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XB3-24Z8PT-J - XBee 3 2.4GHz Zigbee 3.0 TH Module | Digi
The Digi XB3-24Z8PT-J is a Digi XBee 3 series 802.15.4 Zigbee 3.0 transceiver module operating at 2.4 GHz with an integrated PCB trace antenna in a through-hole mounting form factor. The module is built around the Silicon Labs EFR32MG SoC and supports a serial data rate up to 1 Mbps with a 250 kbps RF data rate, while operating from a single 2.1 V to 3.6 V supply. It uses the same TH (through-hole) footprint as legacy XBee S2C modules, providing a true drop-in upgrade path. A wireless transceiver module is a pre-certified, surface-mount or through-hole assembly that integrates an RF transceiver IC, matching network, antenna, and sometimes an onboard microcontroller. These modules live in the broader category of RF & Wireless components, sit below wireless modules, and above bare RF transceiver ICs. They simplify wireless product certification because the radio has already been tested against regional regulatory standards (FCC, IC, ETSI, etc.), allowing end products to inherit the modular certification. Key features include receiver sensitivity of -103 dBm, an integrated PCB antenna, UART/SPI/I2C host interfaces, ADC and PWM I/O, and Zigbee 3.0 mesh protocol support with Digi's MicroPython programmability. The module's transmit output power is approximately +8 dBm (regular XBee 3, not the PRO variant) and the RF data rate is 250 kbps. The through-hole pin layout allows simple socketed or soldered mounting on 2 mm-pitch through-hole pads. Technically, the module combines the EFR32MG ARM Cortex-M4 SoC with an integrated 2.4 GHz radio, an RF front-end with balun, a PCB trace antenna, and onboard LDO regulators supporting the 2.1 V to 3.6 V input range. Digi provides a unified XBee API mode and AT command set across the XBee 3 family, so firmware written for an XBee 3 SMT module will migrate directly to the TH version with no host-side changes. Typical applications include industrial IoT sensor mesh networks, building automation (HVAC, lighting, occupancy), smart energy metering, asset tracking, and wireless remote-control links where Zigbee mesh topology adds self-healing multi-node coverage. The form factor is favorable: the same TH footprint across XBee generations allows customers to upgrade from older XBee S2C modules without PCB rework. When designing with this module, pay attention to antenna keep-out: do not place copper, ground planes, or plastic with high dielectric loss within the PCB antenna's keep-out area, as it will detune and degrade the link budget. Also confirm that the host MCU supplies 3.3 V logic on UART lines, because the module's GPIO is not 5 V tolerant. This page synthesizes distributor pricing, drop-in XBee 3 alternatives, and practical design notes not found in the manufacturer datasheet alone.
XB3-24Z8UM - XBee 3 PRO Zigbee 3.0 Micro U.FL MMT Module | Digi
The Digi XB3-24Z8UM is a Digi XBee 3 PRO Zigbee 3.0 surface-mount RF transceiver module operating in the 2.4 GHz ISM band with a U.FL antenna connector (antenna not included) and MMT (Micro Mount) form factor. Built on the Silicon Labs EFR32MG SoC, it delivers up to 8 dBm (PRO) transmit power and supports the IEEE 802.15.4 / Zigbee 3.0 protocol stack at over-the-air RF data rates up to 250 kbps with serial interface rates up to 1 Mbps. An RF module (radio-frequency module) is a small PCB sub-assembly that integrates a wireless transceiver IC, matching network, crystal, and antenna interface into a single, EMC-compliant package. RF modules sit in the wireless connectivity hierarchy below discrete transceivers and above raw silicon ICs, abstracting RF design complexity so that MCU-based host boards can add wireless capability with a simple UART/SPI/I2C interface. The XB3-24Z8UM belongs to the XBee 3 PRO family, which adds extended RF link budget (PRO = higher TX power, lower RX sensitivity threshold) for longer-range mesh deployments. Key features of the XB3-24Z8UM include 8 dBm (PRO) TX power, 2.4 GHz worldwide ISM band operation, Zigbee 3.0 mesh networking support, and a wide -40C to +85C industrial operating temperature range. The module integrates a Silicon Labs EFR32MG SoC with on-board microcontroller, eliminating the need for an external host MCU in many edge-IoT designs. UART, SPI, and I2C host interfaces are exposed through the 34-pin MMT land pattern. The U.FL RF connector enables use of an external antenna selected for the deployment enclosure. Typical applications include building automation nodes, smart lighting controllers, smart energy metering, digital health peripherals, industrial sensor mesh networks, and any IoT device requiring certified multi-vendor Zigbee 3.0 interoperability. The XBee 3 platform is supported by Digi's XCTU configuration tool and Digi Remote Manager cloud integration, simplifying provisioning and OTA firmware updates. When designing with this module, note that antenna selection is critical - although the U.FL connector is present, RF performance depends entirely on the chosen external antenna, its placement, and ground plane clearance. Allow at least 5 mm of keep-out under the antenna feed trace, follow the MMT footprint exactly, and avoid placing the module near large metal planes that detune the antenna.
