10M08DFV81I7G - MAX 10 FPGA, 8K LE, 81-BGA | Intel
Артикул: 10M08DFV81I7G ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $37.52 | $37,52 |
| 10 | $33.77 | $337,70 |
| 100 | $30.02 | $3.002,00 |
| 500 | $26.27 | $13.135,00 |
| 1.000 | $22.51 | $22.510,00 |
10M08DFV81I7G Обзор
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program in the field after manufacturing. FPGAs sit alongside ASICs and microcontrollers in the programmable logic hierarchy, offering higher performance and parallelism than MCUs while costing less than full-custom ASICs at low volumes. The MAX 10 family specifically targets low-power, cost-sensitive, and instant-on designs by integrating dual-configuration flash, eliminating the need for an external boot PROM.
Key features of the 10M08DFV81I7G include its 8K logic element count, embedded 12-bit ADC up to 1 MSPS with up to 18 analog channels, on-chip flash with instant-on capability, dedicated DSP blocks for fixed- and floating-point arithmetic, and embedded PLLs for flexible clock synthesis. The integrated flash also enables user flash memory (UFM) for data logging and parameter storage. The 81-ball UFBGA package provides a compact footprint suitable for space-constrained PCB designs while supporting up to 56 user I/Os.
Architecturally, the MAX 10 family uses logic array blocks (LABs) built from adaptive logic modules (ALMs), each containing an 8-input fracturable look-up table, two dedicated adders, and four registers. This architecture, combined with hard DSP blocks and embedded memory, gives the 10M08DFV81I7G solid DSP performance and efficient memory utilization in a low-power envelope.
Typical applications for the 10M08DFV81I7G include industrial control and I/O expansion, motor control, portable instrumentation, video bridging, and low-volume ASIC prototyping. Its instant-on flash and integrated ADC make it particularly attractive for system management, sensor fusion, and bridging legacy interfaces in factory automation.
When designing with this FPGA, ensure the Quartus Prime toolchain supports the 10M08DFV81I7G device variant. Use Intel's MAX 10 development kits or partner boards for prototyping, and follow the package-specific PCB layout guidelines for UFBGA/WLCSP fanout and via-in-pad considerations to maintain signal integrity.
This page synthesizes distributor pricing, vertical-migration alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для 10M08DFV81I7G — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10M08DFV81I7G (тот же форм-фактор и посадочное место) — отличается по Mounting Type, Configuration Memory, Operating Temperature, Package, Integrated ADC.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10M08DFV81C8G
✅ Прямая замена✓ В наличии
$7.4 / шт.
Открыть даташит →10M08DCV81I7G
✅ Прямая замена✓ В наличии
$26.85 / шт.
Открыть даташит →10M08DCV81C7G
✅ Прямая замена✓ В наличии
$16.2 / шт.
Открыть даташит →10M08DFV81I7G Максимальные параметры и электрические характеристики
| Series | MAX 10 |
| Logic Elements | 8000 |
| Embedded Memory (Bits) | 387072 |
| User I/O Count | 56 |
| Корпус | 81-UFBGA, WLCSP |
| Тип монтажа | Surface Mount |
| Configuration Memory | Internal Flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 1 MSPS |
| Рабочая температура | -40C to +100C (Industrial) |
| Статус RoHS | Compliant |
| Lead-Free | Yes |
| Toolchain | Intel Quartus Prime |
Руководство по цоколевке 10M08DFV81I7G в корпусе 81-ufbga, wlcsp
Цоколевка для 10M08DFV81I7G (корпус 81-ufbga, wlcsp). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10M08DFV81I7G.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10M08DFV81I7G подходит для 6 применениеs: Industrial Control and I/O Expansion, Motor Control (BLDC / Stepper / FOC), Portable Instrumentation and Data Logging, Video Bridging and Display Interfaces, Low-Volume ASIC Prototyping, Sensor Fusion and System Management.
Industrial Control and I/O Expansion
The 10M08DFV81I7G is well suited to industrial control systems and I/O expansion modules. Its 8,000 logic elements and 56 user I/Os can aggregate multiple legacy interfaces (SPI, I2C, UART, parallel) into a single industrial bus such as EtherCAT or PROFINET. The integrated 12-bit SAR ADC eliminates an external ADC for analog sensor inputs. The industrial temperature rating (-40C to +100C) and on-chip flash provide reliable operation in factory automation panels without external boot memory.
