A3PE3000L-FGG484 vs A3PE3000-2FG484 Сравнение
Подробное сравнение бок о бок A3PE3000L-FGG484 от Microchip Technology и A3PE3000-2FG484 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ АктивенMicrochip Technology
A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484 ✓ АктивенСравнение характеристик
| Параметр | A3PE3000L-FGG484 | A3PE3000-2FG484 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $0,00 | $152,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3E Flash FPGAs |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | — |
| User I/O | 341 | 341 |
| Embedded RAM | 516,096 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| Process Technology | 130 nm flash | — |
| Configuration Technology | Nonvolatile flash, Instant On | — |
| Low Power Feature | Flash*Freeze technology | — |
| Корпус | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch | 484-ball FBGA (FG484) |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Статус RoHS | Compliant (per Newark: RoHS Compliant: Yes) | Non-G suffix (standard package); G-suffix variants are RoHS-compliant |
| Packaging | Tray | — |
| Security | Single-chip, flash-based, secure nonvolatile configuration | — |
| Logic Cells (DFF-equivalent) | — | 75,264 |
| VersaTiles | — | 75,264 |
| Embedded SRAM | — | 516,096 bits |
| Technology | — | 130 nm CMOS flash process |
| Maximum System Performance | — | 310 MHz |
| Speed Grade | — | -2 |
| Configuration | — | Non-volatile Flash (single-chip, instant-on) |
| Soft ARM Support | — | Yes (optional Cortex-M1 soft core) |
| Operating Temperature (commercial) | — | 0C to +85C |
| I/O Standards | — | Voltage-referenced I/O supported (VREF per minibank) |