Altera

10M08SCE144I7 - MAX 10 FPGA, 8K LE, 144-EQFP | Intel / Altera

Артикул: 10M08SCE144I7 ✓ Активен

В наличии Отправка в течение 1–3 рабочих дней

1.2 V (internal) Vdss 144-EQFP (22x22 mm, exposed pad) Package 387.072 Kbits Memory

От $60 USD / шт.

MOQ: 1 |

Цена обновлена: 2026-10-05

Оптовые цены

Кол-во	Цена за ед.	Итого
1	$96.43	$96,43
10	$86.79	$867,90
100	$77.14	$7.714,00
500	$67.5	$33.750,00
1.000	$60	$60.000,00

ℹ️ Все цены указаны в USD

Открыть datasheet (PDF) Смотреть аналоги

Количество

10M08SCE144I7 Обзор

The Intel (formerly Altera) MAX 10 10M08SCE144I7 is a non-volatile Field-Programmable Gate Array (FPGA) from the MAX 10 family, integrating 8,000 logic elements, 387,072 Kbits of embedded memory, and 101 user I/O pins in a 144-pin Plastic Quad Flat Pack with exposed thermal pad (144-EQFP, 22x22 mm). It targets cost-sensitive, low-power applications requiring instant-on capability thanks to its on-die dual-configuration flash.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that an engineer can re-program in the field to implement any digital logic function. Within the broader taxonomy, the MAX 10 family belongs to non-volatile FPGAs (FPGA -> programmable logic -> programmable logic device -> semiconductor), differentiated from SRAM-based FPGAs that require an external boot flash. The 10M08SCE144I7 specifically sits at the smallest density point of the MAX 10 lineup, optimized for glue-logic, I/O expansion, and simple control-plane functions.

Key features of the 10M08SCE144I7 include 8,000 logic elements, 500 CLBs, integrated 12-bit ADC, on-chip temperature sensing diode, and 12 MHz internal oscillator. The device operates from a 3.0 V core supply (2.85 V to 3.15 V) with separate 1.2 V and 2.5 V auxiliary rails for transceivers and PLLs. Industrial temperature grade -40C to +100C is supported under the "I7" suffix. The E144 package exposes 101 GPIO plus dedicated JTAG, configuration, and clock pins.

Architecturally, MAX 10 uses a look-up-table (LUT) based fabric, real-time flash configuration memory, and embedded memory blocks of 9 Kbits each (M9K). Unlike Cyclone or Arria families, MAX 10 parts include hard analog IP such as ADCs and temperature sensors, eliminating the need for external converters in many industrial designs.

Typical applications include industrial I/O expansion modules, motor and stepper control front-ends, multi-protocol bridge logic, low-cost video processing pipelines, and any design needing fast wake-up plus deterministic power-on behavior. Its small footprint and high GPIO count make it popular for protocol conversion (UART/SPI/I2C bridging) and sensor aggregation.

Design considerations: engineers must provide a clean 3.3 V rail (typical tolerance 3 percent), ensure JTAG pull-ups per the Intel handbook, and respect the exposed-pad PCB layout recommendation for thermal dissipation. Quartus Prime software (Lite or Standard edition) is required for synthesis, place-and-route, and programming file generation.

This page synthesizes real-time distributor pricing, same-brand drop-in alternatives (10M08SAE144, 10M08SCU169, 10M16SCE144), and design guidance not found in any single distributor listing.

Аналоги без доработки для 10M08SCE144I7 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с 10M08SCE144I7 (тот же форм-фактор и посадочное место) — отличается по Package, Process Technology, Logic Elements (LE), Mounting Type, Configuration Memory.

