A3PE3000-2FGG484I vs A3PE3000-FG484 Сравнение
Подробное сравнение бок о бок A3PE3000-2FGG484I от Microchip Technology и A3PE3000-FG484 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
A3PE3000-2FGG484I - 3M-Gate Flash FPGA 341 I/O BGA-484 | Microchip
A3PE3000-2FGG484I ✓ АктивенMicrochip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ АктивенСравнение характеристик
| Параметр | A3PE3000-2FGG484I | A3PE3000-FG484 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $89,40 | $139,75 |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3000000 |
| User I/O | 341 | 341 |
| Family | ProASIC3E (Flash) | ProASIC3E Flash FPGA |
| Configuration Memory | Nonvolatile on-chip Flash | On-chip flash (non-volatile, single-chip) |
| Speed Grade | -2 | — |
| Корпус | 484-Ball FBGA | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | -40C to +100C (Industrial, I suffix) | [DATA_NEEDED: operating temperature range] |
| Programming | In-system, live field upgrade | — |
| Soft Processor Support | Optional soft ARM support | — |
| Configuration Bits | 516096 | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM capacity] | [DATA_NEEDED: embedded block RAM capacity] |
| Core Supply Voltage | [DATA_NEEDED: Core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage range] | — |
| PLLs | [DATA_NEEDED: Number of PLLs] | — |
| Статус RoHS | Compliant (green package per manufacturer data) | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| Logic Cells (DFEs) | — | 75264 |
| Core Voltage | — | 1.5 V |
| System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm flash CMOS |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |