FPGA и CPLD
Товары (6666)
10M08DCF256A7G - MAX 10 FPGA 8K LE, 256-BGA, Automotive | Intel
The Intel (formerly Altera) MAX 10 FPGA 10M08DCF256A7G is a non-volatile, low-power field-programmable gate array integrating 8,000 logic elements, 387,072 bits (378 Kbit) of embedded SRAM, and a 1.2 V core supply in a 256-ball FineLine BGA package. It belongs to the MAX 10 family, the industry's first non-volatile FPGA with integrated ADC and instant-on capability, and this specific OPN carries the F256 package code, automotive temperature grade, and -7 speed grade targeting high-volume automotive and industrial designs. What is a MAX 10 FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be re-programmed to implement arbitrary digital logic. The MAX 10 family extends the legacy MAX CPLD lineage by adding true FPGA fabric with on-die flash configuration memory, eliminating the external boot PROM required by SRAM-based FPGAs. Within Intel's programmable logic hierarchy, MAX 10 sits below Cyclone and above MAX II/V CPLDs, targeting glue logic, I/O expansion, motor control, and instant-on system management. The 10M08 variant is the smallest logic-density option in the family, optimized for cost-sensitive designs that exceed traditional CPLD capability. Key specifications include 8,000 logic elements (LEs), 378 Kbit embedded memory (M9K blocks), 178 user I/Os, a 55 nm process node, a 1.2 V core, and integrated dual-configuration flash. The device supports LVCMOS, LVDS, SSTL, and RSDS I/O standards with hot-socketing capability, and contains a built-in 12-bit ADC, temperature-sensing diode, and PLLs for clock management. Typical applications include automotive body electronics, industrial motor control, factory automation I/O expansion, video bridging and display control, and portable medical instrumentation. The integrated flash and instant-on feature suit safety-critical boot designs, while the on-die ADC simplifies sensor fusion. Designers should plan for 256-ball BGA PCB escape routing and supply decoupling close to every GND/VCC pair; the Quartus Prime Lite toolchain supports the full MAX 10 family free of charge for evaluation and small-volume production.
10M08DCF256C8G - MAX 10 FPGA, 8K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M08DCF256C8G is a MAX 10 family Field-Programmable Gate Array (FPGA) integrating 8,000 logic elements (LE), 387,072 bits of embedded SRAM (approximately 378 Kbits user flash plus block memory), and 178 user I/O pins in a 256-ball FineLine BGA (F256) package. It is built on TSMC 55 nm embedded flash process technology, which uniquely enables instant-on, non-volatile configuration without an external boot PROM. The device also integrates a dual 12-bit successive-approximation ADC with up to 17 external analog inputs, a hard Nios II soft-core capable controller, and on-chip temperature-sensing diodes that simplify board-level thermal management. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LUTs, flip-flops, DSP blocks, block RAM) connected by a programmable routing fabric. Unlike an ASIC, an FPGA's function is defined at compile time and re-loaded on every power-up, making it ideal for prototyping, low-volume production, and designs that must evolve in the field. Within the broader taxonomy, the MAX 10 sits in the low-power, non-volatile FPGA category: FPGA -> non-volatile FPGA -> CPLD-replacement FPGA -> MAX 10 family -> Intel FPGA portfolio. This positioning makes it well suited as a bridge between traditional CPLDs and higher-density Cyclone series FPGAs. Key features include 8K logic elements, 378 Kbits of user flash memory, 8 dedicated 18x18 multipliers, two I/O banks with LVDS support, and an integrated ADC block. The device operates across the industrial temperature range (-40C to +100C ambient for the C8 speed grade) and supports core voltages of 1.2 V with multi-voltage I/O banks (1.2 V to 3.3 V) for direct interface to legacy 5 V-tolerant peripherals via resistor dividers. Architecturally, MAX 10 FPGAs embed configuration flash on-die, eliminating the need for a separate boot memory and reducing bill-of-material cost. Designers access the device through the Intel Quartus Prime design software, which supports schematic, VHDL, Verilog, and SystemVerilog entry. Configuration is via JTAG, AS (Active Serial), or internal flash load modes. The C8 speed grade is the commercial temperature grade at the slowest speed bin, which keeps unit cost low while still supporting design frequencies up to approximately 200 MHz for typical logic paths. Typical applications include industrial motor and motion control, factory automation I/O expansion, video bridging and display controllers, low-cost protocol bridging (UART/SPI/I2C to Ethernet), portable test and measurement, and consumer IoT edge nodes. The integrated ADC also makes the part attractive for sensor aggregation and battery-management front-ends in space-constrained embedded designs. When designing with the 10M08DCF256C8G, pay close attention to the 256-ball BGA fanout: at 1.0 mm pitch, four-layer PCB manufacturing with microvias is recommended. Use the Quartus Prime pin planner to assign I/O bank voltages before finalizing the schematic, and decouple every VCCINT/VCCA/VCCIO rail with 0.1 uF plus 10 uF capacitors placed within 5 mm of the ball. This page synthesizes current distributor pricing, same-package alternatives from the MAX 10 family, and practical PCB design notes that are not aggregated on any single distributor or manufacturer page.
10M08DCF256I7G - MAX 10 FPGA, 8K LE, 256-FBGA | Intel
The Intel 10M08DCF256I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and 178 user I/O into a 256-pin FineLine BGA (FBGA) package. Built on TSMC 55nm NOR-flash-backed process technology, this single-chip FPGA delivers instant-on capability with on-die configuration flash, eliminating the need for external boot PROM in most designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built from configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can reconfigure after manufacturing to implement custom digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the programmable-logic hierarchy, offering parallel processing, deterministic timing, and hardware-level flexibility that microcontrollers cannot match. The MAX 10 family targets low-power, cost-sensitive applications that still need the parallelism and I/O flexibility of programmable logic, such as industrial control, I/O expansion, and bridge/protocol conversion. Key features of the 10M08DCF256I7G include an integrated ADC (up to 12-bit at 1 MSa/s), on-chip dual-configuration flash for field upgrades, support for LPDDR2/DDR3/DDR3L external memory interfaces, and an operating junction temperature range of -40C to +100C (industrial grade). The device also integrates a hard Nios II soft-core-capable controller fabric, embedded multipliers (24x18 DSP blocks), and up to 178 general-purpose I/O with LVDS support, making it suitable for glue-logic, sensor aggregation, and motor-control front-ends. The MAX 10 architecture pairs a LUT-based logic fabric with distributed and block RAM (M9K blocks), dedicated 18x18 multipliers, and a hardened memory controller subsystem. The 256-FBGA package exposes all major I/O banks with 1.2V/2.5V/3.3V-compatible LVCMOS/LVDS interfaces, supporting dual-boot configuration from on-chip flash and partial reconfiguration in the field. Compared with SRAM-based FPGAs, MAX 10's flash-backed configuration eliminates external boot memory, reducing BOM cost and board area. Typical applications include industrial machine vision pre-processing, multi-protocol bridge chips (UART-to-SPI, I2C-to-parallel), motor control and drive signal generation, low-cost video processing, factory sensor aggregation, and consumer appliance control. The integrated 12-bit ADC makes it especially attractive for analog sensor front-ends where a separate MCU ADC would be required. When designing with the 10M08DCF256I7G, allocate sufficient decoupling (100nF + 10uF per power rail) and follow Intel's recommended PCB layout for the FBGA escape, paying particular attention to the VCCIO bank voltage grouping to avoid simultaneous-switching noise on sensitive analog inputs to the on-die ADC. This page synthesizes distributor pricing, drop-in alternative MPNs, package-level comparison, and practical design notes that complement the official Intel MAX 10 datasheet and ordering guide.
