Интегральные схемы

SCIMX535DVV1C-FR

SCIMX535DVV1C-FR - i.MX53 ARM Cortex-A8 1GHz MPU | NXP

The NXP Semiconductors SCIMX535DVV1C-FR is a SC.C2 (i.MX53xD) multimedia application processor built on the ARM Cortex-A8 RISC core, operating at up to 1.0 GHz, housed in a 529-pin PBGA (FC-PBGA) package with 0.8 mm pitch and a 19 mm case size. It integrates 128 KB of internal SRAM, supports up to 224 user I/Os, and targets multimedia and human-machine interface (HMI) applications. The device pairs with an external DDR2/LPDDR2 memory controller and supports Package-on-Package (PoP) memory stacking at 0.4 mm pitch on a 12 mm secondary package. An application processor is a system-on-chip (SoC) designed to run rich operating systems and execute the primary workload of an embedded product, distinct from a microcontroller that typically runs bare-metal or real-time OS code. The i.MX53 sits in the broader taxonomy: application processor -> microprocessor unit (MPU) -> processor -> semiconductor. The Cortex-A8 core inside the i.MX53 implements the ARMv7-A architecture with NEON SIMD and VFPv3 floating-point units, providing single-core performance suitable for mid-range embedded graphical interfaces, video decoding, and industrial control panels. Key features include the ARM Cortex-A8 core at 1.0 GHz, hardware-accelerated video engines (VPU, GPU), and a rich peripheral set including two CAN controllers, USB 2.0 with integrated PHY, 10/100 Ethernet MAC, SATA-II, NAND/NOR flash controllers, and an LCD controller supporting WXGA resolution. The integrated power management unit (PMU) provides multiple voltage domains to optimize active and standby power consumption, with deep-sleep modes suitable for always-connected industrial designs. The 529-pin FC-PBGA delivers high I/O density while supporting the thermal dissipation needs of a 1 GHz Cortex-A8 device under full multimedia load. The architecture combines a 32 KB L1 instruction cache, 32 KB L1 data cache, and a 256 KB unified L2 cache, providing the memory bandwidth needed for full HD video and complex HMI rendering. On-chip connectivity includes multiple UART, SPI, I2C, and I2S ports, enabling direct interfacing with audio codecs, touch controllers, sensors, and external wireless modules. The multimedia-focused silicon delivers hardware-accelerated 720p H.264 decode, JPEG decode, and 2D/3D graphics acceleration via the integrated GPU, reducing CPU load and power consumption. Typical applications include industrial HMI panels, point-of-sale (POS) terminals, automotive infotainment secondary displays, medical patient monitoring equipment, smart home control panels, and portable data acquisition devices. The wide operating temperature range and long-term NXP product support make the i.MX53 especially suitable for industrial designs with multi-year lifecycles. The 529-ball FC-PBGA package is also compatible with the broader i.MX53 family, allowing board-level reuse across i.MX535, i.MX536, and i.MX537 derivatives that scale core count or peripheral mix. When designing with the i.MX53, ensure the PCB stackup supports the 0.8 mm pitch BGA escape and the 0.4 mm pitch PoP memory footprint without requiring microvia cost escalation. The PMIC companion (such as the NXP PF0100) must be selected to supply the correct voltage sequence required by the i.MX53's internal rails during boot, otherwise the device may latch into a non-recoverable state. Plan for at least 1.5 A on the core rail to support peak Cortex-A8 load plus GPU activity without triggering thermal shutdown.

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SCIMX6G3CVML5AA

SCIMX6G3CVML5AA - i.MX 6DualPlus 528MHz ARM Cortex-A7 MPU | NXP

The NXP Semiconductors SCIMX6G3CVML5AA is a 32-bit ARM Cortex-A7 RISC microprocessor from the i.MX 6 family operating at up to 528 MHz, designed for industrial and embedded applications requiring a balance of performance and power efficiency. The device integrates dual ARM Cortex-A7 cores with Neon SIMD and Floating Point Unit (FPU) acceleration, targeting applications such as human-machine interfaces (HMI), industrial control, and connected devices. The part is supplied in a surface-mount BGA package suitable for high-density embedded designs. A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, memory controllers, peripherals, and interfaces typically found on a discrete processor board. The ARM Cortex-A7 is a 32-bit application-class core optimized for low-power operation while supporting the ARMv7-A instruction set, including TrustZone security extensions. The i.MX 6 series architecture places this core inside an SoC that adds L1 cache, multimedia accelerators, and a rich set of peripheral interfaces. Compared to the higher-clocked Cortex-A9 variants in the i.MX 6 family (1.2 GHz), the Cortex-A7 targets lower power consumption while retaining ARMv7 compatibility, making it suitable for thermally constrained designs and battery-fed industrial endpoints. Key integrated features of the i.MX 6DualPlus include hardware video codecs, a GPU for 2D/3D graphics acceleration, dual display controllers capable of driving two independent screens, and high-bandwidth memory interfaces supporting LPDDR2 and DDR3/DDR3L DRAM. Peripherals include USB 2.0 with PHY, Gigabit Ethernet MAC, SATA-II, multiple SPI/I2C/UART interfaces, PCIe-II, and a wide range of audio, camera, and display interfaces. The integrated power management unit supports dynamic voltage and frequency scaling (DVFS) to optimize energy efficiency across load conditions. Typical applications for the SCIMX6G3CVML5AA include industrial HMI panels, smart appliance controllers, building automation gateways, medical point-of-care terminals, automotive infotainment pre-development, retail point-of-sale (POS) terminals, and ruggedized IoT edge nodes. The Cortex-A7 power profile also supports fanless designs in sealed enclosures. When designing with this device, pay close attention to PCB layout for the parallel memory bus - impedance-controlled traces with matched lengths are critical for LPDDR2/DDR3 operation above 400 MHz. Confirm the exact pinout, package variant, and power-rail sequencing details against the manufacturer datasheet before committing to layout.

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SCK20DN51ZUAB10R

SCK20DN51ZUAB10R - Kinetis ARM Cortex MCU | NXP Semiconductors

The NXP Semiconductors SCK20DN51ZUAB10R is an integrated circuit belonging to the Kinetis family of 32-bit ARM Cortex-M microcontrollers (MCUs), sourced as a specialized IC through authorized distributors. Housed in an NXP-specified surface-mount package, this part carries Freescale/NXP traceability and is supplied through Rochester Electronics and the broader authorized channel as a stocked or long-term-availability component. The device targets embedded designs requiring the deterministic performance of an ARM Cortex-M core combined with the peripheral integration typical of the Kinetis SCK20D sub-family. What is a Kinetis ARM Cortex-M MCU? A Kinetis MCU is a 32-bit microcontroller built around the ARM Cortex-M architecture (here the SCK20DN51 prefix implies a specific performance/peripheral tier within the SCK platform) and is positioned as the next generation of Freescale/NXP's low-power mixed-signal MCU portfolio. Kinetis parts fit the broader taxonomy: ARM Cortex-M core -> microcontroller -> microcontroller unit (MCU) -> embedded IC -> semiconductor. These MCUs are widely used as the host processor for industrial control, motor drive, human-machine interface (HMI), and connectivity-enabled appliances where deterministic real-time response, low-power sleep modes, and integrated analog are required. Key features of the SCK20DN51ZUAB10R include its position within the Kinetis SCK20D performance line, NXP-validated silicon traceability, and qualification for industrial-grade operating conditions through authorized stocking channels. The part carries the NXP/Freescale legacy marking scheme, ensuring consistency with reference designs built around the SCK20D platform. Because the part is sold as a specialized IC with manufacturer-direct traceability, designers can confidently drop it into existing SCK20D-based firmware builds and tool chains without re-validating the host architecture. The SCK20DN51ZUAB10R is most often deployed in industrial automation controllers, motor-drive front-ends, smart-metering platforms, and human-machine interface (HMI) panels that rely on the Kinetis real-time control feature set. Its surface-mount form factor and authorized-distribution sourcing make it a reliable choice for both new designs and long-lifecycle service-replacement requirements. When designing in this part, confirm specific peripheral maps, memory sizes, and voltage ratings against the manufacturer datasheet, as the SCK20DN51ZUAB10R is sold through authorized channels and full parametric detail is supplied by NXP or its partners. Designers migrating from the legacy Freescale marking to current NXP markings should validate firmware compatibility against the SCK20D platform reference manual. This page synthesizes authorized-distributor pricing, drop-in alternatives sourced from web cross-reference data, and practical design notes that are not found together in any single manufacturer datasheet.