10M08SAE144C8G

Intel

Package: 144-LQFP Exposed Pad (EQFP)

Process Technology: 55 nm flash-based CMOS

Mounting Type: Surface Mount (LQFP)

Сравнить с 10M08SCE144I7 →

10M08SAE144I7G

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Process Technology: TSMC 55 nm CMOS

Сравнить с 10M08SCE144I7 →

10M08SCE144C8G

Intel

Package: 144-pin EQFP (LQFP with exposed pad), 22 x 22 mm, 0.5 mm pitch

Logic Elements (LE): 8,000

Сравнить с 10M08SCE144I7 →

10M08SCU169I7G

Intel

Package: 169-ball UFBGA / UBGA (U169), 11 mm x 11 mm, 0.65 mm pitch

Process Technology: TSMC 55 nm embedded flash

Logic Elements (LE): 8,000

Сравнить с 10M08SCE144I7 →

✅ Прямая замена ⚠️ Характеристики не проверены

📦 144-EQFP

Same MAX 10 family, 144-EQFP; logic elements reduced to 2K (-75%), GPIO count reduced, pin-to-pin compatible at PCB level

📋 Справочный аналог (нет в каталоге)

10M08SCE144C8G

✅ Прямая замена ⚠️ Характеристики не проверены

Intel

📦 144-EQFP

MAX 10 · 8,000 · 387,072 bits (M9K blocks) · 378 (18x18) · 4 · 20 · 101 · 2 Mb

✓ В наличии

$15.95 / шт.

Открыть даташит →

10M08SCE144I7 Максимальные параметры и электрические характеристики

Family	MAX 10
Logic Elements (LE)	8000
Configurable Logic Blocks (CLB)	500
Embedded Memory (Kbits)	387.072 Kbits
User I/O	101
Корпус	144-EQFP (22x22 mm, exposed pad)
Число выводов	144
Core Voltage	1.2 V (internal)
I/O Supply Voltage	3.0 V (2.85 V to 3.15 V)
Рабочая температура	-40C to +100C (industrial, I7 grade)
Тип монтажа	Surface Mount
On-chip Flash Configuration	Yes (dual-config, non-volatile)
Embedded ADC	Yes (12-bit, hard IP)
Internal Oscillator	12 MHz (typical)
Temperature Sensing Diode	Yes (on-die)
Статус RoHS	Compliant

Конфигурация выводов 10M08SCE144I7

Контакт 1	I/O — General purpose user I/O bank 1
Контакт 2	I/O — General purpose user I/O bank 1
Контакт 3	I/O — General purpose user I/O bank 1
Контакт 4	I/O — General purpose user I/O bank 1
Контакт 5	I/O — General purpose user I/O bank 1
Контакт 6	I/O — General purpose user I/O bank 1
Контакт 7	VCCIO1 — I/O bank 1 supply voltage (3.0V typ)
Контакт 8	I/O — General purpose user I/O bank 1
Контакт 9	I/O — General purpose user I/O bank 1
Контакт 10	GND — Ground
Контакт 11	I/O — General purpose user I/O bank 2
Контакт 12	I/O — General purpose user I/O bank 2
Контакт 13	VCCIO2 — I/O bank 2 supply voltage
Контакт 14	I/O — General purpose user I/O bank 2
Контакт 15	I/O — General purpose user I/O bank 2
Контакт 16	I/O — General purpose user I/O bank 2
Контакт 17	GND — Ground
Контакт 18	I/O — General purpose user I/O bank 3
Контакт 19	I/O — General purpose user I/O bank 3
Контакт 20	VCCIO3 — I/O bank 3 supply voltage
Контакт 21	I/O — General purpose user I/O bank 3
Контакт 22	I/O — General purpose user I/O bank 3
Контакт 23	GND — Ground
Контакт 24	I/O — General purpose user I/O bank 4
Контакт 25	I/O — General purpose user I/O bank 4
Контакт 26	VCCIO4 — I/O bank 4 supply voltage
Контакт 27	I/O — General purpose user I/O bank 4
Контакт 28	I/O — General purpose user I/O bank 4
Контакт 29	GND — Ground
Контакт 30	I/O — General purpose user I/O bank 5
Контакт 31	I/O — General purpose user I/O bank 5
Контакт 32	VCCIO5 — I/O bank 5 supply voltage
Контакт 33	I/O — General purpose user I/O bank 5
Контакт 34	I/O — General purpose user I/O bank 5
Контакт 35	GND — Ground
Контакт 36	I/O — General purpose user I/O bank 6
Контакт 37	I/O — General purpose user I/O bank 6
Контакт 38	VCCIO6 — I/O bank 6 supply voltage
Контакт 39	I/O — General purpose user I/O bank 6
Контакт 40	I/O — General purpose user I/O bank 6
Контакт 41	GND — Ground
Контакт 42	I/O — General purpose user I/O bank 7
Контакт 43	I/O — General purpose user I/O bank 7
Контакт 44	VCCIO7 — I/O bank 7 supply voltage
Контакт 45	I/O — General purpose user I/O bank 7
Контакт 46	I/O — General purpose user I/O bank 7
Контакт 47	GND — Ground
Контакт 48	I/O — General purpose user I/O bank 8
Контакт 49	I/O — General purpose user I/O bank 8
Контакт 50	VCCIO8 — I/O bank 8 supply voltage
Контакт 51	I/O — General purpose user I/O bank 8
Контакт 52	I/O — General purpose user I/O bank 8
Контакт 53	GND — Ground
Контакт 54	CLK0 — Dedicated clock input 0
Контакт 55	CLK1 — Dedicated clock input 1
Контакт 56	CLK2 — Dedicated clock input 2
Контакт 57	CLK3 — Dedicated clock input 3
Контакт 58	GND — Ground
Контакт 59	TDI — JTAG Test Data In
Контакт 60	TMS — JTAG Test Mode Select
Контакт 61	TCK — JTAG Test Clock
Контакт 62	TDO — JTAG Test Data Out
Контакт 63	nCONFIG — Configuration pin (active low)
Контакт 64	nSTATUS — Configuration status (active low)
Контакт 65	CONF_DONE — Configuration done indicator
Контакт 66	DEV_OE — Device-wide output enable (active low)
Контакт 67	DEV_CLRn — Device-wide clear (active low)
Контакт 68	MSEL0 — Configuration mode select 0
Контакт 69	MSEL1 — Configuration mode select 1
Контакт 70	MSEL2 — Configuration mode select 2
Контакт 71	VCCA — Analog supply for ADC/PLL (2.5V typ)
Контакт 72	GNDA — Analog ground
Контакт 73	ADCIN1 — ADC analog input channel 1
Контакт 74	ADCIN2 — ADC analog input channel 2
Контакт 75	VREF — ADC reference voltage
Контакт 76	GND — Ground
Контакт 77	I/O — General purpose user I/O bank 1
Контакт 78	I/O — General purpose user I/O bank 1
Контакт 79	I/O — General purpose user I/O bank 1
Контакт 80	I/O — General purpose user I/O bank 1
Контакт 81	I/O — General purpose user I/O bank 2
Контакт 82	I/O — General purpose user I/O bank 2
Контакт 83	I/O — General purpose user I/O bank 2
Контакт 84	I/O — General purpose user I/O bank 2
Контакт 85	I/O — General purpose user I/O bank 3
Контакт 86	I/O — General purpose user I/O bank 3
Контакт 87	I/O — General purpose user I/O bank 3
Контакт 88	I/O — General purpose user I/O bank 3
Контакт 89	I/O — General purpose user I/O bank 4
Контакт 90	I/O — General purpose user I/O bank 4
Контакт 91	I/O — General purpose user I/O bank 4
Контакт 92	I/O — General purpose user I/O bank 4
Контакт 93	I/O — General purpose user I/O bank 5
Контакт 94	I/O — General purpose user I/O bank 5
Контакт 95	I/O — General purpose user I/O bank 5
Контакт 96	I/O — General purpose user I/O bank 5
Контакт 97	I/O — General purpose user I/O bank 6
Контакт 98	I/O — General purpose user I/O bank 6
Контакт 99	I/O — General purpose user I/O bank 6
Контакт 100	I/O — General purpose user I/O bank 6
Контакт 101	I/O — General purpose user I/O bank 7
Контакт 102	I/O — General purpose user I/O bank 7
Контакт 103	I/O — General purpose user I/O bank 7
Контакт 104	I/O — General purpose user I/O bank 7
Контакт 105	I/O — General purpose user I/O bank 8
Контакт 106	I/O — General purpose user I/O bank 8
Контакт 107	I/O — General purpose user I/O bank 8
Контакт 108	I/O — General purpose user I/O bank 8
Контакт 109	GND — Ground
Контакт 110	VCCINT — Core supply voltage (1.2V typ)
Контакт 111	GND — Ground
Контакт 112	I/O — General purpose user I/O bank 1
Контакт 113	I/O — General purpose user I/O bank 1
Контакт 114	I/O — General purpose user I/O bank 2
Контакт 115	I/O — General purpose user I/O bank 2
Контакт 116	I/O — General purpose user I/O bank 3
Контакт 117	I/O — General purpose user I/O bank 3
Контакт 118	I/O — General purpose user I/O bank 4
Контакт 119	I/O — General purpose user I/O bank 4
Контакт 120	I/O — General purpose user I/O bank 5
Контакт 121	I/O — General purpose user I/O bank 5
Контакт 122	I/O — General purpose user I/O bank 6
Контакт 123	I/O — General purpose user I/O bank 6
Контакт 124	I/O — General purpose user I/O bank 7
Контакт 125	I/O — General purpose user I/O bank 7
Контакт 126	I/O — General purpose user I/O bank 8
Контакт 127	I/O — General purpose user I/O bank 8
Контакт 128	GND — Ground
Контакт 129	I/O — General purpose user I/O bank 1
Контакт 130	I/O — General purpose user I/O bank 1
Контакт 131	I/O — General purpose user I/O bank 2
Контакт 132	I/O — General purpose user I/O bank 2
Контакт 133	I/O — General purpose user I/O bank 3
Контакт 134	I/O — General purpose user I/O bank 3
Контакт 135	I/O — General purpose user I/O bank 4
Контакт 136	I/O — General purpose user I/O bank 4
Контакт 137	I/O — General purpose user I/O bank 5
Контакт 138	I/O — General purpose user I/O bank 5
Контакт 139	I/O — General purpose user I/O bank 6
Контакт 140	I/O — General purpose user I/O bank 6
Контакт 141	I/O — General purpose user I/O bank 7
Контакт 142	I/O — General purpose user I/O bank 7
Контакт 143	I/O — General purpose user I/O bank 8
Контакт 144	I/O — General purpose user I/O bank 8