Рекомендуется
Motor Control (BLDC / Stepper / FOC)
For motor control, the 10M08DFV81I7G's DSP blocks deliver fixed- and floating-point arithmetic for field-oriented control (FOC) loops, while the integrated 12-bit ADC samples phase currents and back-EMF. The 8K logic elements easily accommodate space-vector PWM, commutation tables, and protection logic. The 81-ball UFBGA package keeps the design compact on small inverter PCBs, and the instant-on flash enables fast fault-recovery startup.
Рекомендуется
Portable Instrumentation and Data Logging
The 10M08DFV81I7G is ideal for portable test and measurement instruments. Its non-volatile flash enables instant data logging on power-up without boot delay, and user flash memory (UFM) stores calibration constants and configuration parameters. The integrated 12-bit ADC with up to 18 channels supports multi-sensor data acquisition, while 56 user I/Os interface LCDs, keypads, and serial ports. Low-power operation extends battery life in field-portable instruments.
Рекомендуется
Video Bridging and Display Interfaces
The 10M08DFV81I7G can bridge video formats between CMOS cameras, LCDs, and HDMI/DVI transmitters. The 8K logic elements implement timing controllers, color-space converters, and limited scaling, while 56 user I/Os accommodate parallel RGB or LVDS data buses. The integrated ADC and DSP blocks enable on-screen overlay and graphics processing, making this part suitable for industrial HMIs and digital signage controllers.
Рекомендуется
Low-Volume ASIC Prototyping
The 10M08DFV81I7G serves as an ASIC prototyping platform for designs that will later convert to structured ASIC or full-custom silicon. Its 8K logic elements, 387 Kbits of block RAM, and DSP blocks closely match mid-range ASIC gate counts. Quartus Prime supports rapid design iteration, and the integrated flash enables production-ready configuration memory. Engineers can validate firmware, timing, and I/O behavior before committing to NRE.
Рекомендуется
Sensor Fusion and System Management
The 10M08DFV81I7G's combination of logic elements, embedded SRAM, ADC, and user flash makes it ideal for sensor-fusion hubs that aggregate temperature, pressure, current, and voltage data into a single I2C/SPI/CAN interface. The on-chip flash stores calibration coefficients, and the instant-on capability ensures sensor readings begin immediately at power-up. The 81-ball UFBGA footprint supports compact PCB designs in space-constrained embedded systems.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10M08DFV81I7G — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10M08DFV81C8G | 10M08DCV81I7G | 10M08DCV81C7G |
|---|---|---|---|---|
| Package | 81-UFBGA, WLCSP | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 |
| Embedded Memory (Kbits) | 378 | 378 | 378 | 378 |
| User I/O | 56 | 56 | 56 | 56 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Flash Configuration | Single | Single | Dual | Dual |
| Lifecycle Status | Active | Active | Active | Active |
Ключевые отличия
- Same-package upgrade with dual-configuration flash (против 10M08DCV81I7G)
- Industrial temperature grade (против 10M08DFV81C8G)
- Instant-on non-volatile configuration (против XC7A35T (Xilinx))
Заметки по проектированию
The 81-ball UFBGA (WLCSP) package has a 0.4 mm ball pitch and small 4 mm x 4 mm body, requiring via-in-pad PCB technology with filled and plated-over vias for reliable assembly. Use NSMD (non-solder-mask-defined) pads and follow Intel's MAX 10 package-specific layout guidelines for fanout escape routing. Decoupling capacitors should be placed as close as possible to each power pin.
Estimated: with the UFBGA package's small body size, thermal dissipation is limited. At typical 1.0V core voltage and 50% utilization, expect ~0.5-1W dissipation. Ensure the PCB has sufficient copper pour connected to the package thermal balls to dissipate heat. The industrial temperature rating supports ambient up to +100C with adequate thermal management.
Do not confuse the 10M08DFV81I7G (single-config flash, 81-UFBGA) with the 10M08DAU324I7G (dual-config flash, 324-UBGA). The packages are not pin-compatible. When migrating density within the MAX 10 family, verify both the package code and configuration mode (single vs dual) match. Use Intel's MAX 10 vertical migration table for guidance.
Информация о соответствии
RoHS compliant per distributor listings. Halogen-free status not stated in verified web data - defaulting to unknown. Industrial temp grade; not AEC-Q100 qualified.