XB3-24Z8UM-J - XBee 3 Zigbee 3.0 Module, 2.4 GHz, U.FL Antenna | Digi
The Digi International XB3-24Z8UM-J is a compact surface-mount XBee 3 Zigbee 3.0 transceiver module operating in the 2.4 GHz ISM band, housed in a 34-pin SMD Micro form factor with a U.FL antenna connector (antenna not included). It integrates the Silicon Labs EFR32MG SoC and supports 802.15.4 with a native RF data rate of 250 Kbps and a serial interface rate up to 1 Mbps. The module accepts a 2.1 V to 3.6 V supply, draws sub-microamp sleep currents, and provides UART, SPI, and I2C host interfaces for flexible integration into micro-controlled or hostless designs. A Zigbee module is a pre-certified, drop-in radio subsystem that bundles an RF transceiver IC, crystal, matching network, and PCB antenna or U.FL connector onto a single castellated PCB. XBee modules sit in the broader category of embedded wireless modules, above discrete RF transceivers and below complete IoT gateways. They are widely used to add Zigbee, Thread, or Bluetooth connectivity to a host MCU without requiring the designer to handle RF layout, FCC certification, or mesh protocol stacks. The XBee 3 family specifically combines Zigbee 3.0 with Bluetooth Low Energy (BLE) for provisioning and supports MicroPython for on-module scripting. Key features of the XB3-24Z8UM-J include an integrated Silicon Labs EFR32MG SoC, DSSS spread-spectrum modulation for robust 2.4 GHz operation, an operating temperature range that supports industrial deployment, and an ultra-low sleep current that suits battery-powered wireless sensor nodes. The U.FL antenna variant allows designers to attach an external antenna for enclosures where an on-module chip antenna would suffer detuning. The Micro form factor keeps the module footprint roughly 13 mm × 19 mm, enabling dense IoT endpoint designs. From an architectural standpoint, the XB3-24Z8UM-J separates the radio domain (EFR32MG SoC + RF frontend + shield can) from the host domain (UART/SPI/I2C). The on-board ARM Cortex-M4F core runs the Zigbee 3.0 stack and optional MicroPython, while the host MCU exchanges AT commands or API frames. This split keeps the host firmware simple and shields the application processor from real-time RF stack management. Typical applications include Zigbee wireless sensor networks for smart buildings, industrial telemetry, smart lighting and home automation, asset tracking, and battery-powered remote controls. The combination of low sleep current, mesh networking, and MicroPython programmability suits edge-deployed sensor nodes with infrequent wake cycles. For projects requiring an external antenna placement (for example, inside a metal enclosure), the U.FL variant is the correct choice; for exposed-product designs, the chip-antenna variant (XB3-24Z8CM-J) may be preferred. When designing with the XB3-24Z8UM-J, ensure the host board provides a stable 3.3 V rail capable of peak transmit current bursts (about 130 mA typical) and that the U.FL antenna cable is kept short and away from noise sources. The castellated edge pads require clean solder paste printing and a reflow profile compatible with the integrated shield can; hand-soldering the module is not recommended. Always confirm regional Zigbee channel selection against local regulations (Wi-Fi coexistence considerations in the 2.4 GHz band). This page synthesizes distributor pricing, drop-in XBee 3 family alternatives, and practical design notes not found in the manufacturer datasheet alone. Use the comparison table and selection guide below to choose between the U.FL, chip antenna, PRO, and non-PRO variants.