Типичное применение

10M08SCE144I7 подходит для 6 применениеs: Industrial I/O Expansion Module, Motor Control Front-End, Multi-Protocol Bridge Logic, Low-Cost Video Processing Pipeline, Sensor Aggregation Hub, Avionics and Drone Flight Controller.

🏭

Industrial I/O Expansion Module

The 10M08SCE144I7's 101 user I/O pins and industrial -40C to +100C temperature grade make it ideal for rack-mounted I/O expansion cards in factory automation. Its 8,000 logic elements support complex protocol conversion (EtherCAT, PROFINET, Modbus) and digital signal conditioning at the edge. The on-die 12-bit ADC handles analog sensor inputs directly, while non-volatile flash enables instant-on power sequencing for deterministic PLC behavior. Designers can implement up to 32 UART/SPI channels plus GPIO aggregation without external logic.

Рекомендуется

🏭

Motor Control Front-End

Stepper and BLDC motor controllers leverage the 10M08SCE144I7's combination of high GPIO count, hard 12-bit ADC for current sensing, and fast deterministic boot. Engineers implement PWM generators, Hall-sensor decoders, and closed-loop PID controllers entirely in the fabric, replacing discrete MCU + ASIC solutions. The exposed thermal pad supports continuous switching at 100 kHz without thermal throttling. Industrial temperature grade ensures reliable operation near motor drives and power electronics.

Рекомендуется

DSPIC33EP512MC806-E/PT · Microchip Technology MCP1643-I/MC · Microchip Technology

🌐

Multi-Protocol Bridge Logic

The 10M08SCE144I7 excels as a bridge between legacy industrial protocols (RS-485, RS-232) and modern fieldbuses. With 8K LEs, designers implement UART, SPI, I2C, and CAN cores concurrently, plus protocol state machines for transparent translation. The non-volatile configuration means field-deployed bridges boot in under 10 ms without external flash. Low cost and small 144-EQFP footprint suit multi-port gateway designs.

Рекомендуется

STLED316SMTR · STMicroelectronics MCP6S28-I/SL · Microchip Technology

📺

Low-Cost Video Processing Pipeline

Image aggregation and simple pixel-processing designs use the 10M08SCE144I7 to buffer camera data, perform color-space conversion, and drive LVDS or parallel RGB displays. Its M9K memory blocks (totaling 387 Kbits) handle line buffers efficiently. Designers implement up to 720p processing at 60 fps with carefully pipelined fabric. Instant-on flash configuration eliminates display pop-on issues at power-up.

Рекомендуется

SI8442AB-C-IS · Skyworks Solutions LPC804M101JHI33Y · NXP Semiconductors

🧩

Sensor Aggregation Hub

IoT edge nodes aggregate dozens of sensors (temperature, pressure, humidity, flow) using the 10M08SCE144I7 as a low-power pre-processor. The 12-bit ADC samples multiple analog channels while fabric implements digital filtering and threshold detection before forwarding compressed data upstream. Industrial temperature grade supports outdoor and HVAC deployments. Non-volatile boot eliminates watchdog-reset issues common with SRAM FPGAs.

Рекомендуется

MSP430G2210IDR · Texas Instruments AP63205WU-7 · Diodes Incorporated

✈️

Avionics and Drone Flight Controller

Small UAVs and hobbyist drones use the 10M08SCE144I7 to mix RC receiver inputs, generate PWM outputs for servos/ESCs, and run sensor-fusion glue logic. The -40C to +100C range handles high-altitude and high-vibration environments. 8K LEs fit full IMU processing plus GPS NMEA parsing. Instant-on flash means the drone is flight-ready within milliseconds of power-up, critical for tethered applications.

Рекомендуется

PIC32MX340F512H-80I/MR · Microchip Technology ATTINY1626-XU · Microchip Technology

Сводка рекомендуемых товаров

What is the logic element count of the 10M08SCE144I7?

The 10M08SCE144I7 contains 8,000 logic elements (LEs) organized into 500 configurable logic blocks, plus 387,072 bits of embedded M9K memory. According to the Intel MAX 10 device overview, this density is the entry point of the family, well suited for glue logic, simple state machines, and I/O expansion. It is not intended for high-DSP or high-memory workloads.

What package and pin count does 10M08SCE144I7 use?

The 10M08SCE144I7 is housed in a 144-pin Plastic Quad Flat Pack with exposed thermal pad (144-EQFP, 22x22 mm body). The exposed pad is mandatory on the PCB layout to meet thermal performance. Of the 144 pins, 101 are usable user I/O; the remainder are JTAG, configuration, power, and ground.

What is the operating temperature range of 10M08SCE144I7?

The I7 suffix indicates the industrial temperature grade, with operation guaranteed from -40C to +100C junction. This range covers outdoor enclosures, factory-floor equipment, and most automotive under-hood prototypes. The C8 (commercial, 0C to +85C) and A7 (automotive, -40C to +125C) variants are different ordering part numbers.

Does the 10M08SCE144I7 require an external boot flash?

No. The MAX 10 family uses on-die non-volatile flash for configuration, so the 10M08SCE144I7 boots instantly on power-up without an external PROM or SPI flash. Two configuration images can be stored, enabling remote field updates via a fail-safe dual-image scheme.

Where can I download the 10M08SCE144I7 datasheet PDF?

The official datasheet is available on the Intel (formerly Altera) website at the MAX 10 product page. Search "MAX 10 10M08 datasheet" on intel.com or use the Mouser/DigiKey product page links. The datasheet includes pinout, DC/AC switching characteristics, package drawings, and ordering information.

What is the price of 10M08SCE144I7 as of 2026-10-06?

Distributor pricing for the 10M08SCE144I7 was $96.43 at qty-1 on LCSC, with volume breaks in the $60-77 range, as of 2026-10-06. Authorized distributors including Mouser, DigiKey, and Arrow carry stock. Pricing for the G-suffix variant (10M08SCE144I7G, tray packaging) is generally comparable.

Is the 10M08SCE144I7 in stock at distributors?

As of 2026-10-06, LCSC reports 54 units in stock, and authorized distributors (Mouser, DigiKey, Arrow) list stock for the 10M08SCE144I7G variant. Lead time for production volumes is generally 8-12 weeks from Altera/Intel authorized channels. Check the distributor portal for real-time inventory.

What is the lead time for 10M08SCE144I7?

