment decisions must include validated transceiver configuration, memory compatibility, thermal design, security requirements, and the unavailable detailed electrical specifications for the exact ordering code.

🔧

Programmable Logic Control Platform

The XC7Z030-1FF676I is well suited to a platform that presents programmable logic to engineers as custom accelerators while retaining ARM-based software control. Logic blocks can implement deterministic state machines, custom interfaces, filter pipelines, or hardware protocols, and the dual Cortex-A9 subsystem can run control code, diagnostics, and network management. The 676-FCBGA package supports a large number of external connections and is appropriate for sophisticated rather than minimal embedded systems. A robust implementation requires manufacturer-defined power sequencing, decoupling, clocking, configuration memories, and a high-density PCB stack-up with the relevant BGA escape and routing rules.

What is the AMD XC7Z030-1FF676I?

The AMD XC7Z030-1FF676I is a Zynq-7000 Kintex-7 FPGA SoC combining dual-core ARM Cortex-A9 MPCore processing with programmable Kintex-7 logic. The matched AMD/Xilinx distributor listing identifies 125K logic cells, a 667 MHz processor configuration, CoreSight support, and a 676-FCBGA package measuring 27 mm by 27 mm. It is designed for embedded systems that need both hard-processor software control and parallel programmable-logic acceleration.

Where can I download the XC7Z030-1FF676I datasheet PDF?

The XC7Z030-1FF676I datasheet can be located through the Xilinx datasheet listing at Datasheets.com or through AMD/Xilinx product documentation. The verified search record provides the datasheet landing page at https://www.datasheets.com/xilinx/xc7z030-1ff676i. Before downloading a secondary copy, compare the document title, device ordering code, package code, revision, and date against the target assembly because the related XC7Z030-1FFG676I designation also appears throughout distributor records.

Where can I find the XC7Z030-1FF676I pinout and 676-ball map?

The XC7Z030-1FF676I pinout must be taken from the official AMD/Xilinx package drawing and the device-specific ball map; it cannot be reconstructed from the 27 mm by 27 mm package size alone. The supplied web records confirm a 676-FCBGA package for the closely indexed XC7Z030-1FFG676I, but they do not expose individual ball names. Use the official datasheet and package files before routing the PCB, assigning power rails, or checking substitute-device compatibility.

What are the key specifications of XC7Z030-1FF676I that engineers should know?

The verified AMD/Xilinx distributor description identifies the XC7Z030-1FFG676I configuration as a dual-core ARM Cortex-A9 MPCore device with CoreSight, Zynq-7000 Kintex-7 FPGA logic, 125K logic cells, a 667 MHz processor clock, and a 676-FCBGA package measuring 27 mm by 27 mm. The target ordering code XC7Z030-1FF676I is closely associated with that listing, but its complete electrical specification table and exact ordering fields are not included in the supplied records.

What is the price of XC7Z030-1FF676I?

The available verified product listing quotes the AMD XC7Z030-1FF676I from $228.6397 as of 2026-10-28. That figure comes from the eBee Electronics search result and should be treated as a reference listing rather than a guaranteed volume quotation. Digikey and Mouser links are available for additional market checks, but the supplied records do not provide complete quantity-break tables for either distributor, so the published XAIPART tiers repeat the verified reference price rather than inventing bulk discounts.

Where to buy XC7Z030-1FF676I online?

The XC7Z030-1FF676I can be sourced through AMD/Xilinx-authorized distributors, including DigiKey and Mouser, with additional marketplace listings from Octopart and eBee Electronics. The verified DigiKey record uses the closely indexed XC7Z030-1FFG676I designation, while the exact target appears in the DigiKey New Zealand, Octopart, and eBee records. Confirm the exact suffix and package code on the line item before ordering to avoid ordering a different temperature or ordering variant.

What is the lead time for XC7Z030-1FF676I?

The supplied web data does not state a verified factory lead time for the XC7Z030-1FF676I as of 2026-10-28. DigiKey's listing says the related XC7Z030-1FFG676I ships today, but that statement does not establish the lead time of the exact XC7Z030-1FF676I ordering code. Procurement should request a dated quotation and manufacturing lead-time confirmation from an authorized distributor, particularly for production releases, because FPGA SoC availability can vary by lot and distribution channel.

Is XC7Z030-1FF676I in stock?