ZM5101A-CME3R - Z-Wave 500 SiP Module, Sub-GHz, 8051 MCU | Silicon Labs
The Silicon Labs ZM5101A-CME3R is a fully integrated Z-Wave 500 Series Wireless System-in-Package (SiP) module that combines a sub-GHz RF transceiver and an 8051 microcontroller core into a compact 8 mm x 8 mm x 1.2 mm surface-mount module. Operating in the 865.2 MHz to 926.3 MHz sub-GHz band with regional support for 868 MHz (Europe), 908 MHz (United States), and 921 MHz (Japan / Asia) Z-Wave channels, the ZM5101A-CME3R delivers a maximum output power of 6 dBm and receive sensitivity of -94.3 dBm at 100 kbps, enabling reliable mesh networking across typical home-control distances. A Z-Wave module is a self-contained wireless transceiver-plus-MCU module certified for the Z-Wave mesh protocol, used for low-power sub-GHz communication in smart-home and IoT devices. Z-Wave modules belong to the broader family of sub-GHz transceiver modules (ISM < 1 GHz), which sit within RF & wireless connectivity ICs in the broader semiconductor hierarchy. The ZM5101A-CME3R is a SiP (System-in-Package) - i.e. several silicon dies integrated into a single sealed surface-mount package, reducing PCB footprint and EMC compliance burden for the OEM. It belongs to the Silicon Labs ZM5101 family of Z-Wave 500 modules, paired with the ZM5202 PCB-module variant. Key features include 128 kB of embedded Flash, 16 kB SRAM, two UARTs up to 230.4 kbps, two SPI interfaces up to 8 MHz, a 4-channel 12/8-bit rail-to-rail ADC with selectable VDD/internal/external reference, a hardware AES-128 security engine, a 1000-step dimmer control block, automatic response/retransmission, CRC check, and power-on/power-off reset plus software reset. The SiP integrates matching network, crystal, and decoupling, so the host board only needs supply bypass and antenna. Operating supply voltage is 2.3 V to 3.6 V (typical 3.3 V), and the receive current is approximately 32 mA. The ZM5101A-CME3R uses an optimized 8051 core paired with the Sigma Designs (now Silicon Labs) Z-Wave 500 series MAC/PHY. This enables deterministic mesh routing, low-latency acknowledgements, and Z-Wave Plus certification compatibility for gateways, sensors, locks, lighting and HVAC nodes. The integrated hardware AES-128 engine accelerates encrypted Z-Wave frames, freeing the 8051 core for application logic. Typical applications include Z-Wave smart-home gateways, door locks, lighting dimmers, energy meters, HVAC controls, PIR/motion sensors, water-leak sensors, smoke detectors, and AV control remotes. The compact SiP and pre-certified RF section dramatically shorten time-to-Z-Wave-Plus-certification versus discrete transceivers. When designing with this SiP, observe the supply decoupling guidance in the manufacturer datasheet (input and output caps as close as possible to the supply pads), respect the antenna keep-out zone, and ensure the host MCU handles Z-Wave Plus provisioning. The device requires Z-Wave Plus certification for retail products - it is not pin-compatible with non-Z-Wave sub-GHz parts. This page synthesizes distributor pricing, drop-in alternatives and Z-Wave ecosystem notes not found in the manufacturer datasheet alone.