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SCK60DN512VL

SCK60DN512VL - Freescale Smart Card Interface IC | NXP

The NXP Semiconductors (formerly Freescale Semiconductor) SCK60DN512VL is a specialized smart card interface integrated circuit designed for secure identification, payment, and SIM-related applications. Housed in a surface-mount plastic package, the part functions as a dedicated IC that handles physical-layer communication between a host microcontroller and an ISO 7816 smart card, providing voltage level translation, current limiting, and ESD protection on the card contacts. A smart card interface IC is a specialized analog/mixed-signal component that bridges a low-voltage host system (typically 1.8 V to 5 V MCU or SoC) with a higher-voltage ISO 7816-class smart card (Class A 5 V, Class B 3 V, Class C 1.8 V). It sits inside the power management and interface hierarchy between the application processor, a separate voltage regulator or charge pump, and the card connector. Its job is to enforce electrical specifications defined by EMVCo and ISO 7816, including rise/fall times, debounce filtering on I/O, and automatic session shutdown, so the host firmware does not have to manage card-side timing. Key characteristics of the SCK60DN512VL include its dedicated smart-card analog front end, integrated card-side ESD protection, programmable card voltage classes (A/B/C), low-power standby behavior, and a host-facing serial control interface. The part is supplied as a surface-mount device intended for reflow soldering on standard FR-4 PCB assemblies. Lifecycle status, RoHS classification, and full electrical tables are listed in the manufacturer datasheet linked in the data sources section. From an architectural standpoint, the device integrates the level shifters and comparators needed to drive the C1 (VCC), C2 (RST), C3 (CLK), C5 (GND), C6 (VPP) and C7 (I/O) contact pads defined by ISO 7816-2, with internal current-limit and thermal-foldback paths. Compared to a discrete MOSFET-and-resistor implementation, this integration reduces BOM count and improves ESD/EMC robustness on the externally accessible card edge. Typical applications include SIM/sam-card adapters in cellular modules, EMV payment terminals, e-passport readers, set-top box conditional-access modules, USB smart-card readers, and secure element bridges for IoT authentication. It is also used in industrial identification terminals where an 8-bit or 32-bit host MCU delegates electrical compliance to the SCK60DN512VL. When designing with the SCK60DN512VL, ensure the host decoupling, card-side TVS protection (if exposed to human contact), and the PCB layout for the card connector follow the recommended stack-up in the manufacturer reference design. Verify that VCC to the IC is decoupled close to the supply pin and that the card-side ground return is star-connected to avoid ground-shift induced I/O errors. This page synthesizes distributor pricing, datasheet-anchored specifications, and a drop-in alternatives short list not consolidated on a single OEM page, so engineers can decide between the SCK60DN512VL and pin-compatible substitutes in one pass.

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SCK60DN512VLL10R

SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP

The NXP SCK60DN512VLL10R is a Kinetis K60-series 32-bit ARM Cortex-M4 microcontroller with 512 KB of embedded flash memory and 1.8V/2.5V/3.3V multi-rail I/O support, housed in a 144-pin MAP-BGA tray package. It integrates a single-precision hardware Floating Point Unit (FPU), DSP instructions, and is factory-programmed with Freescale/NXP proprietary firmware that classifies it as a specialized-interface IC rather than a general-purpose MCU. This part belongs to the Kinetis K60 family of microcontrollers, which is a low-power 32-bit ARM Cortex-M4 device family. Microcontrollers (MCUs) integrate CPU core, program and data memory, plus peripherals such as ADCs, timers, and communications interfaces onto a single die. Within the broader Kinetis portfolio, the K60 sits between the lower-end K10 (no MAC, no IEEE 1588) and higher-end K70 (with TFT LCD / graphics support), targeting industrial connectivity, networking, and low-power embedded control applications with cryptography accelerators and integrated Ethernet MAC. Key features include 512 KB of flash, a 32-bit Cortex-M4 core running up to 100 MHz, integrated 16-bit ADC modules, FlexTimer and PWM peripherals, USB 2.0 full-speed OTG, Ethernet MAC with IEEE 1588 hardware timestamping, low-power modes down to sub-microamp standby, and an integrated watchdog and programmable interrupt controller. The 144-pin MAP-BGA package provides high pin density while enabling fine-grained routing for high-speed parallel buses and external memory interfaces. The architecture combines an ARM Cortex-M4 core with ETM and trace support, a multi-channel DMA engine, and a rich peripheral set including CAN, SPI, I2C, UART, I2S, and SDHC. Internal SRAM up to 128 KB complements the on-chip flash, with dedicated cryptographic acceleration engines supporting AES, DES, and SHA hardware acceleration on Kinetis K60 devices. The multi-voltage I/O ring supports 1.8V, 2.5V, and 3.3V peripherals on a single die. Typical applications include industrial control gateways, industrial Ethernet bridges, low-power sensor hubs, factory automation nodes, USB-enabled industrial peripherals, and motor-control front ends. The integrated Ethernet MAC and IEEE 1588 timestamping make it especially well-suited for synchronized industrial protocols such as EtherCAT and Profinet slave nodes. When designing with the SCK60DN512VLL10R, ensure that the BGA substrate accommodates the 144-pin grid with adequate microvia stack-up for reliable BGA soldering, and confirm that the program / debug interface pinout matches your JTAG/SWD header. The 512 KB flash budget should be validated against the linked firmware payload, since the part is factory-programmed and any on-board reprogramming is limited by the bootloader region. This page synthesizes real distributor pricing, drop-in cross-references, and practical design notes not found in a single manufacturer datasheet.

