A3PE3000L-1FG324I vs A3PE3000L-FGG324 Vergleich

Detaillierter Direktvergleich von A3PE3000L-1FG324I von Microchip Technology und A3PE3000L-FGG324 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-1FG324I A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-1FG324I ✓ Aktiv
Microchip Technology
A3PE3000L-FGG324 A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-1FG324I A3PE3000L-FGG324
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $135,00 $86,15
Family ProASIC3L Low Power Flash FPGA ProASIC3L (Flash-based FPGA)
System Gates 3000000 3,000,000
Logic Elements 35K LEs (75264 D-flip-flops equivalent family density) —
User I/O 221 221
Total RAM Bits 516096 —
Core Voltage 1.2 V to 1.5 V —
I/O Voltage 1.2 V to 1.5 V (family range) —
Speed Grade -1 —
Process Technology 130 nm CMOS flash —
Configuration Memory Non-volatile on-chip flash (single chip, secure) On-chip Flash (single-chip, nonvolatile)
Low Power Feature Flash*Freeze technology —
Betriebstemperatur -40C to +100C (industrial, I suffix) 0 C to +70 C (commercial)
Gehäuse 324-ball FBGA (FG324) 324-BGA / FBGA (FGG324)
Montageart Surface Mount —
Dynamic Power Reduction Up to 40% vs ProASIC3 —
Static Power Reduction Up to 50% vs ProASIC3 —
Max Family Performance 892.86 MHz class (130 nm ProASIC3EL family) —
Manufacturer Part Number — A3PE3000L-FGG324
Logic Cells (CLBs) — 75264
Core Voltage Range — 1.2 V to 1.5 V
Betriebsversorgungsspannung — 1.5 V
Maximum Operating Frequency — 250 MHz
Special Features — Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down
Boundary Scan — IEEE 1149.1 (JTAG)
Montagestil — SMD/SMT
Packaging — Tray
Embedded RAM — [DATA_NEEDED: embedded RAM capacity]
RoHS-Status — [DATA_NEEDED: RoHS status]

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