10AX090R2F40I2LG
10AX090R2F40I2LG - 900K Logic Elements FPGA | Altera | Industrial
Altera 10AX090R2F40I2LG is a high-density Arria 10 GX field-programmable gate array with 900,000 cells, 342 I/O, and a 1,517-ball FCBGA package. Verified distributor data identifies 59,234,304 bits of embedded memory and a 0.9 V supply associated with this device family listing. The ordering code also indicates an industrial temperature grade and F40 package designation. These characteristics make the FPGA suitable for data-intensive, high-bandwidth embedded systems where programmable logic, parallel processing, and substantial on-chip memory are required.
A field-programmable gate array is an integrated circuit containing configurable logic blocks, programmable interconnects, memory resources, and input/output elements. FPGA devices are semiconductor ICs that can be configured after manufacturing for functions such as digital signal processing, protocol bridging, control logic, and hardware acceleration. Their hierarchy spans FPGA, programmable logic device, configurable integrated circuit, and programmable logic IC. This programmability enables engineering teams to update interfaces or algorithms without replacing the complete hardware platform.
The headline capacity of 900,000 cells supports complex datapaths and high logic density. Its 342 I/O provide extensive connectivity for parallel interfaces, memory controllers, communications links, and control signals. The listed 59,234,304-bit embedded memory capacity is significant for buffering, packet processing, waveform handling, and other memory-intensive designs. The 0.9 V process-family supply information supports power-conscious architectures, while the industrial grade indicates suitability for demanding operating environments.
The part is implemented in 20 nm technology according to the verified FPGAkey listing. This process generation balances high integration and power efficiency for high-performance programmable logic. The 1,517-ball BGA package is a surface-mount, square ball-grid-array design intended for multilayer PCBs with controlled escape routing, continuous power planes, and high-speed signal-integrity analysis. The F40 package code is part of the full ordering designation and should not be changed independently.
Typical applications include industrial automation, communications infrastructure, test and measurement equipment, medical imaging, aerospace and defense electronics, and high-performance computing. A 342-I/O budget can consolidate multiple interface and control functions, while the 59,234,304-bit memory capacity helps reduce reliance on external memory in appropriate data paths. Engineers must still assess transceiver requirements, logic utilization, memory bandwidth, clocking, thermal performance, and power integrity for the exact system implementation.
Design consideration: the 1,517-ball FCBGA requires a strict PCB stack-up, fanout, via, solder-mask, and assembly strategy. Use the manufacturer package guidance and the device's pin assignment to verify bank compatibility, voltage rails, decoupling, and high-speed routing before schematic release. Preliminary design values not explicitly provided by the verified data are intentionally left for datasheet validation.
This page consolidates verified device capacity, memory, I/O, package, grade, and distributor information; it also distinguishes the exact target from related ordering codes. No compliant five-part drop-in set could be proven from the supplied cross-reference evidence, so related Arria 10 devices are not presented as interchangeable substitutes.
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