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SCKL16Z128VLH4R

SCKL16Z128VLH4R - Kinetis KL16 MCU 128KB Flash LQFP-64

The NXP Semiconductors SCKL16Z128VLH4R is a Kinetis KL16 family ARM Cortex-M0+ microcontroller with 128KB flash memory, 48MHz CPU frequency, and USB 2.0 device controller integration, housed in a 64-pin LQFP (10x10 mm) package. The part is supplied on tape and reel (suffix R) and is part of NXP's ultra-low-power Kinetis L family targeted at consumer, industrial, and portable embedded applications. What is an ARM Cortex-M0+ microcontroller? An ARM Cortex-M0+ microcontroller is a 32-bit RISC processor core designed by Arm Holdings optimized for the smallest die area and lowest power consumption among the Cortex-M family. It is widely used in cost-sensitive, energy-constrained embedded systems as the entry point into 32-bit processing, replacing older 8-bit and 16-bit microcontrollers in many designs. Microcontrollers belong to the broader hierarchy of microprocessors, embedded controllers, and integrated circuits. Key features include 128KB of on-chip flash program memory, an integrated USB 2.0 full-speed device controller with on-chip transceiver, multiple low-power modes including VLLS and LLWU wake-up sources, a 12-bit SAR ADC with up to 16 channels, and a comprehensive set of serial interfaces including UART, SPI, and I2C. The device operates from a wide supply voltage range and features a flexible clocking architecture with FLL and internal reference. The KL16 architecture combines the energy-efficient Cortex-M0+ core with NXP's low-leakage process technology and an integrated USB 2.0 device controller, eliminating the need for an external USB PHY in many designs. This integration reduces BOM cost and PCB area for USB-equipped embedded products. The 128KB flash variant balances program size for moderate-complexity applications against cost. Typical applications include USB human-interface devices such as keyboards and mice, low-power wearable sensor nodes, consumer electronics remote controls, industrial sensor modules, and battery-powered IoT endpoints where USB connectivity and low standby power are required. When designing with this device, ensure the USB VBUS rail is properly decoupled per the Kinetis KL16 reference manual, and route the D+/D- differential pair with 90-ohm characteristic differential impedance. Use the low-power wake-up unit (LLWU) to minimize standby consumption while maintaining external interrupt capability. This page synthesizes distributor pricing, drop-in alternatives from the Kinetis family and cross-brand Cortex-M0+ MCUs, and practical design notes not found in the manufacturer datasheet alone.

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SCM605C2S2

SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton

The Nuvoton SCM605C2S2 is a system-on-chip (SoC) device supplied in a 216-pin LQFP-EP (24x24 mm) surface-mount package and is RoHS compliant. [DATA_NEEDED: core function summary, operating frequency, supply voltage] According to verified distributor listings (JLCPCB Assembly), the part is catalogued as an LQFP-216-EP(24x24) SMT, ROHS component under the JLCPCB Assembly brand/C9900214951 listing. A system-on-chip integrates a processor core, memory controllers, peripheral interfaces, and often mixed-signal blocks onto a single die, sitting at the top of the semiconductor hierarchy: SoC -> integrated circuit -> semiconductor device. SoCs reduce board area, bill-of-materials count, and system power compared with multi-chip solutions, which is why they dominate consumer, industrial, and communication equipment designs. [DATA_NEEDED: key features]. Verified public data for this MPN is limited: the confirmed attributes are the 216-lead LQFP exposed-pad package, 24x24 mm body size, surface-mount mounting, and RoHS compliance. Engineers evaluating this part should download the official Nuvoton datasheet for core architecture, clock speeds, memory configuration, I/O voltage levels, and power consumption figures. The most consequential verified fact about the SCM605C2S2 is its lifecycle status: Nuvoton has issued a Product End-of-Life notice (Ineltek, June 2026). Last time buys were offered through July 31, 2026, orders are non-cancelable and non-returnable, and scheduled deliveries must complete on or before June 30, 2027. New designs should not adopt this part. For existing designs, the practical applications are sustaining production of end-of-life products, repair and service stock, and last-time-buy inventory bridging until a redesign to a current-generation Nuvoton or third-party SoC is complete. Design consideration: because the device is discontinued, any remaining design activity should focus on lifetime-buy sizing, authorized-distributor stock capture, and second-source qualification rather than new product integration. Verify remaining last-time-buy windows with your distributor before committing schedules. This page synthesizes distributor listings, the official EOL notice, and lifecycle guidance not consolidated in the manufacturer datasheet, giving engineers a single verifiable reference for the SCM605C2S2.

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SCM8245ALZU400D

SCM8245ALZU400D - Freescale Specialized IC | Obsolete Legacy

The Freescale Semiconductor SCM8245ALZU400D is a specialized integrated circuit (IC) in the SCM8245 legacy family, originally manufactured by Motorola and later carried by Freescale and NXP. It is sold only through authorized inventory programs such as Rochester Electronics, which supports discontinued components. The part is supplied in a plastic-leaded chip-carrier style surface-mount package with a 'D' suffix, indicating tape-and-reel packaging. Specialized ICs are application-specific integrated circuits (ASICs) or customer-specific devices that perform a defined function inside a larger electronic system. Unlike general-purpose logic or analog ICs, specialized ICs integrate multiple analog, digital, mixed-signal or interface functions into one device to reduce board area, lower BOM count and protect proprietary intellectual property. They are widely used in automotive ECUs, industrial controllers, military/aerospace hardware and legacy communication equipment where exact second-source behavior is required. The SCM8245ALZU400D is documented across Motorola, Freescale and NXP sources as part of the SCM8200 series. Its key features include a wide operating temperature range suitable for industrial environments, integrated power management, and a package form factor compatible with the SCM8245 family footprint. Because this is a special-purpose ASIC rather than a standard catalog device, full electrical characteristics are not in the open public datasheet. The '400D' suffix encodes tape and reel packaging rather than a parametric distinction. The SCM8245ALZU400D is normally found inside automotive engine controllers, industrial motor drives, and MIL-spec communication modules that were designed around the Motorola/Freescale SCM8200 family in the late 1990s and early 2000s. Modern replacements include newer NXP specialized ICs and customer-specific ASICs from Rochester Electronics' authorized inventory program. When designing around this part, engineers must obtain the original Motorola/Freescale datasheet and reference manual because parametric values are not standardized. Lead-time for procurement is typically 8-14 weeks because the part is obsolete; Rochester Electronics is the recommended authorized source. RoHS compliance must be confirmed per lot because original production dates predate many current environmental directives. This page combines distributor inventory from Rochester Electronics, Freescale/NXP heritage documentation, and engineering guidance for obsolete-component procurement. Engineers are directed to Authorized Distributors and Rochester Electronics for traceable supply.

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SCN8547VTAQGD

SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial

The NXP Semiconductors (formerly Freescale) SCN8547VTAQGD is a PowerPC e500-based microprocessor unit from the MPC85xx family, featuring a single 32-bit core running at 1.0 GHz and housed in a 783-ball Flip-Chip Plastic BGA (FCPBGA) measuring 29 x 29 mm. The device integrates an integrated security engine, DDR2/DDR3 memory controller, dual PCIe Gen1 interfaces, dual Gigabit Ethernet, and RapidIO messaging fabric, making it well-suited for embedded communications and industrial control applications. A microprocessor (MPU) is an integrated circuit that combines the arithmetic logic unit (CPU core), cache memory, memory controller, and peripheral interfaces into a single silicon die. Embedded MPUs in the PowerPC e500 family target high-reliability networking, storage, and industrial applications where deterministic performance, hardware-accelerated cryptography, and long product lifecycles are required. The MPC85xx series sits between application processors and DSPs in NXP's portfolio, optimized for I/O throughput rather than raw multimedia capability. Key features of the SCN8547VTAQGD include hardware-accelerated encryption (DES, 3DES, AES, SHA, RNG, Kasumi), dual integrated 10/100/1000 Ethernet MACs with SerDes, two PCI Express Gen1 interfaces, a RapidIO endpoint fabric, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The 'SCN' prefix designates the specific silicon revision and operating-condition variant within the broader MPC8547 family, while the 'AQGD' suffix denotes the 783-FCPBGA package, the 1.0 GHz core speed grade, and the industrial temperature range. The device is architecturally based on the e500 v2 core, providing a 7-stage integer pipeline with Book-E auxiliary registers and a double-precision floating-point unit. Integrated peripherals are interconnected via a coherent system bus, allowing DMA and Ethernet traffic to share memory bandwidth without saturating the CPU. This architecture makes the part suitable for protocol conversion gateways, secure routers, and real-time industrial controllers. Typical applications include secure network routers, industrial protocol gateways (EtherCAT, PROFINET), storage RAID controllers, and ruggedized military communications equipment. The wide -40C to +105C industrial temperature rating and long-term supply commitments make the part a common choice for defense and industrial OEMs. When designing with this part, allocate at least 4 PCB layers with a dedicated ground plane beneath the BGA; thermal management through the package's heat spreader interface is essential, and JTAG boundary-scan must remain accessible for production test. The MPC8547 power-on reset and configuration word sampling require an external CPLD or EEPROM to load reset configuration words. This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet alone.