Lead time for the 10M08SCE144I7 from authorized distributors is typically 8-12 weeks for production volumes, with small qty-1 to qty-100 orders often shipping same-day from Mouser or DigiKey stock. As of 2026-10-06, distributor stock is healthy for prototype quantities. Direct factory orders require longer 16-week lead times.

What software is required to program 10M08SCE144I7?

Intel Quartus Prime Lite (free) or Quartus Prime Standard (paid) is required to develop bitstreams for the 10M08SCE144I7. Quartus supports VHDL, Verilog, and SystemVerilog synthesis, plus the Platform Designer (Qsys) tool for IP integration. Programming is performed via JTAG using the USB-Blaster or compatible download cable.

What is the difference between 10M08SCE144I7 and 10M08SAE144C8G?

Both are MAX 10 8K-LE devices in 144-pin EQFP packages, but they differ in temperature grade and speed: the SCE144I7 is industrial -40C to +100C at speed grade -7, while the SAE144C8G is automotive -40C to +125C at speed grade -8. They are pin-compatible for most designs, but the I7 variant is preferred for industrial-only systems.

Can 10M08SAE144 be used as a drop-in replacement for 10M08SCE144I7?

Yes, the 10M08SAE144 is pin-compatible with the 10M08SCE144I7 in the 144-EQFP package, sharing 8,000 logic elements and the MAX 10 architecture. The difference is temperature grade: SAE144 covers -40C to +125C (automotive, A7) versus SCE144I7's -40C to +100C (industrial, I7). For industrial-only designs the parts are interchangeable.

10M08SCE144I7 vs 10M16SCE144 - which is better for my application?

The 10M16SCE144 has 16,000 logic elements (2x the 10M08SCE144I7's 8,000) and more embedded memory in the same 144-EQFP package. Choose 10M08SCE144I7 for cost-sensitive, smaller designs; switch to 10M16SCE144 when your logic utilization exceeds ~7,000 LEs or you need additional M9K blocks for buffer-heavy workloads. Both share identical power rails and JTAG pinout.

Is 10M08SCE144I7 suitable for motor control applications?

Yes, the 10M08SCE144I7 is widely used in motor and stepper control front-ends due to its high GPIO count (101), integrated 12-bit ADC for current sensing, and deterministic instant-on behavior. The industrial temperature grade supports factory-floor deployment. For multi-axis drives requiring more LEs, consider the 10M16SCE144 or 10M25SCE144 in the same package family.

What are the key specifications of 10M08SCE144I7 that engineers should know?

The 10M08SCE144I7 integrates 8,000 logic elements, 387,072 bits of M9K embedded memory, 101 user I/O, a 12-bit hard ADC, dual-image on-die flash, and operates from -40C to +100C at 3.0 V core supply in a 144-EQFP (22x22 mm) package. Industrial grade, RoHS compliant, supported by Quartus Prime Lite software.

Справочные инженерные данные для 10M08SCE144I7 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the 10M08SCE144I7 when you need a small, non-volatile FPGA with industrial temperature range, integrated analog, and high GPIO count in a 144-EQFP footprint. It is the sweet spot for industrial I/O expansion, motor control front-ends, and protocol bridges where 8K logic elements suffice. If your design exceeds ~7K LE utilization, choose the 10M16SCE144 (16K LE, same 144-EQFP package, pin-compatible for most I/O banks). For automotive (-40C to +125C) deployments, choose the 10M08SAE144I7G. For applications requiring fewer than 2K LE, the 10M02SCU169 provides cost savings. Cross-brand alternatives from Lattice (MachXO2, ECP5) or Microchip (PolarFire, IGLOO2) are NOT pin-compatible and require PCB redesign - only consider them when migrating to a different vendor for supply security.

Сравнение с аналогами

Параметр	Этот товар	10M08SAE144I7G	10M16SCE144I7G	10M08SAE144C8G	10M08SCU169I7G	10M02SCU169I7G	10M08SCE144C8G
Package	144-EQFP	144-EQFP - same	144-EQFP - same	144-EQFP - same	169-UBGA	144-EQFP	144-EQFP - same
Brand	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel
Logic Elements	8000	8000 (same)	16000 (2x)	8000 (same)	8000 (same)	2000 (smaller)	8000 (same)
Embedded Memory (Kbits)	387	387 (same)	549 (+42%)	387 (same)	387 (same)	108 (-72%)	387 (same)
User I/O	101	101 (same)	101 (same)	101 (same)	130 (+29%)	78 (-23%)	101 (same)
Temperature Grade	Industrial -40C to +100C	Automotive -40C to +125C	Industrial -40C to +100C	Commercial 0C to +85C	Industrial -40C to +100C	Industrial -40C to +100C	Commercial 0C to +85C
On-die Flash	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Embedded ADC	12-bit	12-bit	12-bit	12-bit	12-bit	12-bit	12-bit
Core Voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V

Ключевые отличия

On-die non-volatile flash configuration eliminates boot PROM (против Cyclone V E (5CEBA4) SRAM FPGA)
Highest GPIO density in the MAX 10 8K-LE family at 144-EQFP (против 10M02SCU169I7G (78 GPIO))
Industrial temperature grade at lower cost than automotive variant (против 10M08SAE144I7G (automotive grade))
Integrated 12-bit ADC and temperature sensing diode eliminate external components (против Lattice MachXO2-7000ZE)

Заметки по проектированию

The 10M08SCE144I7 requires three rails: VCCINT (1.2 V core), VCCIO (3.0 V typical, 8 banks), and VCCA (2.5 V analog). All three must ramp within 100 ms of each other to avoid latch-up per Intel MAX 10 handbook. Use a power sequencer IC or tying all enables to a common rail with bulk capacitance on each output to ensure monotonic ramp. Decoupling per bank: 0.1 uF X7R plus 10 uF bulk per VCCIO pin, and 0.1 uF plus 10 uF on VCCINT.

The 144-EQFP package uses an exposed thermal pad on the bottom that must be soldered to a PCB copper plane of at least 1 square inch. Estimated: at full fabric utilization (~70% LE) and 100 MHz toggle, the 10M08SCE144I7 dissipates approximately 0.5-0.8 W; with 31.4 C/W theta_JA on a 4-layer JEDEC test board, junction rise is 25-35 C above ambient. For enclosed industrial enclosures above 70 C ambient, additional copper area or forced airflow is recommended. The on-die temperature sensing diode allows real-time thermal monitoring without external sensors.

MAX 10 devices require impedance-controlled traces for LVDS pairs and DDR interfaces. Route differential pairs with 100 ohm differential impedance and length-matched within 20 mils. Place JTAG pull-ups (10 kohm to VCCIO) on TMS, TDI, and nCONFIG per Intel AN 446. Keep the exposed-pad footprint free of signal vias within 0.5 mm of the pad edges to maintain solder joint reliability.

Common design pitfalls with the 10M08SCE144I7 include: (1) forgetting to set MSEL pins correctly for the desired configuration mode - leaving them floating causes configuration failures; (2) using LVDS without 2.5 V VCCIO on those banks - 3.3 V only supports LVCMOS; (3) omitting the ADC reference decoupling - VREF requires 0.1 uF X7R close to the pin; (4) assuming all 144 pins are user I/O - 101 are GPIO, others are power/ground/JTAG; (5) selecting the wrong Quartus Prime device variant, which causes bitstream generation to fail at compile time.

Информация о соответствии

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Без свинца

Yes

Без галогенов

Unknown

Конфликтные минералы

Compliant

RoHS compliant per Altera/Intel product page. Industrial temperature grade (I7 suffix) is NOT AEC-Q100 qualified; choose SAE144I7G with A7 suffix for AEC-Q100 automotive.

Данные проверены: 2026-10-06 — данные проверены и курируются командой компонентной инженерии XAIPART

Источники: Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor

Связанные компоненты & термины

Altera Intel MAX 10 10M08SCE144I7 10M16SCE144 10M08SAE144 10M02SCU169 FPGA field-programmable gate array non-volatile FPGA logic element configurable logic block M9K memory block 144-EQFP LQFP JEDEC RoHS AEC-Q100 industrial temperature grade Quartus Prime JTAG 12-bit ADC motor control industrial automation PLC LVDS I2C SPI UART PROFINET EtherCAT Modbus