10M08DCF484C8G - MAX 10 FPGA, 8K LEs, 484-BGA | Intel
The Intel 10M08DCF484C8G is a MAX 10 Field-Programmable Gate Array (FPGA) from the Altera MAX 10 family, integrating 8,000 logic elements, 378 Kbits of embedded memory (M9K), and 250 user I/O pins in a 484-ball FineLine BGA package. Built on TSMC's 55 nm embedded NOR flash process, this non-volatile FPGA combines programmable logic with on-die flash configuration memory, eliminating the need for an external boot PROM and enabling instant-on operation. The -C8 speed grade targets commercial temperature operation with optimized timing closure. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure post-manufacture to implement custom digital circuits. MAX 10 FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) within the Intel/PSG portfolio, below Cyclone and above legacy MAX II/MAX V families. They integrate analog blocks (ADC), dual-configuration flash, and on-chip voltage regulators, bridging the gap between small CPLDs and high-density FPGAs. Key features include 1.4 Gbps LVDS support, up to 16 global clocks with PLL phase shifting, 1.2 V core voltage operation, and dual-configuration flash allowing fail-safe field upgrades. The device integrates 2 PLLs, embedded 12-bit ADC blocks, and supports DDR3/DDR3L/LPDDR2 external memory interfaces via hardened memory controllers. Per-pin LVDS, emulated LVDS, and 1.0/1.2/1.5/1.8/2.5/3.3 V LVCMOS I/O standards are supported. Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements each, with adaptive logic modules (ALMs) containing 8-input fracturable look-up tables (LUTs), dedicated carry chains, and register chains. The embedded flash is organized as two configuration sectors (CF0, CF1) plus dual-boot capability, enabling remote update without external components. User flash memory (UFM) is also accessible from the logic fabric for non-volatile parameter storage. Typical applications include industrial motor control, factory automation PLCs, video bridging and protocol conversion, low-cost ASIC replacement, and embedded control with on-board analog sensing. The integrated 12-bit ADC and instant-on flash make it particularly attractive for system-on-module (SoM) designs where BOM minimization matters. When designing with this device, ensure the Quartus Prime software version supports the -C8 speed grade timing models, and validate pinout assignments against the 484-FBGA ball map. Thermal management is critical: at full toggle rate the device can dissipate several watts, requiring adequate copper on the PCB. This page consolidates distributor pricing, drop-in same-package alternatives, and Quartus Prime design considerations not present in the standalone datasheet - saving engineers BOM validation time.
10M08DCF484I7G - MAX 10 FPGA, 8K LE, 250 I/O, 484-FBGA | Intel
The Intel 10M08DCF484I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) featuring 8,000 logic elements, 387,072 bits of embedded memory, and 250 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. As a member of Intel's MAX 10 family, it integrates flash configuration memory on-chip, enabling instant-on functionality without an external boot PROM. The device combines programmable logic, analog-to-digital conversion, and dual-configuration flash in a single die, delivering a system-on-chip FPGA for cost-sensitive, low-power applications. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program to implement arbitrary digital circuits, glue logic, state machines, or full processor subsystems. FPGAs sit above microcontrollers in flexibility but below ASICs in per-unit cost, making them ideal for low-to-mid-volume designs, hardware prototyping, hardware-accelerated signal processing, and industrial I/O expansion. The MAX 10 family specifically targets applications that previously required a discrete MCU plus a CPLD plus an ADC. Key features of the 10M08DCF484I7G include 8 K logic elements, 378 Kbits of user flash memory, an integrated 12-bit ADC, on-chip temperature sensor, and dual-configuration flash that supports remote field updates. The device supports LVDS, LVCMOS, SSTL, and other I/O standards, and provides up to 250 general-purpose I/O pins. Configuration is instantaneous because the configuration bitstream is stored in on-die flash rather than an external serial PROM. Hard IP blocks include PLLs, embedded memory blocks (M9K), and multiplier blocks (18x18). Power supplies require a 1.2V core rail plus 2.5V/3.3V auxiliary rails. Typical applications include industrial machine vision and motor control, factory automation I/O expansion, video bridging and display controllers, low-cost software-defined radio (SDR) front ends, test and measurement instruments, and bridge/replacement of legacy discrete logic. The integrated ADC is often used for monitoring power rails or sensor inputs directly inside the FPGA, eliminating a separate analog front-end IC. When designing with the 10M08DCF484I7G, pay attention to the FBGA484 ball-pitch (1.0 mm) PCB escape routing: at least 4 routing layers with microvias are recommended for fan-out. Use Intel Quartus Prime Lite or Standard Edition for design entry; the 484-FBGA package has a substantial 23x23 mm footprint that requires careful power-plane segmentation between 1.2V core and 3.3V I/O domains. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 and Cyclone 10 families, and practical design notes not found in the manufacturer datasheet alone.
10M08DCU324A7G - MAX 10 FPGA, 8K LE, 324-LFBGA | Intel
The Intel 10M08DCU324A7G is a non-volatile FPGA from the MAX 10 family featuring 8,000 logic elements (LE), 246 Kbit embedded memory, and 387,072 total user flash memory bits in a 324-pin LFBGA (U324) package. It is built on a 55 nm TSMC process and supports supply voltages of 1.15 V to 1.25 V core with internal configuration via on-die flash. The device is AEC-Q100 qualified and rated for automotive grade with an industrial operating temperature range of -40 C to +125 C. A maximum internal clock frequency of 382 MHz is supported according to the manufacturer datasheet. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic fabric can be reconfigured by the designer after manufacturing, in contrast to an ASIC whose function is fixed at tape-out. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits -> semiconductors. MAX 10 devices are non-volatile FPGAs with on-die flash configuration memory, distinguishing them from SRAM-based competitors that require external boot flash. Key features include integrated 12-bit ADC blocks, on-chip flash for instant-on configuration, dual-configuration flash support, and DSP blocks in selected variants. The U324 package exposes up to 246 user I/O with mixed-voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) on user I/O banks. The device integrates phase-locked loops (PLLs) for clock management and includes embedded SRAM blocks distributed across the fabric. The MAX 10 architecture employs logic-array blocks (LABs) each containing 16 logic elements, interconnected by a multi-level routing hierarchy with embedded multiplier blocks and RAM blocks. The non-volatile configuration memory enables single-chip FPGA operation without external boot PROMs, simplifying board design and reducing BOM cost. Typical applications include industrial motor control, automotive body electronics, sensor aggregation, display controllers, low-cost video processing, and I/O expansion bridges. The AEC-Q100 qualification makes the device particularly suitable for under-hood and body-control applications where temperature extremes are routine. When designing with the 10M08DCU324A7G, ensure that the chosen variant matches the I/O bank voltage mix required by your design. The internal configuration time after power-on is typically sub-100 ms because configuration is read from on-chip flash rather than an external serial PROM, which simplifies power-sequencing requirements. This page synthesizes distributor pricing, drop-in alternative MAX 10 same-family variants, and practical design notes not collected in a single section of the manufacturer datasheet.