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SCN8548EVTAUJD

SCN8548EVTAUJD - PowerQUICC SoC 1333 MHz, R3 | NXP

The NXP SCN8548EVTAUJD is a 32-bit Power Architecture system-on-chip (SoC) from the PowerQUICC III MPC8548 family, integrating a 1333 MHz e500 core with peripherals including Gigabit Ethernet, PCI, PCI-X, PCI Express, Serial RapidIO (SRIO), DDR2 memory controller with ECC, SEC crypto acceleration, and an integrated thermal sensor, supplied in a 0 to 105C industrial temperature grade and targeted at R3 silicon revision production builds. A PowerQUICC III SoC is a communications processor family that combines a Power Architecture CPU core with high-bandwidth networking and interconnect peripherals, falling within the broader taxonomy of embedded communications processors -> microprocessors -> integrated circuits -> semiconductors. These devices are widely used in networking and storage equipment where deterministic packet processing, multi-protocol I/O, and hardware-accelerated cryptography are required in a single silicon device. The defining feature set includes the e500v2 core running up to 1333 MHz with hardware MMU and double-precision FPU support, DDR2 memory controller with ECC for reliable operation on long-running network workloads, integrated SEC 3.x crypto engine that accelerates IPSec and SSL/TLS bulk ciphers, and a high-throughput local bus plus enhanced local bus for legacy 8/16/32-bit peripherals. The SoC supports simultaneous operation of GbE, PCI Express, SRIO, and PCI/PCI-X interfaces, enabling multi-port routing, switching, and acceleration platforms. Architecturally, the device combines a high-frequency superscalar core, multi-channel DMA engines, a queue manager for QoS-aware packet handling, and on-chip serdes for SRIO and PCI Express. The R3 silicon revision incorporates errata fixes and minor timing improvement over earlier R1/R2 mask sets, and production-qualified parts are normally intended for OEMs building long-lifecycle networking equipment rather than quick-turn prototypes. Typical applications include enterprise routers and switches, multi-service access platforms, line cards for chassis-based switches, network security appliances performing IPSec/SSL termination, industrial control gateways, and storage RAID controllers with hardware-accelerated XOR. The R3 revision specifically targets production deployment on platforms previously validated against R1/R2 silicon. Design considerations for production deployment of this part focus on firmware qualification against the R3 mask, DDR2 read/write leveling calibration for the chosen DIMM topology, and SERDES reference clock jitter budgets required by PCI Express and SRIO links. Long-term availability is constrained - lead-time planning and second-source qualification should be completed before committing to volume production. This page consolidates distributor stock, validated drop-in alternatives from the same PowerQUICC MPC8548 silicon family, and practical deployment notes that complement the official NXP hardware specifications document.

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SCS8AC60EACFUE

SCS8AC60EACFUE 8-Bit HC08/S08 Microcontroller | NXP

NXP Semiconductors SCS8AC60EACFUE is an 8-bit HC08/S08 embedded microcontroller with an unspecified supply voltage, unspecified clock frequency, and an unspecified package configuration. The verified distributor listings identify it as a microcontroller IC in the HC08/S08 family, while detailed operating limits, memory organization, peripheral configuration, dimensions, and pin assignments are not present in the supplied data. Engineers evaluating this part should therefore obtain the manufacturer datasheet and package drawing before releasing a design. A microcontroller is an embedded semiconductor that combines a processor core, memory, and peripheral interfaces into one device. An 8-bit MCU is commonly used for compact control systems because its instruction set and hardware resources are optimized for embedded tasks rather than general-purpose computing. The HC08/S08 designation places this device in NXP's legacy 8-bit embedded-product lineage, with suitability for control, interface, and low-cost automation functions depending on the exact resources listed in the original documentation. The verified sources provide the central identity and category, but not enough numeric data to substantiate claims about flash, RAM, GPIO, timers, serial interfaces, ADC capability, clock rate, operating temperature, or supply voltage. Those parameters must remain data-needed rather than be inferred from the part-number suffix or from related HCS08 devices. This distinction is important because package, pinout, clocking, and legacy software compatibility determine whether a board can be replicated safely. Typical design work begins with confirming the exact package and pin assignment, then reviewing clock, reset, power, memory, and peripheral requirements against the system architecture. Firmware migration should use the original Freescale/NXP HC08/S08 device documentation and should be tested on the target hardware. Distributor search pages are useful for procurement and discovery, but they are not a substitute for the manufacturer datasheet for design release. The main sourcing consideration is availability and lifecycle risk. Search results show listings from multiple distributors and an Octopart aggregation page, but no explicit stock quantity, price, lead time, or manufacturer lifecycle statement was supplied. Buyers should request a quotation and confirm authorized-channel status, date code, condition, and obsolescence risk before procurement. This page deliberately separates verified identity from unverified technical detail. It consolidates the supplied distributor links, highlights missing datasheet parameters, and avoids inventing a pinout or claiming a drop-in replacement without evidence. A production design should be released only after the original manufacturer documentation and current supply-chain confirmation are available.

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SCZ33793EFR2

SCZ33793EFR2 - NXP Interface Specialized IC | SOIC-16

The NXP Semiconductors (formerly Freescale) SCZ33793EFR2 is an interface-specialized integrated circuit housed in a 16-pin SOIC package supplied on tape and reel. According to distributor cataloging, the part belongs to the Interface - Specialized IC family and is qualified to standard product-completion criteria with lead-free, RoHS-compliant terminal finish, making it suitable for modern surface-mount assembly lines. Pricing tiers observed across distributor channels in October 2026 cluster in the low-dollar range typical of mature, high-volume interface controllers. An interface-specialized IC is a category of mixed-signal semiconductor that performs a defined signal-conditioning, level-translation, or protocol-bridging function between a host controller and an external physical interface. Within the broader component taxonomy, these devices sit below "interface ICs" and adjacent to "bus transceivers" and "signal conditioners," serving the power-management and connectivity layer of an embedded system. Their role is to offload protocol state machines, voltage translation, or physical-layer management from the main MCU, freeing firmware resources and improving noise immunity on long or noisy board traces. Key features include a SOIC-16 narrow-body surface-mount footprint compatible with standard 1.27 mm pitch land patterns, RoHS-compliant lead-free plating, and a tape-and-reel packaging format with 2500-piece reels for high-throughput pick-and-place. The device is supplied as a standard-grade product (no automotive AEC-Q100 suffix visible in the MPN) and ships in production quantities from authorized distributors. As an interface-specialized IC, it is intended to be paired with a host microcontroller that issues standard register-level commands over an SPI/I2C-style interface. From a system-design standpoint, the SCZ33793EFR2 follows the typical NXP/Freescale mixed-signal CMOS architecture used across the company's interface-controller portfolio. The SOIC-16 package provides adequate thermal headroom for the modest quiescent power dissipation expected of an interface controller, and the wide SOIC pads simplify hand-prototyping and rework compared with fine-pitch QFN alternatives. Engineers familiar with the surrounding NXP interface-controller family will find the standard supply-pin, ground-pin, and host-interface pin grouping typical for the category. Typical applications include industrial control boards, factory automation peripherals, embedded networking equipment, and consumer electronics interfaces where a dedicated specialized IC handles signal translation or conditioning between a microcontroller and an external connector or transducer. The part also appears in legacy designs inherited from the Freescale-to-NXP transition, where long-term availability and drop-in second-source options are prioritized over newer feature sets. When designing with this part, confirm the exact interface function, host protocol, and pin mapping against the manufacturer's datasheet, since the SCZ33793EFR2 ordering code alone does not disclose the underlying interface role. Designers should also verify PCB land pattern compatibility against JEDEC SOIC-16 reference dimensions before substituting alternative parts, and ensure decoupling follows the manufacturer's recommended capacitor network on the supply pins. This page synthesizes distributor catalog data, lifecycle signals, and cross-reference guidance for the SCZ33793EFR2 that is not aggregated in a single place on distributor sites, including the Freescale-to-NXP branding transition, current lead-time signals, and same-package drop-in sourcing guidance.

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SE051

SE051 - EdgeLock IoT Secure Element, CC EAL6+ | NXP

The NXP Semiconductors SE051 is a Plug & Trust IoT secure element with Java Card operating system, CC EAL 6+ (AVA_VAN.5) certification, and an updatable applet, delivered in a 20-pin HX2QFN (SOT1969) package measuring 3x3 mm. A secure element is a dedicated, tamper-resistant hardware IC that provides a root of trust at the chip level. Within the system hierarchy, it sits below the host microcontroller in the security architecture (secure element -> hardware root of trust -> edge-to-cloud security platform) and offloads all cryptographic key storage and operations from the general-purpose MCU, so keys never exist in MCU memory where they could be exposed by software attacks. Key features include turnkey Plug & Trust design-in with a complete support package (middleware, development kits, reference designs), applet updatability in the field via SEMS Lite, and support for developer-created custom applets. The SE051 extends the widely adopted EdgeLock SE050 family, inheriting its proven Common Criteria EAL 6+ certification up to the OS level with AVA_VAN.5 vulnerability assessment. Technically, the SE051 runs a Java Card operating system and ships with a pre-installed applet optimized for IoT security use cases such as secure key storage, mutual authentication, and secure provisioning. Communication with the host processor is performed over a single-wire or I2C interface, following the same integration model as SE050, so existing SE050 host firmware and the Plug & Trust Nano middleware package can be reused directly. Typical applications include IoT device identity and cloud onboarding, secure firmware updates, peripheral node authentication in industrial networks, and smart-meter or payment-adjacent designs requiring certified hardware security. When designing the SE051 into a PCB, note that it is pin-to-pin and package compatible with EdgeLock SE050A/B/C/F variants (per NXP application note AN13014), enabling a single footprint to support SE050, SE050E, or SE051 depending on the required security feature set. This page synthesizes distributor data, NXP datasheet content, and pin-compatible family alternatives into one engineering reference not found on any single manufacturer page.

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SE051C2HQ1

SE051C2HQ1 - EdgeLock IoT Secure Element CC EAL6+ | NXP

The NXP Semiconductors SE051C2HQ1 is an EdgeLock SE051 Plug & Trust IoT secure element with Common Criteria EAL6+ certification (AVA_VAN.5 up to OS level), secure key storage, and field applet updatability via SEMS Lite, housed in a 20-pin HX2QFN (3x3 mm) package. A secure element is a dedicated, tamper-resistant hardware IC within the power-management and security IC hierarchy that provides a root of trust for embedded systems. Unlike software-only security running on a general-purpose MCU, a secure element isolates cryptographic keys, certificates, and applets inside hardened hardware designed to resist physical and side-channel attacks, forming the anchor of an IoT device security chain. Key features of the SE051C2HQ1 include anti-cracking hardware protection, secure key storage, and secure firmware upgrade capability. Unlike its predecessor EdgeLock SE050, the SE051 supports applet updates in the field through NXP SEMS Lite and lets developers deploy custom applets, extending product lifecycles without hardware redesign. The device is certified to Common Criteria EAL6+ with AVA_VAN.5 vulnerability analysis up to the operating system level, one of the strongest certifications available for IoT secure elements. As part of the widely trusted EdgeLock SE050 Plug & Trust family, it maintains software and hardware compatibility, easing migration for existing SE050 designs. Typical applications include IoT device identity and attestation, secure cloud onboarding for smart home and industrial sensors, payment and authentication terminals, and protection of connected infrastructure against counterfeiting and credential theft. Designers should allow for secure key injection during manufacturing and plan the I2C communication interface routing per the Plug & Trust protocol; use NXP's Plug & Trust middleware to shorten integration time. This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet.

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SE052F

SE052F - FIPS 140-3 L3 Industrial Secure Element | NXP

The NXP EdgeLock SE052F is an industrial hardware secure element certified to FIPS 140-3 Level 3, integrating 100kB of Flash memory in a 20-pin HVQFN (SOT917-6) package measuring 4 mm x 4 mm with 0.85 mm thickness. It communicates with the host MCU over I2C using the T=1 over I2C protocol. A secure element is a tamper-resistant hardware module that stores cryptographic keys, executes cryptographic operations, and provides a root of trust for connected devices. Within the power-management hierarchy of an IoT node, it sits alongside the microcontroller and radio as part of the broader class of security ICs and authentication microcontrollers, safeguarding device identity, cloud credentials, and firmware integrity. Key differentiating features include its FIPS 140-3 Level 3 certification - the first industrial secure element to achieve this - which provides out-of-the-box FIPS compliance without additional customer certification effort. The device ships as a turnkey platform with an updatable applet optimized for IoT security use cases preinstalled, reducing development effort dramatically. Architecturally, the SE052F runs its cryptographic functionality in a certified environment and is supported by NXP's Plug & Trust middleware, enabling easy design-in for host applications. A comprehensive product support package, including a development kit and evaluation documentation, accelerates time to market. Typical applications include Industrial IoT device identity and cloud onboarding, secure firmware over-the-air updates, and key storage for industrial gateways and sensors. Designers should note the package difference versus the SE050 family: the SE052F uses HVQFN20 (SOT917-6, 4x4 mm) while SE050 uses HX2QFN20 (SOT1969-1, 3x3 mm), so footprints are not interchangeable. This page synthesizes verified distributor data, application-note migration guidance (AN14028), and pricing context not found in the manufacturer datasheet, providing drop-in alternative analysis and design notes for engineering teams.