The exact XC7Z030-1FF676I is listed as in stock by eBee Electronics in the supplied data, while the closely indexed XC7Z030-1FFG676I is marked as shipping from DigiKey. These statements do not guarantee equivalent inventory for every suffix or package code. Stock should therefore be confirmed at the distributor with the complete MPN and required date code. The structured offer uses BackOrder because the supplied records do not explicitly confirm inventory for the exact requested ordering code.

What is the best drop-in replacement for XC7Z030-1FF676I?

The closest verified candidates are same-package AMD/Xilinx Zynq-7000 ordering variants using the 676-ball FCBGA, including XC7Z030-1FFG676I, XC7Z030-2FFG676I, and XC7Z030-1FFG676C. A drop-in decision still requires verification of speed grade, temperature grade, ball assignment, supply voltages, configuration, and all supported I/O standards. AMD's support result explicitly cautions against assuming that visually similar Zynq order codes are fully compatible, so schematic and PCB review remains mandatory.

Can XC7Z030-2FFG676I replace XC7Z030-1FF676I?

The XC7Z030-2FFG676I is a plausible same-family drop-in candidate because it is listed as a 676-FCBGA Zynq-7000 device, but its higher speed grade can change timing, power, and configuration constraints. The alternative is therefore treated as a 90 percent parametric match rather than an unconditional replacement. Before substitution, compare the official ordering tables, maximum clock specifications, power limits, I/O and transceiver characteristics, and the complete ball maps against the exact target device.

What can replace XC7Z030-1FF676I on the same PCB footprint?

Same-footprint candidates identified in the verified cross-reference data are AMD/Xilinx XC7Z030-1FFG676I, XC7Z030-2FFG676I, and XC7Z030-1FFG676C, all associated with the 676-FCBGA Zynq-7000 configuration. The AMD support record warns that closely related order codes may have separately documented pinouts, so package size alone is insufficient proof. Confirm the target ball map, power rails, exposed connections, and device configuration in the manufacturer documentation before treating any candidate as a drop-in replacement.

Is XC7Z030-1FF676I the same as XC7Z030-1FFG676I?

The two orderings refer to closely related AMD/Xilinx Zynq-7000 devices, but the supplied search records use both names and do not provide the complete ordering-code definitions needed to declare them identical. The indexed XC7Z030-1FFG676I is explicitly described as a 676-FCBGA device with dual Cortex-A9 processors and 125K logic cells. Procurement should reconcile the missing G field against AMD's ordering guide and confirm that the original design was assembled around the exact target rather than the G-designated suffix.

When should I choose XC7Z030-1FF676I over a faster Zynq-7000 speed grade?

Choose the XC7Z030-1FF676I when its -1 speed grade, industrial ordering suffix, and established 676-FCBGA implementation satisfy the design without requiring a faster performance grade. A 2 or 3 speed-grade device can provide additional timing margin but may impose different power and configuration constraints. The choice should be based on worst-case timing closure, power budget, availability, and qualification requirements rather than on the ordering code alone.

Is XC7Z030-1FF676I suitable for industrial automation and communications equipment?

The XC7Z030-1FF676I is architecturally suitable for industrial automation and communications equipment because it combines a dual-core ARM Cortex-A9 processor with 125K Kintex-7 programmable logic cells. That combination supports control software, external networking functions, protocol acceleration, and time-critical parallel processing in one SoC. Suitability still depends on the device's verified operating-temperature rating, industrial qualification, electrical limits, and long-term availability, which are not fully stated in the supplied records.

What is the best cross-brand equivalent for XC7Z030-1FF676I?

No cross-brand, pin-compatible replacement is verified by the supplied data. The cross-reference search mentions broader SoC FPGA options from Intel and Microchip, but those families use different architectures, packages, and programming ecosystems and therefore are not drop-in replacements. The AMD support record also raises uncertainty about similarly ordered Zynq devices. For a cross-brand migration, treat it as a full-board redesign involving logic, processor software, toolchain, memory interface, I/O, certification, and PCB changes.

工程參考資料，適用於 XC7Z030-1FF676I — 比較、設計指引及合規資訊。

選型指南

Choose the XC7Z030-1FF676I when the original design was specified around the -1 speed grade and the I ordering suffix, and when the 667 MHz processor configuration, 125K Kintex-7 logic cells, and 676-FCBGA footprint satisfy the system requirements. Consider XC7Z030-1FFG676I when procurement needs the explicitly indexed close ordering variant, but first reconcile the G field and ball map. Use XC7Z030-2FFG676I or XC7Z030-3FFG676I when additional fabric timing margin justifies the changed speed-grade power and timing constraints. XC7Z030-1FFG676C may be considered when commercial-temperature operation is acceptable, because the suffix difference can make it unsuitable for an industrial-temperature design. No cross-brand drop-in replacement is verified; Intel, Microchip, and other SoC FPGA options require a new PCB, toolchain, and design architecture rather than substitution.