10M08DCU324I7G - MAX 10 FPGA, 8K LE, U324 BGA | Intel
The Intel 10M08DCU324I7G is a member of the MAX® 10 family of non-volatile FPGAs, integrating 8,000 logic elements (LEs), 246 Kbits of embedded SRAM, and 387,072 bits of user flash memory into a single 324-pin Ultra FineLine BGA (UFBGA / U324) package. Built on TSMC's low-power 55nm NOR flash-based process, the device features on-die dual-configuration flash, an integrated 12-bit successive-approximation analog-to-digital converter (ADC), and a built-in PLD-style instant-on capability, making it suitable for system management, I/O expansion, and industrial control roles that previously required a CPLD plus a discrete MCU. A field programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that can be re-programmed to implement arbitrary digital logic. FPGAs occupy a unique position in the silicon hierarchy between fixed-function ASICs and software-driven microcontrollers: they deliver parallel hardware performance and deterministic latency without the NRE cost of an ASIC, while providing far more flexibility than a microcontroller for custom I/O timing, wide datapaths, or high-speed interface bridging. The MAX 10 family specifically targets low-power, small-form-factor, and cost-sensitive applications that benefit from non-volatile instant-on behavior. Key specifications of the 10M08 include up to 246 user I/Os, an embedded 12-bit ADC with up to 18 analog inputs, on-die temperature-sensing diode, hardware multipliers, and a 3.3 V core / LVCMOS I/O architecture supporting LVDS, LVTTL, and LVCMOS standards. The device supports configuration via JTAG, internal flash, or external host, and includes user flash memory (UFM) for non-volatile data storage such as calibration constants or serial numbers. The architecture pairs a 4-input look-up table (LUT) based logic fabric with embedded memory blocks (M9K), 18x18 multipliers, and a programmable interconnect network. The integrated ADC samples at up to 1 MSa/s in single-ended mode, while dual-boot flash enables fail-safe field updates. Compared with SRAM-based competitors, the on-die flash removes the need for an external boot PROM, reducing BOM cost and board area by roughly one to two square centimeters. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image aggregation, low-cost PCIe endpoint prototyping, and system management in telecom or server backplanes. The on-die flash and instant-on capability also make the device attractive for use as a replacement for legacy CPLDs plus discrete ADCs in power-sequencing, fan control, and board-management controller designs. When designing with this device, pay attention to UFBGA-324 PCB layout requirements: microvia or via-in-pad technology is recommended for the 0.8 mm ball pitch escape, and at least four routing layers with a continuous ground plane are required to maintain signal-integrity margins on LVDS and DDR interfaces. Quartus Prime (Lite or Standard edition) is the supported development environment for synthesis, place-and-route, and programming. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical layout notes not collated on a single manufacturer page, helping engineers shorten the bill-of-materials evaluation cycle.
10M08DCV81C7G - MAX 10 FPGA, 8K LE, 81-UFBGA | Altera / Intel
The Altera (Intel) 10M08DCV81C7G is a MAX 10 family field-programmable gate array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory (RAM), and 56 (18x18) hardware multipliers, housed in an 81-ball Ultra-Fine-Pitch Ball Grid Array (UFBGA, WLCSP) package. It is fabricated on a 55 nm TSMC process and operates from a 1.2 V core supply with integrated dual-configuration flash and analog-to-digital converter (ADC) blocks. A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers and block RAM that the user defines via a hardware description language (HDL). Within the broader taxonomy, the 10M08 belongs to Altera/Intel's MAX 10 family, which sits below Cyclone V/10 and above legacy MAX II/MAX V CPLDs; it is a non-volatile, flash-based FPGA targeting low-power, instant-on, and cost-sensitive applications that previously required CPLDs or small ASICs. Key differentiating features of this part include 1.2 V core operation, integrated 12-bit SAR ADC support, on-chip dual-configuration flash allowing instant-on behavior, and the very small 81-ball WLCSP/UFBGA footprint. It is also lead-free and RoHS-compliant, suitable for industrial temperature operation, and provides hardened peripherals (PLL, I/O buffers, JTAG) without requiring external configuration memory. Architecturally, MAX 10 devices combine a LUT-based logic fabric with 18x18 multipliers, M9K block RAM, a hardened ADC subsystem, and on-die flash for configuration. The 8K LE variant occupies the lower-density end of the family (2K, 4K, 8K, 16K, 25K, 40K, 50K), making it ideal for glue-logic, sensor aggregation, and low-cost I/O expansion. Typical applications include industrial motor and process control, consumer display controllers, I/O expansion for microcontrollers, sensor hubs, and portable/handheld embedded systems. The combination of small package, integrated ADC, and instant-on flash makes it well-suited to compact, power-constrained designs. When designing with this part, ensure the WLCSP/UFBGA land pattern is correctly fabricated because the 0.4 mm-or-finer ball pitch requires precise PCB stencil design and reflow profile. Verify Quartus Prime device support, JTAG chain, and dual-boot image configuration during board bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical design notes not aggregated on any single distributor product page.
10M08DCV81I7G - MAX 10 FPGA, 8K LE, 81-WLCSP | Intel / Altera
The Intel / Altera (formerly Altera) 10M08DCV81I7G is a MAX 10 family Field-Programmable Gate Array (FPGA) housed in an 81-ball Wafer-Level Chip-Scale Package (WLCSP) and offering 8,000 logic elements, 387,072 bits of embedded user flash, and 56 maximum user I/O pins. As a non-volatile FPGA, it integrates a dual-configuration flash array and instant-on support directly on-die, eliminating external boot PROM and shortening power-to-active latency. The device operates across industrial temperature ranges and is built on a low-power process that targets glue-logic, I/O expansion, and bridge functions. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose digital logic functionality is defined by the user after manufacture, via a hardware description language (HDL) and a configuration bitstream. In the broader component taxonomy, an FPGA belongs to programmable logic devices (PLD), which in turn belong to digital logic ICs, under the integrated circuit hierarchy. MAX 10 occupies a niche between small CPLDs and higher-density SRAM-based FPGAs by offering on-chip flash, analog blocks, and DDR3 support in a single chip. Key features of the 10M08DCV81I7G include 8K logic elements, 387 Kbits user flash, 56 maximum user I/Os, integrated ADC (12-bit SAR), and on-chip dual-configuration flash with instant-on capability. The 81-WLCSP package is the smallest form factor in the MAX 10 family, enabling extremely compact board layouts for space-constrained products such as wearables, sensor modules, and portable instrumentation. I/O support includes LVDS, LVCMOS, SSTL, and RSDS, simplifying interface to common DDR memory and CMOS peripherals. The MAX 10 architecture combines an SRAM-backed logic fabric with non-volatile flash for configuration storage. This hybrid design lets the device retain its bitstream through power cycles without external boot devices, a meaningful architectural distinction from Cyclone or Stratix families that rely on external flash. Designers use Quartus Prime software for HDL capture, synthesis, place-and-route, and bitstream generation. The device also supports JTAG, AS, and PS configuration modes for in-system programming. Typical applications include I/O expansion and bridging (I2C/SPI to parallel, UART multiplexing), industrial control and motor drive glue logic, sensor aggregation hubs, portable medical and consumer wearables, and low-cost video processing. Its small footprint and integrated flash make it attractive when board area and BOM cost dominate over raw logic density. In designs that previously required a CPLD plus discrete ADC, a single MAX 10 device can replace both functions. When designing with this part, pay attention to the WLCSP assembly process: it requires PCB pad finishing, underfill, and careful reflow profile control. The 56 user I/Os are arranged across multiple I/O banks with mixed voltage tolerance; verify each bank's VCCIO supply matches the connected peripheral logic before routing. Designers should also plan for Quartus Prime licensing and reference the MAX 10 device handbook for timing closure guidance. This page consolidates distributor pricing, verified specifications, drop-in same-package alternatives, and practical design notes in one place, saving engineers from cross-referencing multiple distributor listings and datasheet documents.
10M08DFV81C8G - MAX 10 FPGA, 8K LE, 81-WLCSP | Altera / Intel
The Intel (formerly Altera) MAX 10 10M08DFV81C8G is a non-volatile FPGA from the MAX 10 family, integrating 8,000 logic elements, 387,072 bits of embedded user flash memory, and 56 (18x18) hardware multipliers in a compact 81-ball WLCSP package. Built on TSMC's 55 nm embedded flash process, the device operates from a single 1.2 V core supply with LVCMOS/LVDS I/O support, eliminating the need for an external configuration memory. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the designer after manufacture. Within the broader taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable compute fabrics. The MAX 10 family specifically integrates a dual-configuration flash, analog-to-digital converters, and SRAM into a single chip, bridging the gap between traditional CPLDs and higher-density Cyclone-series FPGAs. Key features of the 10M08DFV81C8G include 8,000 logic elements, 56 embedded 18x18 multipliers, 378 Kbits of block RAM, integrated ADC, and instant-on support from on-die flash. The device supports commercial temperature grade (0C to +85C) with a speed grade 8 core. The 81-ball WLCSP (Wafer Level Chip Scale Package) delivers the smallest footprint in the MAX 10 portfolio for space-constrained designs. Typical applications include industrial motor control, IoT sensor hubs, low-cost video processing, and portable instrumentation. The integrated ADC makes it well suited for data acquisition front-ends, while the embedded multipliers enable DSP pipelines such as FFTs and digital filters. When designing with this part, engineers should review Quartus Prime device pin-out files for the V81 ball map and observe WLCSP PCB layout guidelines (microvia stack-up, NSMD pads). The non-volatile architecture removes boot-time configuration delays inherent to SRAM-based FPGAs. This page synthesizes distributor pricing, drop-in same-brand alternatives from the MAX 10 family, and engineering design notes not consolidated in the manufacturer datasheet.
10M08DFV81I7G - MAX 10 FPGA, 8K LE, 81-BGA | Intel
The Intel (formerly Altera) 10M08DFV81I7G is a MAX 10 field-programmable gate array (FPGA) featuring 8,000 logic elements, 387,072 bits of embedded SRAM, and 56 user I/O pins, housed in an 81-ball UFBGA / WLCSP package. It belongs to the non-volatile MAX 10 family, integrating flash configuration memory, a 12-bit SAR ADC, and DSP blocks directly on-chip. The device operates across an industrial temperature range and is built on a low-power process optimized for instant-on, single-chip applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program in the field after manufacturing. FPGAs sit alongside ASICs and microcontrollers in the programmable logic hierarchy, offering higher performance and parallelism than MCUs while costing less than full-custom ASICs at low volumes. The MAX 10 family specifically targets low-power, cost-sensitive, and instant-on designs by integrating dual-configuration flash, eliminating the need for an external boot PROM. Key features of the 10M08DFV81I7G include its 8K logic element count, embedded 12-bit ADC up to 1 MSPS with up to 18 analog channels, on-chip flash with instant-on capability, dedicated DSP blocks for fixed- and floating-point arithmetic, and embedded PLLs for flexible clock synthesis. The integrated flash also enables user flash memory (UFM) for data logging and parameter storage. The 81-ball UFBGA package provides a compact footprint suitable for space-constrained PCB designs while supporting up to 56 user I/Os. Architecturally, the MAX 10 family uses logic array blocks (LABs) built from adaptive logic modules (ALMs), each containing an 8-input fracturable look-up table, two dedicated adders, and four registers. This architecture, combined with hard DSP blocks and embedded memory, gives the 10M08DFV81I7G solid DSP performance and efficient memory utilization in a low-power envelope. Typical applications for the 10M08DFV81I7G include industrial control and I/O expansion, motor control, portable instrumentation, video bridging, and low-volume ASIC prototyping. Its instant-on flash and integrated ADC make it particularly attractive for system management, sensor fusion, and bridging legacy interfaces in factory automation. When designing with this FPGA, ensure the Quartus Prime toolchain supports the 10M08DFV81I7G device variant. Use Intel's MAX 10 development kits or partner boards for prototyping, and follow the package-specific PCB layout guidelines for UFBGA/WLCSP fanout and via-in-pad considerations to maintain signal integrity. This page synthesizes distributor pricing, vertical-migration alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
The Intel 10M08SAE144C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 378 Kb of M9K embedded SRAM, 24 embedded 18x18 multipliers, and a 12-bit analog-to-digital converter (ADC) into a 144-pin EQFP (LQFP with exposed pad) package. Built on a 55 nm flash-based process, it stores its configuration in on-chip flash memory, enabling instant-on behavior without an external boot ROM. The device exposes 101 user I/O pins, supports LVDS, DDR3 external memory interfaces, and operates across the commercial 0C to 85C junction range. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic, DSP, and memory functions through a software-defined configuration. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than an ASIC, faster and more parallel than a microcontroller, and lower-power-per-compute than a GPU for fixed-function pipelines. The MAX 10 family targets glue logic, motor control, I/O expansion, and small-format digital signal processing where instant-on and integrated analog reduce total bill of materials. Key features include 8 K logic elements (LEs), 8 K flip-flops, 24 hardware 18x18 multipliers, two analog front-end PLLs, a hard 12-bit successive-approximation ADC (up to 1 MSa/s with up to 17 analog inputs), and dual configuration flash. The integrated ADC eliminates external analog front-end ICs for sensor monitoring, while internal flash removes the boot PROM that CPLDs and SRAM-based FPGAs traditionally require. Architecturally, the device uses look-up-table (LUT) based logic elements clustered into Logic Array Blocks (LABs), routed through a multi-speed interconnect fabric. The flash configuration cell sits on the same die, allowing field upgrades via JTAG while preserving 100,000+ erase/program cycles. The ADC is a hard IP block sharing analog supply and reference pins with the digital I/O ring. Typical applications include industrial motor control (BLDC, stepper, servo), factory automation I/O expansion, sensor aggregation with on-chip ADC, video bridging (LVDS/CVBS), medical patient monitoring, and portable test instruments requiring instant-on capability. Designers also use the MAX 10 for protocol bridging (UART/SPI/I2C to Ethernet) in IoT edge nodes. Design tip: route the exposed thermal pad (EP) to a continuous ground plane with at least 9 thermal vias on a 0.3 mm pitch. Without EP soldering, junction-to-ambient thermal resistance degrades significantly and high-utilization designs can exceed the 85C commercial limit. This page synthesizes distributor pricing, drop-in alternatives, application notes, and package-level guidance not consolidated in any single manufacturer document.