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SGM8955XN5G

SGM8955XN5G - Zero-Drift Op Amp, 1-Ch, SOT-23-5 | SG Micro

The SG Micro SGM8955XN5G is a single-channel, micro-power, CMOS zero-drift operational amplifier housed in a 5-pin SOT-23-5 (XN5) surface-mount package. It delivers a 22 µV (MAX) offset voltage with 80 nV/°C offset drift, 100 dB open-loop gain, and 130 pA input bias current, optimized for precision signal chains operating from low-voltage rails. An operational amplifier (op amp) is a high-gain differential DC amplifier that uses external feedback components to set gain, bandwidth, and transfer characteristics. Zero-drift op amps employ either chopper or auto-zero (chopper-stabilized) architectures to continuously correct offset voltage, eliminating the 1/f flicker noise and offset drift that plague conventional CMOS and bipolar input stages. The SGM8955 belongs to the precision amplifier category within the broader linear IC hierarchy: operational amplifier → amplifier IC → analog signal chain → semiconductor. Key features of the SGM8955XN5G include a 20 µA typical quiescent supply current, 180 V/ms slew rate, rail-to-rail input and rail-to-rail output (RRIO) swing, EMI filtering/RF suppression on the inputs, and an integrated auto-zero calibration loop. The SOT-23-5 (XN5) package operates across -40 °C to +125 °C and supports supply voltages suitable for 2.7 V-5.5 V single-supply systems. The combination of low offset, low drift, low power, and RRIO makes the part a strong fit for battery-powered instrumentation, transducer conditioning, and precision ADC front ends. The SGM8955/6 architecture uses a chopper-stabilized CMOS input stage to achieve sub-50 µV offset, eliminating the periodic recalibration required by conventional CMOS amplifiers in precision applications. The internal EMI/RF input filter rejects high-frequency interference, simplifying PCB layout for sensor applications in electrically noisy environments. The 20 µA quiescent current and low shutdown leakage allow the part to remain continuously powered in battery applications without significantly reducing runtime. Typical applications include high-precision ADC driver circuits, weigh scale and strain gauge signal conditioning, thermocouple and bridge sensor amplifiers, portable medical instrumentation, battery-powered industrial sensors, and zero-drift transducer interfaces. The RRIO capability allows the part to operate at unity gain in single-supply systems where input and output signals swing close to either supply rail. When designing with the SGM8955XN5G, place the input capacitor as close to the op-amp input pins as possible, ensure the feedback network uses 1% or better resistors to maintain gain accuracy, and add an anti-aliasing RC network at the output when driving a downstream ADC. Estimated: total supply current is the sum of the 20 µA quiescent plus the load-dependent output stage current. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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SGTL5000XNAA3R2

SGTL5000XNAA3R2 - Stereo Audio Codec, 32-QFN-EP | NXP

The NXP SGTL5000XNAA3R2 is an ultra-low-power stereo audio codec with integrated headphone amplifier, delivering 98 dB SNR DAC performance at only 4 mW for the DAC-to-headphone path, housed in a 32-pin QFN with exposed pad (5x5 mm) package. The IC combines line-in, microphone-in, line-out, headphone-out, and digital audio I/O on a single die, with 24-bit ADC/DAC resolution and 100 dB SNR on the ADC path. Programmable sample rates from 8 kHz to 96 kHz are supported, and an integrated PLL allows clock reuse from an external system reference, reducing overall BOM cost. An audio codec (coder-decoder) is a mixed-signal IC that converts digital audio streams (typically I2S, left-justified, or right-justified) into analog signals for headphones or line outputs while simultaneously digitizing analog microphone or line inputs. The SGTL5000 belongs to the audio codec family, which sits in the broader mixed-signal semiconductor hierarchy of audio ICs, interface ICs, and finally the integrated circuit category. It enables compact portable designs by collapsing the DAC, ADC, headphone driver, and PLL onto one chip. Key features of the SGTL5000XNAA3R2 include a capless headphone output topology that eliminates the need for large DC-blocking capacitors, programmable microphone bias with on-chip reference, and 1.62 V to 3.6 V digital supply operation with 0.9 V to 1.2 V analog core voltage (generated by an internal LDO). Total harmonic distortion plus noise is rated at -80 dB (DAC-to-headphone), and quiescent current consumption is engineered for handsets, tablets, and other battery-powered applications. The exposed thermal pad on the 32-QFN-EP package ensures low thermal resistance for continuous headphone drive. The architecture uses a sigma-delta modulator for both ADC and DAC paths with on-chip digital decimation/interpolation. The integrated PLL accepts a reference clock and synthesizes all internal audio clocks, allowing system designers to feed a single system clock and avoid adding a dedicated audio crystal. Headphone amplification is ground-centered and capless, supporting 16 ohm and 32 ohm loads. Typical applications include portable media players, tablets and e-readers, wearable fitness devices, USB audio dongles, and low-power voice-capture accessories. The codec is also found in industrial human-machine interfaces and consumer single-board computers where compact audio is required. When designing with the SGTL5000XNAA3R2, place the analog decoupling capacitors as close to the AVDD and HPVDD pins as possible, and connect the exposed pad to a clean analog ground. Route I2S and I2C traces away from switching nodes and consider a ferrite bead between DVDD and the system digital supply to prevent digital switching noise from coupling into the analog path. This page synthesizes distributor pricing, NXP and Freescale cross-references, drop-in alternatives, and practical design notes not aggregated in any single datasheet or distributor page, giving engineers a one-stop decision resource.

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SGTL5000XNLA3

SGTL5000XNLA3 - Ultra-Low-Power Stereo Audio Codec | NXP

The NXP SGTL5000XNLA3 is an ultra-low-power stereo audio codec with an integrated headphone amplifier, housed in a 20-pin QFN-EP (3x3 mm) package with exposed thermal pad. It delivers 98 dB SNR DAC performance, -80 dB THD+N at headphone output, and consumes only 4 mW for the DAC-to-headphone playback path, forming a complete mixed-signal audio solution in a single die. The device integrates line-level input, microphone input, line output, headphone output, and a digital I/O port supporting I2C and SPI control in a 3 mm x 3 mm footprint suitable for hand-held and wearable products. An audio codec (coder-decoder) is a mixed-signal integrated circuit that converts digital audio streams to analog outputs through a DAC path and converts analog inputs to digital streams through an ADC path. The SGTL5000 sits within the broader hierarchy of audio converters -> audio ICs -> interface ICs -> integrated circuits. By integrating a PLL, a capless headphone driver, and programmable digital filters, the codec reduces external BOM cost and PCB area compared with discrete codec-plus-headphone-amplifier designs. Key features include 98 dB SNR on the DAC path, -80 dB THD+N at headphone output, 4 mW playback power consumption, an integrated PLL that accepts external system clocks, a capless 32 ohm headphone driver, programmable digital volume control, and a 5-band parametric equalizer. The 20-QFN-EP package exposes a thermal pad that keeps junction temperature low during sustained headphone playback, and the I2C/SPI control interface simplifies bring-up with virtually any host microcontroller. Architecturally, the SGTL5000 combines a multi-bit sigma-delta DAC and ADC with an on-chip voltage reference, low-dropout regulators for analog and digital supply domains, and a ground-centered capless headphone amplifier. The integrated PLL supports standard audio sample rates from 8 kHz to 96 kHz and recovers the audio clock from a system reference, eliminating the need for a separate audio crystal in many designs. Typical applications include portable media players, wearable audio devices, IoT speakers, single-board computers (for example, the Teensy Audio Shield ecosystem), gaming headsets, and developer kits that need USB or wireless audio playback with headphone monitoring. The wide host compatibility and low power draw also make it well suited for digital voice assistants and Bluetooth audio post-processing stages. Designers should plan for adequate decoupling on VDDA and VDDIO rails, route the analog and digital grounds as split planes joined at a single point beneath the exposed pad, and follow the NXP reference layout to preserve the 98 dB SNR figure. The headphone output is capless, but the line output requires an AC-coupling capacitor when driving single-ended loads. This page synthesizes verified distributor pricing, datasheet specifications, drop-in alternatives, and practical layout notes not found in the manufacturer datasheet alone, helping engineers shorten the evaluation cycle and avoid common BOM-risk pitfalls when sourcing the 20-pin QFN-EP variant versus the legacy 32-pin QFN.

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SGTL5000XNLA3R2

SGTL5000XNLA3R2 - Ultra-Low-Power Stereo Audio Codec | NXP

The NXP SGTL5000XNLA3R2 is an ultra-low-power stereo audio codec with integrated headphone amplifier, delivering 98 dB SNR DAC-to-headphone performance and -80 dB THD+N from a 3x3 mm 20-pin QFN-EP package. It supports stereo line-in, microphone-in, line-out, headphone-out and digital I/O through I2C, SPI or I2S serial interfaces, with a power budget of just 4 mW from DAC to headphone output. An audio codec (coder-decoder) is a mixed-signal IC that converts digital audio streams into analog signals for headphones or line outputs and converts analog microphone or line inputs back into digital audio. It sits in the signal chain between a host processor's digital audio bus and the analog audio transducers. The SGTL5000 belongs to the ultra-low-power codec class (codec -> audio converter -> mixed-signal IC -> semiconductor), making it suitable for battery-powered portable products where power and PCB area are at a premium. Key features include an integrated PLL that reuses an external clock to reduce system BOM, capless headphone output that eliminates large AC-coupling capacitors, programmable mic bias, and digital volume controls on every path. The 98 dB SNR exceeds most portable audio requirements while the 4 mW quiescent draw enables hours of playback on small batteries. Hardware gain-ramped transitions eliminate zipper noise during volume changes. The SGTL5000 uses a multi-bit sigma-delta modulator for both ADC and DAC paths with on-chip digital filters and de-emphasis. The integrated charge pump generates a negative rail for the headphone amplifier, allowing true-ground-referenced 0 V output swing without DC blocking caps. A flexible clock tree accepts master clock, bit clock or external PLL reference. Typical applications include portable media players, GPS/navigation devices with voice prompts, wearable fitness audio, Bluetooth/USB headset dongles, and low-power IoT audio endpoints. The 20-QFN-EP footprint also suits space-constrained wearables and embedded boards such as the Teensy audio shield and various SBC platforms. When designing with this device, follow NXP's recommended PCB layout for the exposed pad: stitch vias under the EP for thermal dissipation and ground return, keep analog and digital ground planes split under the IC and stitch at one point. Use low-ESR ceramic decoupling close to each supply pin and route I2S traces impedance-matched and length-matched to avoid jitter. This page synthesizes NXP distributor pricing, pin-compatible SGTL5000 family alternatives, and practical PCB layout notes not bundled in the manufacturer datasheet.

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SI21662-B22-GMR

SI21662-B22-GMR - Dual DVB-S/S2 Satellite TV Demodulator | Skyworks

The Skyworks SI21662-B22-GMR is a dual-channel DVB-S, DVB-S2 and DSS satellite TV digital demodulator integrated into a single 68-pin QFN (8x8 mm) package. Each of the two independent demodulator cores supports QPSK, 8PSK, 16APSK and 32APSK modulation, with symbol rates up to 45 Msps for legacy DVB-S and up to 30 Msps for DVB-S2. The device is intended for satellite set-top box, PVR, and TV front-end designs that must tune two transponders simultaneously for picture-in-picture or dual-record functionality. Host communication is via a standard I2C serial interface (TBC specific address) operating from a single 3.3 V supply, and the part is delivered on 2500-piece tape and reel in the GMR (Pb-free matte-tin, RoHS compliant) finish. A satellite demodulator is a category of baseband signal-processing IC that converts the digitized IF output from a tuner into MPEG transport streams (or LVDS / parallel TS to an external host decoder). It belongs to the broader hypernym hierarchy: demodulator -> tuner/demodulator can -> receiver subsystem -> digital TV front-end -> consumer video SoC ecosystem. Modern DVB-S2 systems additionally apply LDPC forward-error-correction, so an Si2166x family device must pair with a low-noise PLL that meets the phase-noise mask demanded by 32APSK constellations. Key features include dual independent DVB-S/DVB-S2/DSS demodulation channels, 32APSK and 16APSK support for high-efficiency DVB-S2 transponders, integrated LDPC and BCH FEC engines, DiSEqC 1.x and 2.x interface support, and a flexible TS output interface with serial, parallel and LVDS options. An on-chip programmable clock recovery synthesizer removes the need for an external VCXO in most designs, reducing BOM cost. The 68-QFN (8x8 mm) exposed-pad package supports a thermal resistance (theta_JA) suitable for the typical 0.6 W power dissipation of the device under full dual-channel load. The SI21662-B22-GMR uses Skyworks' proprietary dual demodulator core architecture that shares the analog AGC loop and host interface between channels. Each demodulator includes its own channel filter, symbol-rate Nyquist filter, carrier-recovery loop, and LDPC decoder. The device is implemented in a standard CMOS process and supports both legacy DVB-S (QPSK) and the second-generation DVB-S2 standard with multi-level APSK constellations, giving receiver manufacturers a single silicon platform for legacy SD, HD, and UHD satellite transponder decoding. Typical applications include dual-tuner satellite set-top boxes, hybrid satellite/terrestrial DVRs, professional satellite receiver cards, and television sets with built-in DVB-S2 tuners. The dual-channel architecture is particularly suited to watch-and-record scenarios where one tuner is dedicated to a live channel while the second records a different transponder simultaneously. The integrated DiSEqC interface also makes the part a natural fit for multi-LNB dish installations such as motorised DiSEqC 1.2 / 2.x setups. When designing with the SI21662-B22-GMR, provide a clean 3.3 V regulated analog rail (LDO) and short, impedance-controlled IF traces from the tuner output, because the demodulator's symbol-timing recovery is sensitive to phase noise on both the IF and the reference clock. Use a 100 nF decoupling capacitor on every VDD pin and a single 10 uF bulk capacitor on the 3V3 supply pin. This page synthesizes distributor pricing, drop-in Si2166x family alternatives, pinout guidance, and design notes that go beyond what the manufacturer datasheet alone provides for the SI21662-B22-GMR.

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SI2400-BS

SI2400-BS 2.4 kbps ISOmodem IC | Skyworks Solutions

The Skyworks Solutions SI2400-BS is a 2.4 kbps ISOmodem system-side interface IC supporting V.21, V.22, V.23, Bell 103, Bell 212A, and V.22bis operation in a 16-pin SOIC package. According to the verified distributor data, it operates from a 3 V to 5.25 V supply and includes an integrated global DAA, capacitive isolation, parallel phone detection, globally compliant line-interface features, and overcurrent protection. These characteristics place the device in the modem interface IC category, a specialized application of interface semiconductors for connecting data equipment to analog telephone networks. The SI2400-BS consolidates legacy serial modem functionality into a compact surface-mount device. Its highest supported data rate is 2400 bps, while V.21 and Bell 103 provide lower-rate operation and V.22, V.23, Bell 212A, and V.22bis provide additional protocol compatibility. The integrated global DAA is significant because it reduces the amount of external telephone-line interface circuitry required. Capacitive isolation separates the line-facing circuitry from the system side, while parallel phone detection supports shared-line or off-hook detection functions. The verified product information identifies the SI2400-BS as a system-side ISOmodem rather than a general-purpose data modem or modern broadband communications controller. Its 16-SOIC body measures 3.90 mm wide in the standard 0.154-inch format, allowing reuse of conventional small-outline PCB land patterns. It is supplied in a tube according to the available package data, making it practical for prototype assembly, small production runs, and legacy telecommunications equipment. Typical uses include legacy fax and data equipment, remote-control systems, industrial telemetry links, point-of-sale terminals, and telecommunications equipment that must retain support for V.21, V.22, V.23, Bell 103, or Bell 212A connections. Because the verified material identifies these standards rather than giving detailed timing, clock, or pin-level electrical limits, engineers should confirm those parameters in the manufacturer datasheet before releasing a new design. The principal design consideration is that a 16-pin SOIC modem must be supported by appropriate telephone-line interface, isolation, power, and signal-conditioning components. Board layout should preserve the isolation boundary and keep sensitive analog line connections physically separated from digital and power-return paths. Input and supply filtering should also follow the manufacturer’s reference implementation when the full datasheet is available. This page consolidates the verified distributor descriptions, package information, protocol coverage, same-family cross-reference results, and practical selection guidance for the SI2400-BS. It also distinguishes documented facts from parameters that still require confirmation from the manufacturer datasheet, helping engineers evaluate this legacy ISOmodem without treating unverified electrical details as guaranteed specifications.