與替代品比較

參數	本產品	XC7Z030-1FFG676I	XC7Z030-2FFG676I	XC7Z030-1FFG676C	XC7Z030-2FFG676C	XC7Z030-3FFG676I
Brand	AMD	AMD	AMD	AMD	AMD	AMD
Package	676-FCBGA (27 mm x 27 mm)	676-FCBGA (27 mm x 27 mm)	676-FCBGA (27 mm x 27 mm)	676-FCBGA (27 mm x 27 mm)	676-FCBGA (27 mm x 27 mm)	676-FCBGA (27 mm x 27 mm)
Device Family	Zynq-7000 Kintex-7 FPGA SoC	Zynq-7000 Kintex-7 FPGA SoC	Zynq-7000 Kintex-7 FPGA SoC	Zynq-7000 Kintex-7 FPGA SoC	Zynq-7000 Kintex-7 FPGA SoC	Zynq-7000 Kintex-7 FPGA SoC
Processor Configuration	Dual-core ARM Cortex-A9 MPCore	Dual-core ARM Cortex-A9 MPCore	Dual-core ARM Cortex-A9 MPCore	Dual-core ARM Cortex-A9 MPCore	Dual-core ARM Cortex-A9 MPCore	Dual-core ARM Cortex-A9 MPCore
Speed Grade	-1	-1	-2	-1	-2	-3
Ordering Suffix	I	I	I	C	C	I

主要差異化特點

Directly indexed industrial ordering variant (對比XC7Z030-1FFG676I)
Higher speed grade in the same package family (對比XC7Z030-2FFG676I)
Commercial suffix option for cost-sensitive sourcing (對比XC7Z030-1FFG676C)
Maximum timing-grade option in the same family (對比XC7Z030-3FFG676I)

設計說明

Treat the XC7Z030-1FF676I as a high-density 676-FCBGA design and use only the official AMD/Xilinx escape-routing and ball-map files. The supplied data confirms a 27 mm by 27 mm package but does not provide individual ball assignments. Preserve the recommended ball and row geometry, via-in-pad requirements, solder-mask and paste apertures, and layer-transition rules rather than deriving them from a generic BGA template.

Verify the exact device power rails, current limits, sequencing rules, and decoupling values from the official documentation. The 667 MHz processor and 125K-cell FPGA configuration can make power integrity and thermal performance central to the design. Use the manufacturer-recommended power architecture and placement for high-current and sensitive supply balls; no exact voltage or capacitor values are included in the supplied records, so guessed values should not be used.

Do not treat XC7Z030-1FF676I and XC7Z030-1FFG676I as interchangeable merely because search results use both names, and do not assume that all 676-ball Zynq variants have interchangeable pinouts. AMD's support record specifically questions compatibility between related orderings. Before substitution, compare the ordering table, complete ball maps, supply voltages, exposed connections, configuration method, and every supported I/O standard against the original design.

Complete a thermal budget using actual processor activity, FPGA utilization, I/O loading, board copper, airflow, and the validated power data for the selected ordering code. The 667 MHz processor listing is not a thermal rating, and the supplied data does not include junction-temperature limits or package thermal resistance. Validate the assembled board in its intended enclosure and use the manufacturer's power estimator or supported engineering models rather than extrapolating from processor frequency alone.

Plan high-speed routing only after identifying the actual interfaces enabled in the selected device and package. The supplied records do not disclose transceiver lane counts, maximum data rates, I/O standards, or ball assignments, so generic impedance rules are insufficient. Use the official pinout and timing information, account for package and PCB loss, and perform appropriate pre-layout and post-layout signal-integrity analysis for memory, high-speed serial, and other critical interfaces.

合規資訊

RoHS

Unknown

REACH

Unknown

AEC-Q100

Unknown

無鉛

Unknown

無鹵

Unknown

衝突礦產

Unknown

The supplied distributor records do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for the exact XC7Z030-1FF676I. These fields remain unknown rather than being inferred from the manufacturer or package name.

資料驗證日期： 2026-10-28 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Distributor, Manufacturer Datasheet, Octopart, Manufacturer Datasheet, Distributor, Octopart, Distributor, Distributor, Distributor, Octopart, Distributor, Distributor, Octopart, Distributor, Manufacturer Product Page, Distributor, Octopart