10M08SAE144I7G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel
The Intel 10M08SAE144I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) with 8,000 logic elements (LE), 387,072 bits (378 Kb) of embedded SRAM, and 101 user I/O pins in a 144-pin EQFP (LQFP with exposed pad) package. It integrates dual-configuration flash (1,540 Kbits), an internal ADC, and on-board configuration memory, enabling single-chip instant-on applications without an external boot PROM. Operating from a single 2.85V to 3.465V supply, this industrial-temperature (-40°C to +100°C TJ) device targets low-density logic integration with deterministic timing. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Unlike a microcontroller, FPGAs execute logic in parallel hardware, offering deterministic timing and high I/O throughput. FPGAs sit in the broader hierarchy of programmable logic -> programmable logic device -> logic semiconductor -> integrated circuit, and are widely used to accelerate parallel workloads, glue logic, and interface bridging. Key features of the 10M08SAE144I7G include 8,000 logic elements, 378 Kbits of user flash memory, a 1.25 Gbps LVDS-capable I/O bank architecture, an integrated 12-bit successive-approximation ADC, and a single 3.3 V core supply. The device also supports Nios II embedded processor cores, JTAG-based configuration, and 18x18 multiplier blocks for digital signal processing. This combination delivers a flexible, processor-capable platform in a single device. Architecturally, the 10M08SAE144I7G uses a TSMC 55 nm CMOS process with a look-up-table (LUT) based fabric and embedded SRAM blocks (M9K). The integrated flash eliminates external boot components, reducing BOM and board area. The exposed-pad LQFP-144 package supports conventional SMT reflow, simplifying manufacturing versus BGA alternatives. The 144-pin EQFP form factor exposes 101 user I/Os while remaining hand-solderable for prototype work. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing bridges, portable instrumentation, and consumer electronics requiring custom logic or peripheral interfacing. The internal ADC and flash make it well-suited for sensor aggregation and instant-on embedded platforms. Designers frequently pair it with Nios II soft-core firmware for low-cost SoC replacement. When designing with the 10M08SAE144I7G, ensure the exposed pad (EP) is soldered to a sufficiently large copper pour for thermal dissipation and ground return. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure. Plan I/O bank voltage (VCCIO) assignments carefully - the 10M08 device supports multiple I/O standards per bank but each bank must use a single VCCIO. Decouple each VCCIO bank with 0.1µF + 10µF ceramic capacitors placed within 5 mm of the supply pins. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, providing a faster engineering decision workflow.
10M08SAM153C8G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel / Altera
The Intel (Altera) 10M08SAM153C8G is a member of the MAX 10 FPGA family, integrating 8,000 logic elements, 387,072 bits of embedded user flash, and a 153-ball Micro BGA (MBGA) package. Built on a 55 nm process and operating from a 1.2 V core supply, this non-volatile FPGA delivers 112 Kbits of dedicated block RAM and up to 250 user I/O pins in the package family, while consuming a fraction of the power of comparable SRAM FPGAs through instant-on configuration from internal flash. A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect, allowing designers to implement arbitrary digital logic, glue logic, and parallel processing functions after PCB fabrication. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs and SPLDs as non-processor programmable devices; the MAX 10 family in particular targets low-power, instant-on applications by embedding dual-configuration flash on-die, eliminating the need for external boot memory. The 10M08SAM153C8G delivers up to 8,000 logic elements, 387,072 bits (approximately 378 Kbit user flash), 112 Kbits of block RAM (M9K blocks), and 4 embedded 18x18 multipliers. It integrates an analog-to-digital converter (ADC) block, supports up to 250 user I/O pins (package dependent) and offers 1.2 V core operation with 3.0/3.3 V LVCMOS/LVTTL I/O capability. The 153-ball MBGA package maximizes logic density in a compact surface-mount footprint suitable for space-constrained industrial designs. Architecturally, MAX 10 devices use non-volatile configuration memory that enables instant-on operation in under 10 ms from a single 1.2 V supply, eliminating boot PROM or external flash. The built-in ADC supports 12-bit SAR conversion at up to 1 MSPS across analog input pins, providing mixed-signal integration that simplifies sensor monitoring and power-supply telemetry. Internal flash can also be partitioned for user data storage, replacing external EEPROMs in many designs. Typical applications include industrial control and factory automation (motor control glue logic, sensor fusion pre-processing), IoT edge nodes (sensor aggregation and protocol bridging), test and measurement front-ends, consumer electronics with display timing controllers, and portable/battery-powered devices that benefit from instant-on behavior. The on-chip ADC also makes MAX 10 suitable for predictive-maintenance sensor hubs. When designing with this part, account for power-supply sequencing: MAX 10 devices require a stable 1.2 V core rail and a separate VCCIO bank supply. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and configuration bitstream generation. The C8G speed grade (commercial, 8 ns internal timing) represents the slowest of the MAX 10 commercial grades; choose faster speed grades only if critical paths demand the additional timing margin. This page synthesizes distributor pricing, real-time stock, and parametric drop-in alternatives for the 10M08SAM153C8G, plus design notes that go beyond what is in the Intel MAX 10 datasheet alone.
