A3PE3000L-1FG324I vs A3PE3000L-FGG324 Сравнение
Подробное сравнение бок о бок A3PE3000L-1FG324I от Microchip Technology и A3PE3000L-FGG324 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ АктивенMicrochip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ АктивенСравнение характеристик
| Параметр | A3PE3000L-1FG324I | A3PE3000L-FGG324 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $135,00 | $86,15 |
| Family | ProASIC3L Low Power Flash FPGA | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) | — |
| User I/O | 221 | 221 |
| Total RAM Bits | 516096 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| I/O Voltage | 1.2 V to 1.5 V (family range) | — |
| Speed Grade | -1 | — |
| Process Technology | 130 nm CMOS flash | — |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) | On-chip Flash (single-chip, nonvolatile) |
| Low Power Feature | Flash*Freeze technology | — |
| Рабочая температура | -40C to +100C (industrial, I suffix) | 0 C to +70 C (commercial) |
| Корпус | 324-ball FBGA (FG324) | 324-BGA / FBGA (FGG324) |
| Тип монтажа | Surface Mount | — |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 | — |
| Static Power Reduction | Up to 50% vs ProASIC3 | — |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) | — |
| Manufacturer Part Number | — | A3PE3000L-FGG324 |
| Logic Cells (CLBs) | — | 75264 |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Рабочее напряжение питания | — | 1.5 V |
| Maximum Operating Frequency | — | 250 MHz |
| Special Features | — | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Способ монтажа | — | SMD/SMT |
| Packaging | — | Tray |
| Embedded RAM | — | [DATA_NEEDED: embedded RAM capacity] |
| Статус RoHS | — | [DATA_NEEDED: RoHS status] |