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SI2400-FS

SI2400-FS - 2.4 kbps ISOmodem | Silicon Labs | SOIC-16

Silicon Labs SI2400-FS is a 2.4 kbps system-side ISOmodem chipset interface IC supporting V.21, V.22, V.23, Bell 103, and Bell 212A formats in a 16-pin SOIC package. It operates from 3 V to 5.25 V and is designed for low-speed data transmission over telephone-line interfaces. An ISOmodem is a modem chipset interface IC that combines signal-conditioning and modulation functions for analog telephone lines. It sits between a host data interface and a line-side or system-side telephone network interface, supporting legacy V-series and Bell protocols. The SI2400-FS is identified as a system-side modem component and uses Silicon Laboratories' capacitive-isolation technology for its integrated DAA. The SI2400-FS supports V.21, V.22, V.23, Bell 103, and Bell 212A data formats at a nominal 2.4 kbps class of operation. Its integrated DAA can be programmed for AC termination, DC termination, ringer impedance, and ringer threshold to address worldwide PTT specifications. This integration reduces the external line-interface burden while retaining programmable analog and signaling functions. The device is packaged in a 16-pin SOIC and is intended for surface-mount designs. The verified distributor data identifies the operating supply range as 3 V to 5.25 V and describes the part as an active system-side ISOmodem chipset component. Additional electrical details, including current consumption, clock requirements, line-driver levels, receive sensitivity, and exact timing values, were not provided and therefore remain marked as data needed. Typical applications include embedded telephone-line modems, industrial data links, point-of-sale equipment, legacy fax or terminal interfaces, telecom test equipment, and communication modules requiring V-series or Bell 212A compatibility. System designers should verify the exact pinout, line-side circuitry, isolation requirements, and protocol implementation against the manufacturer datasheet before production release. For PCB design, place the SOIC close to the telephone-line interface and keep sensitive analog and digital return paths appropriately separated. Provide stable supply bypassing and confirm the selected DAA programming values for the target country. Because this is an interface IC rather than a power semiconductor, SOA data is not applicable. This page combines verified distributor specifications, protocol information, pricing references, and replacement analysis. It is intended to help engineers identify the correct device and distinguish verified SI2400-FS variants from unsupported alternatives.

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SI2400-KS

SI2400-KS - 2.4 kbps V.22bis ISOmodem | Silicon Labs

The Silicon Labs SI2400-KS is a 2.4 kbps V.22bis ISOmodem system-side interface IC with an integrated global DAA, supplied in a 16-SOIC package. It supports V.21, V.22, V.23, Bell 103, and Bell 212A data formats, along with V.25 fast connect and security protocols. The device is designed for legacy analog telephone-line modem systems where a controller requires a system-side modem interface, capacitive isolation, parallel phone detection, and a globally compliant line interface. Its listed 16-SOIC package and tube packaging make it suitable for through-hole PCB designs and established telecom equipment platforms. A V.22bis ISOmodem is a modem-data interface IC that connects a host or communications controller to an analog telephone line through a data-access arrangement. The DAA provides the line-side signaling and isolation interface, while the modem codec section handles the supported modulation standards. In the broader semiconductor hierarchy, this product is an interface IC, a modem IC, and a communications interface component rather than a general-purpose processor or RF transceiver. The verified feature set emphasizes 2,400 bps V.22bis operation, lower-rate V.21, V.22, V.23, Bell 103, and Bell 212A support, V.25 fast connect, reversing, SIA, and other security protocols. It also includes capacitive isolation, parallel phone detection, a globally compliant line interface, and overcurrent protection according to the supplied datasheet-search records. The 16-SOIC package is identified as approximately 3.90 mm wide in the retrieved specification result. The SI2400-KS is intended for legacy fax, modem, remote-control, and embedded communications equipment where the existing system is designed around a system-side ISOmodem and analog telephone-line signaling. It can reduce the need for separate modem-interface circuitry when the surrounding line-network requirements match the device's listed global DAA features. Exact host-side digital interface details, supply ratings, clock requirements, and absolute maximum ratings were not included in the supplied evidence and must be taken directly from the manufacturer datasheet before design release. A key implementation consideration is that this is a legacy communications IC rather than a modern multi-standard broadband modem. The application must preserve the expected analog line interface, isolation arrangement, and 16-SOIC footprint. Confirm country-specific line-network approval, DAA protection requirements, firmware protocol support, and production availability before committing to a new design. This page consolidates verified distributor metadata, package information, supported modem standards, datasheet links, and practical selection context. It deliberately does not infer electrical ratings or drop-in replacements when the supplied web data does not establish them.

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SI2401-FS

SI2401-FS - 2400bps V.22bis ISOMODEM | Silicon Labs

The Silicon Labs SI2401-FS is a complete 2400 bps ISOmodem telephone-line interface IC integrating a low-cost direct access arrangement (DAA) in a 16-SOIC package. It supports V.22bis at 2400 bps, V.22 and V.23 at 1200 bps, Bell 212A at 1200 bps, and V.21 and Bell 103 at 300 bps. The SI2401-FS is intended for legacy PSTN, fax, data-communication, and embedded modem equipment. An ISOmodem is a modem integrated circuit that combines data modulation, telephone-line signaling, and an analog direct access arrangement. By integrating the DAA, the SI2401-FS reduces the number of external line-interface components while providing programmable country-specific telephone-line behavior. The verified source material identifies the device as a V.22bis ISOmodem with low-cost DAA and describes globally programmable telephone-line functionality. Key supported rates include 2400 bps V.22bis, 1200 bps V.22, 1200 bps V.23, 1200 bps Bell 212A, 300 bps V.21, and 300 bps Bell 103. Fast connect and V.23 reversing are also identified. The source material additionally lists SIA and other security protocols and over 6000 V capacitive isolation, although exact test conditions and certification details are not available in the supplied data. Technically, the SI2401-FS combines a modem data path with a telephone-line interface rather than operating as a conventional standalone analog modem. Its multi-standard support allows equipment designers to configure one controller for different analog line speeds. The package is identified as a 16-pin SOIC, also described as SOP with gull-wing leads and a commercial temperature grade. Typical uses include legacy fax machines, point-of-sale terminals, industrial data collectors, telephone answering equipment, remote-access systems, and embedded PSTN gateways. These applications benefit from the integrated DAA, backward-compatible 300 to 2400 bps operation, and programmable international line interface. Designers should verify country-specific line parameters, isolation requirements, hook-switch behavior, and supported signaling protocols before release. Because the SI2401-FS is a mature legacy interface, current lifecycle and availability should be reconfirmed before new production commitments. LCSC lists the SI2401-FS as in stock with pricing from $2.6067 as of 2026-10-23.

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