10M08SAM153I7G - MAX 10 FPGA, 8K LE, 153-MBGA | Intel
The Intel 10M08SAM153I7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 8,000 logic elements (LEs), 378 Kbits of embedded memory, and a 153-ball FineLine BGA (MBGA) package measuring 8 x 8 mm with 0.5 mm pitch. It provides 112 maximum user I/O pins and combines LUT-based logic, embedded SRAM, and on-die flash configuration memory in a single low-power device. A field-programmable gate array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, state machines, and parallel datapaths after PCB fabrication. The MAX 10 family extends the FPGA concept with on-die flash, so designs boot instantly without an external configuration PROM. Within the broader hierarchy, this part is an FPGA -> programmable logic -> reconfigurable digital IC -> semiconductor. Key features include 8,000 LEs, a 378 Kbit M9K embedded memory block array, 24 (18x18) multipliers, and an internal configuration flash that supports dual-boot images and instant-on operation. The device also integrates an analog-to-digital converter (ADC) block, user flash memory (UFM), and a hardened PLL network. Operating at the industrial temperature range of -40 °C to +100 °C (I7G speed grade), the part targets industrial, automotive, and consumer applications that need low-power, instant-on logic. The 10M08 die is fabricated on a low-power process and features 55 nm embedded-flash technology. Its logic structure is built around 4-input LUTs with dedicated carry chains, distributed M9K SRAM blocks, and DSP blocks for signal processing. The instant-on flash allows zero-second boot from power-on, enabling use as a companion controller or "glue logic" on platforms that previously required a small CPLD plus a separate FPGA. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC prototyping, and consumer display processing. The combination of small footprint, BGA-153 package, and low static power consumption also suits battery-backed devices and portable test instrumentation. When designing with the 10M08SAM153I7G, plan for the 0.5 mm BGA pitch during PCB layout: at least a 4-layer board with microvia stacks and 0.4 mm via-pad design rules is recommended. Bank I/O voltages must be configured via Quartus Prime before generating the programming file, and unused GPIO should be left in a defined high-impedance state through the Pin Planner to avoid leakage. This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for component evaluation and sourcing.
10M08SAU169A7G - MAX 10 FPGA 8K LE 169-UBGA | Intel
The Intel 10M08SAU169A7G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 8,000 logic elements, 378 Kbits of embedded RAM, and 130 user I/Os in a 169-ball Ultra FineLine BGA (UBGA) package. Built on TSMC 55 nm embedded NOR flash technology, this non-volatile FPGA delivers instant-on capability, on-chip dual-configuration flash, and integrated analog-to-digital converters (ADCs) in a single chip. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as memory and DSP slices. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers as the three main approaches to custom digital hardware. MAX 10 FPGAs specifically occupy the low-power, non-volatile niche, replacing traditional CPLD + external flash + ADC combinations in cost-sensitive industrial and automotive designs. Key features include 8,000 logic elements (4-input LUTs), 378 Kbits (approximately 46 Kbytes) of embedded SRAM, 16 full-precision 18x18 multipliers, and a hard DDR3 memory controller. The 169-UBGA package exposes 130 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards, while the integrated 12-bit ADC provides up to 1 MSPS sampling across 17 analog inputs. Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 16 logic elements per LAB, and includes embedded NOR flash for single-chip configuration storage. This eliminates the external boot flash typically required by SRAM-based FPGAs from Xilinx and AMD (formerly Xilinx Spartan-6), reducing BOM cost and PCB footprint. The device supports up to 450 MHz internal clock operation via phase-locked loops (PLLs). Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), portable medical instruments, video processing for surveillance and machine vision, and I/O expansion for processors. The combination of integrated ADC, flash memory, and small form factor suits space-constrained and cost-optimized designs. When designing with the 10M08SAU169A7G, verify that the 169-UBGA ballmap is compatible with your PCB footprint and that the Quartus Prime toolchain supports the speed grade 7 timing model. For migration paths within the MAX 10 family, the 169-UBGA package is shared with 10M04 and 10M16 variants, enabling scalable logic capacity on a single PCB layout. This page synthesizes distributor pricing, drop-in alternative FPGAs from the same MAX 10 family, comparison parameters, and practical design notes not found in the manufacturer datasheet alone.
10M08SAU169C8G - MAX 10 FPGA, 8K LEs, 130 I/O, 169-LFBGA | Intel
The Intel (formerly Altera) 10M08SAU169C8G is a MAX 10 family Field Programmable Gate Array integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and 130 user I/Os into a 169-ball plastic LFBGA (11x11 mm, 0.8 mm pitch) package. As a non-volatile single-chip FPGA it incorporates on-chip flash configuration memory, eliminating the need for an external boot PROM and enabling instant-on functionality for industrial and factory-automation designs. Built on a low-power 55 nm embedded flash process, the device operates from a 1.2 V core supply across commercial and industrial temperature grades, with the C8 speed grade providing the standard -8 timing closure. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture comprises an array of configurable logic elements (LEs) interconnected through a programmable routing fabric, surrounded by hard IP blocks such as embedded memory, PLLs, and high-speed transceivers. FPGAs sit within the programmable logic device (PLD) category and are used for glue logic, custom state machines, parallel interfaces, hardware acceleration, and ASIC prototyping. The MAX 10 line extends the legacy MAX CPLD family with an on-chip ADC, Nios II soft-processor support, and dual-configuration flash to deliver true single-chip programmability. Key features include 8K logic elements, 173 Kbits of dedicated M9K block RAM, four analog PLLs plus two fractional PLLs, dual-configuration flash, on-chip ADC support, and DSP blocks for signal processing. The 169-LFBGA footprint exposes 130 general-purpose user I/Os up to 3.3 V LVCMOS/LVTTL and includes embedded PCIe hard IP plus DDR3 external memory interface support. Power consumption is typically below 1 W at moderate toggle rates, and the 0.8 mm ball pitch simplifies PCB manufacturing. Architecturally, MAX 10 devices pair the LE fabric with embedded flash for in-system programmability via JTAG, supporting active serial (AS) configuration and the Quartus Prime toolchain. The C8G speed grade and industrial-grade temperature rating make the variant well suited to factory-floor equipment, motor control, and HMI controllers. Typical applications include industrial control and factory automation, motor drives and servo control, programmable logic controllers (PLCs), video bridging and display controllers, sensor aggregation for IoT gateways, and low-cost ASIC prototyping. When designing with this device, ensure the Quartus Prime toolchain matches the device speed grade (C8) and pin-out package (U169). Decoupling strategy should follow Intel's MAX 10 Hardware Reference Guide, and the dual-boot configuration should be exercised when designing fail-safe remote firmware updates. This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet.
10M08SAU169I7G - MAX 10 FPGA, 8K LE, 169-LFBGA | Altera
The Altera 10M08SAU169I7G is a member of the MAX 10 family of non-volatile FPGAs from Intel (formerly Altera), offering 8,000 logic elements, 378 Kbits of embedded RAM, and a single 1.2V core supply in a 169-pin LFBGA (U169) package. According to the verified distributor listings, this OPN belongs to the MAX 10 10M08 device class with 130 user I/O pins and 8K logic elements, all housed in a 169-LFBGA package operating across the industrial temperature range. MAX 10 FPGAs belong to the broader taxonomy of FPGAs (field-programmable gate arrays) -> programmable logic devices (PLDs) -> logic ICs -> integrated circuits. MAX 10 is a low-cost, non-volatile family that integrates a flash configuration memory on-chip, eliminating the need for an external boot PROM. The 10M08 is the lowest-density member of this family, optimized for glue logic, I/O expansion, and small control-plane applications where an MCU is overkill or a custom ASIC is too expensive. Key features include 8K logic elements (LEs), 378 Kbits of embedded block RAM, 130 maximum user I/O pins, an integrated ADC, internal flash configuration memory, and support for industrial-grade temperatures. The LFBGA-169 package provides a compact footprint suitable for space-constrained designs. The 'I' suffix indicates industrial temperature range (-40C to +100C) and the '7' indicates a speed/power grade per Intel's MAX 10 ordering code scheme. The device uses a TSMC 55nm embedded-flash process, allowing instant-on configuration and unlimited re-programmability. The integrated 12-bit ADC and temperature-sensing diode reduce external analog circuitry. The 169-LFBGA (UBGA) package has a 0.5mm or similar fine pitch typical of Intel FPGA ball-grid packages. Typical applications include industrial I/O expansion, motor control, sensor aggregation, low-volume bridge designs replacing legacy CPLDs, and prototyping for ASIC replacement. The integrated flash makes MAX 10 suitable for unattended remote installations where the part must self-configure without external boot memory. A key design consideration is that all variants in the MAX 10 family share the same Quartus Prime toolchain, simplifying code migration across densities. Choose 10M08 when 8K LEs is sufficient; otherwise migrate to 10M16, 10M25, 10M40, or 10M50 within the same tool chain. This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. All 5-8 alternatives share the same MAX 10 family toolchain.
10M08SAU169I7P - MAX 10 FPGA 8K LE UFBGA-169 | Altera
The Altera (Intel) 10M08SAU169I7P is a member of the MAX 10 family of non-volatile FPGAs integrating 8,000 logic elements, 387,072 bits of embedded SRAM, and a 1.2 V core in a 169-ball Ultra FineLine BGA (UFBGA-169) package. The MAX 10 device combines a traditional FPGA fabric with on-die flash configuration memory and a hard ADC block, eliminating the need for external boot PROMs in many designs. The 'S' speed grade and 'A' automotive-grade screen make this variant suitable for cost-sensitive industrial control, motor drive, and I/O expansion applications. A MAX 10 FPGA belongs to the non-volatile FPGA category, sitting hierarchically below SRAM-only FPGAs (e.g. Cyclone V) and above CPLDs in terms of logic density and embedded feature set. The MAX 10 family integrates user flash, ADC, and DSP blocks directly on-die, allowing single-chip implementation of mixed-signal control designs. Compared to pure CPLDs, MAX 10 devices offer substantially higher logic capacity, embedded multipliers, and DSP support, while preserving instant-on capability from on-chip flash. Key features of the 10M08SAU169I7P include 8,000 logic elements (LEs), 387 Kbits of embedded user SRAM (M9K blocks), 56 embedded 18x18 multipliers, two integrated PLLs, and up to 130 general-purpose I/O pins. The device supports LVCMOS, LVDS, SSTL, and differential I/O standards at data rates suitable for parallel sensor buses, low-speed video, and industrial communication interfaces such as SPI, I2C, UART, and CAN. Typical applications include industrial motor control and PLC interfaces, sensor aggregation hubs, low-cost video processing bridges, machine vision pre-processors, and I/O expansion for SoC-based designs. The integrated 12-bit ADC (up to 17 channels) and DSP blocks make the part especially attractive for mixed-signal data acquisition and signal conditioning tasks. When designing with the 10M08SAU169I7P, plan power sequencing on the 3.3V/2.5V/1.2V rails, observe the BGA escape routing density in the UFBGA-169 footprint, and use the Quartus Prime toolchain for synthesis and place-and-route.
10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel
The Intel 10M08SAU324I7G is a MAX 10 family field-programmable gate array (FPGA) integrating 8000 logic elements, 387,072 bits of embedded user flash memory, and 246 Kbits of general-purpose SRAM in a 324-pin LFBGA (U324) package. Built on TSMC 55 nm embedded flash process technology, it combines a non-volatile FPGA fabric with on-chip analog and digital peripherals, enabling single-chip glue-logic, I/O expansion, and instant-on control solutions. An FPGA (field-programmable gate array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user defines after manufacture via a hardware description language such as Verilog or VHDL. MAX 10 FPGAs occupy a hybrid position in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below high-density SRAM-based FPGAs in capacity, but unique in offering instant-on capability from on-die flash configuration memory. The 10M08SAU324I7G therefore replaces multiple discrete logic ICs, PLDs, and small CPLDs in cost-sensitive embedded designs. Key features include up to 250 user I/O pins, two integrated 12-bit ADCs supporting 1 MSPS conversion, dual 1.5/3.3 V configuration voltage support, on-die temperature sensing, and an integrated PLL with up to 4 output taps. The 324-LFBGA package exposes the largest I/O count in the 10M08 density tier, suiting industrial automation and motor control boards that require high pin density. Operating junction temperature spans the -40C to +100C industrial range with a 1.2 V core supply. Architecturally, MAX 10 devices embed configuration flash directly on the silicon die, eliminating external boot PROMs and reducing board area. Logic elements are arranged in Logic Array Blocks (LABs) interconnected by MultiTrack interconnect, with embedded memory blocks (M9K) providing true-dual-port RAM. The fabric also includes hardware multipliers (18x18), consumer-grade PCIe hard IP, and an Nios II soft-core processor compatible path for system-on-chip designs. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, sensor fusion, low-cost prototyping, and instant-on replacement of legacy CPLD designs. The combination of flash storage, ADCs, and LVDS-capable I/O makes it well suited for IoT edge nodes that boot in under 10 ms. When designing with the 10M08SAU324I7G, plan power rail sequencing carefully: the 1.2 V core VCC must ramp before VCCA (2.5 V PLL analog) and VCCIO (I/O banks). Use the Quartus Prime design toolchain for compilation, pin planning, and programming - the part supports JTAG (IEEE 1149.1) and Active Serial configuration modes. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, giving engineers a single reference for the 10M08SAU324I7G selection.
10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)
The Intel (Altera) 10M08SCE144C8 is a MAX 10 family Field-Programmable Gate Array (FPGA) built on a non-volatile flash-based process, with 8,000 logic elements (LEs), approximately 387 Kbits of embedded memory, and 101 user I/Os, housed in a 144-pin LQFP Exposed Pad package. The MAX 10 family integrates a true single-chip small FPGA with on-die flash configuration memory and a 12-bit ADC, eliminating the need for an external boot PROM. The "C8" speed grade and "E144" package designation identify this as the commercial-temperature, 8 ns timing-model variant in a 22x22 mm LQFP. What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability. Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant. Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required. Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes. Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry. This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.
