XCKU3P-2FFVB676I - Kintex UltraScale+ FPGA | AMD
N.º da peça: XCKU3P-2FFVB676I ✓ AtivoXCKU3P-2FFVB676I Visão geral
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior can be configured after manufacture. FPGAs occupy the programmable-logic portion of the semiconductor hierarchy, combining large parallel processing resources with programmable interconnect. This makes them useful for demanding digital systems that benefit from hardware parallelism, deterministic interfaces, and field-updatable functionality.
The most prominent catalog characteristics are the 280 I/O, the -2 performance grade, and the FCBGA-676 package. The Kintex UltraScale+ designation identifies a high-end AMD/Xilinx FPGA platform, while the KU3P device designation distinguishes the specific configuration within that platform. The -2 suffix selects a particular speed grade, allowing designers to match device timing expectations to a particular system-performance target.
The FCBGA-676 package provides a dense, board-level mounting solution with hundreds of connection points. Because such packages contain many power, ground, signal, configuration, and differential I/O balls, the PCB must use a qualified footprint, controlled escape routing, and careful power-plane distribution. AMD also publishes UltraScale package pinout files in TXT and CSV formats, with the file format described in UG575.
Typical applications include high-speed signal processing, industrial control, communications infrastructure, test and measurement, embedded vision, and acceleration functions requiring substantial parallel programmable logic. The large I/O count supports systems that need numerous parallel connections, while the Kintex UltraScale+ resource level is suited to consolidated control and datapath designs rather than simple low-complexity programmable logic.
A key design consideration is that this is a high-pin-count BGA device requiring careful escape routing, layer planning, decoupling, and thermal management. Do not assign package balls solely from a catalog page; use the AMD UltraScale package pinout files and the device-specific documentation for every power, ground, configuration, and I/O connection before release.
This page organizes the exact order code, package information, verified specifications, purchase and lead-time guidance, package-related constraints, and engineering selection considerations. It also distinguishes catalog-confirmed attributes from detailed electrical, timing, and pin-level information that must be established from the appropriate AMD documentation and the final system design.
Alternativas drop-in para XCKU3P-2FFVB676I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XCKU3P-2FFVB676I (mesmo formato e footprint) — diferindo em Package, Device Type, Mounting Type, Speed Grade, Logic Cells.
XCKU3P-1FFVB676I
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XCKU3P-1FFVB676E
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XCKU3P-2FFVA676I
✅ Drop-InConsulte o preço
Ver ficha técnica →XCKU3P-2FFVB676E
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →XCKU3P-2FFVB676I Classificações máximas e características elétricas
| Device Type | Kintex UltraScale+ field-programmable gate array (FPGA) |
| Product Type | FPGA IC |
| Manufacturer | AMD |
| Series | Kintex UltraScale+ |
| Device Designation | KU3P |
| Speed Grade | -2 |
| Logic Cell Count | 162,720 cells |
| Input/Output Count | 280 I/O |
| Package Type | FCBGA-676 |
| Package Format | 676-BBGA, FCBGA |
| Programmability | Field-programmable digital logic |
| Temperature Grade | Industrial grade |
Guia de Configuração de Pinos do XCKU3P-2FFVB676I 676-bbga, fcbga
Configuração de pinos para XCKU3P-2FFVB676I (pacote 676-bbga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para XCKU3P-2FFVB676I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
XCKU3P-2FFVB676I é adequado para 6 aplicaçãos: High-Speed Communications Infrastructure, Industrial Control and Automation, Embedded Vision and Image Processing, Test and Measurement Systems, Aerospace and Defense Systems, Data-Center Acceleration and Storage.
High-Speed Communications Infrastructure
The XCKU3P-2FFVB676I fits communications infrastructure designs that require substantial parallel programmable logic and a high I/O count. Its Kintex UltraScale+ KU3P configuration provides 162,720 logic cells, while the -2 speed grade supports timing-focused implementations and the 280 I/O support numerous parallel interfaces. Engineers can use the programmable fabric for packet handling, interface bridging, test logic, and control functions around high-speed SerDes resources. The principal design consideration is package complexity: all 676 balls require controlled escape routing, and power delivery must be planned for a device with numerous supply connections. Timing closure should include the selected transceiver configuration, board-level skew, and the difference between -2 and alternative -1 implementations before the order code is frozen.
Recomendado
Industrial Control and Automation
The XCKU3P-2FFVB676I is suitable for industrial automation systems that combine deterministic control, communications, and extensive parallel I/O. The 280 available I/O can support machine-control signals, sensor aggregation, actuator interfaces, and industrial networking logic, while the 162,720-cell KU3P architecture allows control and datapath functions to be consolidated. The -2 grade is appropriate when the control design benefits from additional timing headroom over a -1 implementation. Because the part is identified as industrial grade, engineers must still confirm the exact temperature limits and any application-specific qualification requirements. Layout should reserve continuous power and ground planes, minimize high-speed escape-path length, and follow AMD’s package-specific pinout files rather than assigning connections from a generic BGA symbol.
Recomendado
Embedded Vision and Image Processing
The XCKU3P-2FFVB676I supports embedded vision designs that require parallel image pipelines, sensor-interface logic, buffering, and control functions in one programmable device. Its 162,720 logic cells provide substantial implementation capacity, and the 280 I/O offer many lanes for parallel sensors, capture logic, and external memory interfaces. The -2 speed grade can improve timing margin in pixel-processing pipelines where latency and clock frequency are important. FPGA architecture selection must account for whether the design primarily uses general logic, block RAM, DSP, or dedicated I/O resources. PCB implementation requires careful partitioning of high-speed and low-speed signals, solid decoupling around every supply ball group, and verification of package orientation and ball mapping using AMD’s FFVB676 documentation.