ZM5202 - Z-Wave 500 Wireless Module | Silicon Labs
The Silicon Labs ZM5202 is a fully integrated Z-Wave wireless module combining the SD3502 SoC - which integrates an 8-bit 8051 microcontroller core and a Z-Wave RF transceiver - with a crystal oscillator, SAW filter, and passive RF components in a single compact surface-mount module. It supports Z-Wave sub-1 GHz operation at 908/908.42/916 MHz regional bands with output power up to approximately 4 dBm and receiver sensitivity around -93 dBm. A Z-Wave module is a fully certified, ready-to-integrate wireless subsystem that encapsulates the radio, modulation/demodulation hardware, and the Z-Wave network protocol stack into a single hardware block, dramatically reducing the engineering effort required to add Z-Wave mesh connectivity to products such as thermostats, lighting controls, door locks, and USB sticks. Key features of the ZM5202 include up to 32 GPIO pins, flash and RAM resources sufficient for host-side or single-MCU Z-Wave node firmware, an integrated crystal providing the precise frequency reference required by Z-Wave channelization, and full backwards compatibility with the ZM3102 and ZM4102 modules in terms of GPIO pinout and PCB land pattern. Its module-level regulatory qualification lets customers skip FCC/ETSI RF certification work for the radio portion of their end product. Architecturally, the SD3502 SoC at the heart of the ZM5202 pairs an 8-bit 8051-class CPU with the Z-Wave PHY/MAC radio, so applications can either run the Z-Wave stack natively on the module or offload host connectivity through a UART-style interface. The integrated SAW filter provides strong out-of-band rejection, complementing the Z-Wave protocol's frequency-shift-keyed robustness against in-band interferers. Typical applications include smart-home thermostats, lighting dimmers and switches, door locks, USB stick Z-Wave gateways, and battery-powered wireless sensor nodes. The integrated crystal and SAW filter, combined with regulatory pre-certification, allow designers to focus on application firmware rather than RF matching. When designing with the ZM5202, observe that legacy status: Silicon Labs recommends ZGM130S for new designs. Engineers still specifying the ZM5202 should follow the reference antenna layout and decoupling guidance in the datasheet to preserve the pre-certified RF performance. This page consolidates distributor pricing, drop-in compatible alternatives within the Z-Wave 500-series lineup, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate end-of-life risk and pin-compatible replacements.
ZM5304Ax-CME3 - Z-Wave 908MHz Transceiver Module | Silicon Labs
The Silicon Labs ZM5304Ax-CME3 is a fully self-contained Z-Wave transceiver module operating in the 908 MHz ISM band, built around the Sigma Designs SD3503 Z-Wave 500-series modem IC and integrating a built-in antenna for surface-mount PCB integration. The module delivers up to +4 dBm transmit output power and -103 dBm receiver sensitivity, enabling robust wireless mesh links in Z-Wave home-control and monitoring networks. The device operates from a single 2.3 V to 3.6 V supply rail and exposes a serial interface to the host through a 12-pin surface-mount land pattern. The "Ax" suffix identifies the 908 MHz US/Canada/ANZ regional variant. A Z-Wave transceiver module is a pre-certified wireless subsystem that bundles an RF transceiver, a network protocol stack, and a built-in antenna into a single reflow-compatible component. Within the broader taxonomy, the ZM5304 sits as a sub-module category in the RF module family, itself a branch of RF & wireless components for short-range personal-area networking and home-area sub-GHz mesh networking. Modules of this class remove the burden of RF matching, antenna tuning, and regulatory pre-compliance testing from the OEM designer. Key features include on-board Z-Wave 500-series protocol stack handling MAC/PHY and mesh routing, FCC modular approval under part 15 limits plus pre-scanned CE conformance, deep-sleep current below 50 uA for battery-powered nodes, and a built-in chip antenna that supports a 30-50 m typical in-home range. The exposed pads align with the industry-standard ZM5304 footprint, enabling drop-in upgrade paths from prior Z-Wave 300/400-series modules without board rework. The ZM5304Ax-CME3 architecture pairs the SD3503 modem SoC with an internal PA, LNA, TCXO and PCB antenna; the modem runs the Z-Wave protocol library via firmware loaded from an external host or optional on-module flash. Internal mesh routing handles up to 232 hops, supporting large multi-story smart-home installations. Typical applications include Z-Wave smart-home gateways, door/window sensors, smart lighting dimmers, smart locks, and water-leak detectors. The compact surface-mount form factor also serves battery-powered HVAC thermostats and energy-harvesting switch nodes. When designing with the ZM5304Ax-CME3, observe the keep-out zone underneath and around the chip antenna; place no copper, traces, or ground plane within 5 mm of the antenna pad to avoid detuning. Use a 4-layer or 2-layer board with a continuous ground reference and follow Sigma Designs reference layout AN-2014-007 for best RF yield. This page synthesizes distributor pricing, drop-in alternative sourcing, and practical RF layout guidance not found on the manufacturer product page, helping engineers accelerate Z-Wave node design and second-source qualification.