10M08SCE144C8G - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera
The Intel (formerly Altera) MAX 10 10M08SCE144C8G is a non-volatile Field-Programmable Gate Array (FPGA) from the MAX 10 family with 8,000 logic elements (LEs) and 387,072 bits of embedded user flash, housed in a 144-pin EQFP (LQFP with exposed pad) package. As an FPGA IC with 101 user I/Os, the device integrates a 2 Mb flash block (dual-configuration support), 12-bit 1 Msps ADCs, and a PLL, all on a single chip that requires only one supply rail. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of semiconductor ICs that includes CPLDs and SPLDs - that uses a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. Within the broader computing hierarchy, FPGAs sit between general-purpose microcontrollers and ASICs, offering hardware-level parallelism for glue logic, custom I/O bridging, and DSP workloads. The MAX 10 family is Intel's low-cost, non-volatile FPGA line, designed for single-supply 3.3 V or 2.5 V operation without external boot memory. Key features include 8,000 LEs, 414 Kbits of embedded SRAM (M9K blocks), 378 18x18 multipliers, 4 PLLs, and integrated 12-bit ADCs with up to 18 analog inputs. The 'S' speed grade and 'C8' commercial temperature rating (0 °C to +85 °C) target cost-sensitive industrial and consumer designs, while the '144' package pinout supports up to 101 user I/Os operating at LVCMOS 3.3/2.5/1.8/1.5/1.2 V levels with hot-socketing capability. Architecturally, the 10M08 uses a look-up-table (LUT)-based logic fabric paired with 12-bit SAR ADCs and an embedded flash subsystem that provides instant-on behavior and dual-image configuration - one of the lowest-power non-volatile FPGAs in its class. The device supports internal pull-ups, programmable drive strength, and PCI Express (PIPE) hard IP emulation through soft cores. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-volume ASIC prototyping, and embedded vision pre-processing. The integrated ADC simplifies designs that previously required a separate analog front-end MCU. When migrating between MAX 10 density points, designers can reuse the 144-pin PCB layout for the 10M04 (4K LE) and 10M16 (16K LE) variants in the same package, simplifying platform scalability.
10M08SCE144I7 - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera
The Intel (formerly Altera) MAX 10 10M08SCE144I7 is a non-volatile Field-Programmable Gate Array (FPGA) from the MAX 10 family, integrating 8,000 logic elements, 387,072 Kbits of embedded memory, and 101 user I/O pins in a 144-pin Plastic Quad Flat Pack with exposed thermal pad (144-EQFP, 22x22 mm). It targets cost-sensitive, low-power applications requiring instant-on capability thanks to its on-die dual-configuration flash. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that an engineer can re-program in the field to implement any digital logic function. Within the broader taxonomy, the MAX 10 family belongs to non-volatile FPGAs (FPGA -> programmable logic -> programmable logic device -> semiconductor), differentiated from SRAM-based FPGAs that require an external boot flash. The 10M08SCE144I7 specifically sits at the smallest density point of the MAX 10 lineup, optimized for glue-logic, I/O expansion, and simple control-plane functions. Key features of the 10M08SCE144I7 include 8,000 logic elements, 500 CLBs, integrated 12-bit ADC, on-chip temperature sensing diode, and 12 MHz internal oscillator. The device operates from a 3.0 V core supply (2.85 V to 3.15 V) with separate 1.2 V and 2.5 V auxiliary rails for transceivers and PLLs. Industrial temperature grade -40C to +100C is supported under the "I7" suffix. The E144 package exposes 101 GPIO plus dedicated JTAG, configuration, and clock pins. Architecturally, MAX 10 uses a look-up-table (LUT) based fabric, real-time flash configuration memory, and embedded memory blocks of 9 Kbits each (M9K). Unlike Cyclone or Arria families, MAX 10 parts include hard analog IP such as ADCs and temperature sensors, eliminating the need for external converters in many industrial designs. Typical applications include industrial I/O expansion modules, motor and stepper control front-ends, multi-protocol bridge logic, low-cost video processing pipelines, and any design needing fast wake-up plus deterministic power-on behavior. Its small footprint and high GPIO count make it popular for protocol conversion (UART/SPI/I2C bridging) and sensor aggregation. Design considerations: engineers must provide a clean 3.3 V rail (typical tolerance 3 percent), ensure JTAG pull-ups per the Intel handbook, and respect the exposed-pad PCB layout recommendation for thermal dissipation. Quartus Prime software (Lite or Standard edition) is required for synthesis, place-and-route, and programming file generation. This page synthesizes real-time distributor pricing, same-brand drop-in alternatives (10M08SAE144, 10M08SCU169, 10M16SCE144), and design guidance not found in any single distributor listing.
10M08SCE144I7G - MAX 10 FPGA, 8K LE, 144-LQFP | Intel
The Intel (Altera) 10M08SCE144I7G is a non-volatile MAX 10 field-programmable gate array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory, and 101 user I/O pins, housed in a 144-pin LQFP exposed-pad (EQFP-144) package. It integrates dual-configuration flash, an internal configuration controller, and dual 12-bit analog-to-digital converters, providing single-chip instant-on functionality at 1.2V core voltage. The -7 speed grade and industrial -40C to +100C junction temperature range suit cost-sensitive industrial and consumer designs that need non-volatile logic density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, embedded memory (block RAM, M9K), DSP blocks, and I/O cells, all of which can be re-programmed after manufacture. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution, deterministic timing, and rapid time-to-market. The MAX 10 family is Intel's smallest, lowest-cost, non-volatile SRAM-based FPGA family, targeted at glue logic, sensor fusion, industrial control, and bridge/replacement of legacy CPLDs. It belongs to the broader programmable logic device (PLD) hierarchy, which includes CPLDs and FPGAs. Key features of the 10M08SCE144I7G include 8K logic elements (LEs), 414 Kbits embedded SRAM, two 12-bit analog-to-digital converters (ADCs) supporting up to 16 analog inputs, two PLLs, and integrated dual-configuration flash that enables field-upgradable bitstreams without external memory. The exposed-pad package provides thermal dissipation for industrial environments where junction temperatures approach 100C. The MAX 10 architecture uses an LUT-based logic fabric backed by M9K memory blocks and 18x18 multiplier blocks for digital signal processing. Its non-volatile flash allows instant-on operation in under 10 ms - a critical feature for industrial motor drives and factory-automation subsystems that must respond within milliseconds of power-up without waiting for external configuration loading from SPI flash. Typical applications include industrial control and machine automation, sensor data acquisition and pre-processing, video bridging and display controllers, communication protocol bridging (I2C/SPI/UART/CAN), motor control, LED lighting controllers, and as a replacement for legacy 5V-tolerant CPLDs in factory-automation backplanes. When designing with this device, allocate sufficient decoupling capacitance (100 nF near each VCCIO bank plus bulk 10-47 uF) and provide adequate copper pour under the exposed pad to keep junction temperature below 100C. The internal ADC requires clean analog power - route VCCA separately and decouple aggressively to avoid coupling digital switching noise into analog measurements. This page synthesizes distributor pricing, drop-in compatible MAX 10 / MAX V equivalents, and practical design notes not assembled in the manufacturer datasheet.