Recomendado
Test and Measurement Systems
The XCKU3P-2FFVB676I fits programmable test and measurement systems requiring many acquisition channels, timing control, pattern generation, and analysis logic. The 280 I/O support parallel interfaces and control channels, while the high-capacity KU3P fabric can combine multiple measurement functions without relying on numerous fixed-function devices. Its -2 speed grade is valuable in designs where clocking, acquisition latency, and internal timing closure are critical. Engineers should use the exact device timing and power information to select clocking resources and I/O standards. The FCBGA-676 package also makes power integrity important: use a qualified footprint, stitch supply and ground balls into adjacent planes, and isolate noisy external circuitry where practical to reduce coupling into precision measurement channels.
Recomendado
Aerospace and Defense Systems
The XCKU3P-2FFVB676I can support aerospace and defense system functions that require extensive programmable logic, modular interfaces, and deterministic digital behavior. The KU3P architecture’s 162,720 logic cells and 280 I/O can support data acquisition, command processing, interface control, and fault-monitoring logic. The -2 speed grade may provide useful timing margin, but the exact operating-temperature range, radiation-tolerance status, lifecycle documentation, and qualification evidence must be checked before using the device in a flight or mission-critical program. Because the catalog description establishes industrial grade rather than a specialized aerospace qualification, engineers should not infer additional certification from the product family name. The design should include complete pin assignment, power-decoupling, thermal-analysis, and configuration-security reviews.
Recomendado
Data-Center Acceleration and Storage
The XCKU3P-2FFVB676I can serve as an FPGA-based accelerator or interface controller in data-center, server, and storage systems where programmable pipelines provide an advantage over fixed hardware. Its 162,720-cell KU3P fabric can support data movement, protocol conversion, compression, analytics, or storage-interface control, while 280 I/O accommodate wide data paths and control channels. The -2 speed grade is relevant when internal timing or external interface closure is demanding. Resource selection should account for block RAM, DSP, transceiver, and I/O requirements rather than relying only on logic-cell count. PCB design must address the FCBGA-676 package with high-speed loss-controlled routing, robust power distribution, and extensive validation against the selected board stack-up.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XCKU3P-2FFVB676I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XCKU3P-1FFVB676I | XCKU3P-1FFVB676E | XCKU3P-2FFVA676I | XCKU3P-2FFVB676E |
|---|---|---|---|---|---|
| Package | FCBGA-676 | FCBGA-676 | FCBGA-676 | FCBGA-676 | FCBGA-676 |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Device Designation | KU3P | KU3P | KU3P | KU3P | KU3P |
| Speed Grade | -2 | -1 | -1 | -2 | -2 |
| Package Code | FFVB676 | FFVB676 | FFVB676 | FFVA676 | FFVB676 |
| Temperature Suffix | -I | -I | -E | -I | -E |
| Programmable Device Type | FPGA | FPGA | FPGA | FPGA | FPGA |
Principais diferenciais
- Maintains the -2 speed grade while offering a same-family package-code migration path (vs XCKU3P-2FFVA676I)
- Higher speed grade than the -1 FFVB676 alternatives (vs XCKU3P-1FFVB676I)
- Industrial -I ordering suffix within the same FFVB676 package family (vs XCKU3P-1FFVB676E)
- Preserves the -2 grade and FFVB676 package code (vs XCKU3P-2FFVB676E)
Notas de projeto
Use the AMD FFVB676 package files to create the footprint, escape routing, and ball assignments. A 676-ball device should not be routed from a generic BGA outline: verify body dimensions, ball diameter, pitch, ball-map orientation, and exposed or omitted-ball details. Place the decoupling network directly at the corresponding supply and ground balls and provide uninterrupted reference-plane distribution beneath the device.
Plan the complete power-delivery network around every documented VCCINT, VCCAUX, VCCBRAM, and VCCO connection, using the voltage assignments and decoupling recommendations from the device documentation. Separate planes or tightly coupled distribution structures can reduce return-path impedance and switching noise. Validate the design with power-integrity analysis because the FCBGA-676 footprint presents many simultaneous power and ground connections.
Estimate junction temperature from total device power, package thermal resistance, ambient temperature, board copper, airflow, and the thermal design of adjacent components. Use the package-specific thermal data rather than a generic BGA assumption. Where the calculated operating margin is limited, increase board copper area, improve through-via spreading, control airflow, or reduce activity in power-hungry FPGA blocks.
Do not substitute an order code solely because it has 676 balls or the same KU3P designation. Speed-grade changes can affect timing, temperature-suffix changes can affect environmental qualification, and FFVA versus FFVB package codes can affect footprint or ball-level compatibility. Re-run synthesis timing, pin assignment, PCB comparison, power, thermal, and qualification checks for every proposed substitution.
Preserve continuous return paths beneath high-speed routes and keep escape geometry consistent across matched interfaces. Account for the complete package-and-board channel, including BGA transition effects, when applying external I/O timing constraints. Use spread-spectrum clocking only if supported and validated for the selected design, and confirm that configuration, clock, reset, and reference inputs meet their required rise, fall, and timing constraints.
Informações de conformidade
The order code identifies an industrial-grade device, but no RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals evidence was identified. AEC-Q100 is therefore not qualified. The -I suffix is an ordering designation and must not be treated as proof of automotive qualification.
