AFS600-1FG256K vs AFS600-FG256 Сравнение
Подробное сравнение бок о бок AFS600-1FG256K от Microchip Technology и AFS600-FG256 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ АктивенMicrochip Technology
AFS600-FG256 - 600K Mixed-Signal Fusion FPGA | Microchip
AFS600-FG256 ✓ АктивенСравнение характеристик
| Параметр | AFS600-1FG256K | AFS600-FG256 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | FPGA |
| Programmable Logic | Flash-based programmable logic | — |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | — |
| User I/O | 119 I/O | — |
| Maximum Frequency | 1282.05 MHz | 1098.9 MHz |
| Core Supply Voltage | 1.5 V | — |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | 110,592 bits |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Корпус | 256-terminal plastic ball grid array (256-LBGA) | — |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Тип монтажа | Surface mount | — |
| Ordering Package Option | Tray | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Диапазон рабочих температур | [DATA_NEEDED: operating temperature range] | — |
| Product Type | — | Fusion mixed-signal FPGA |
| System Gates | — | 600,000 gates |
| User I/O Count | — | 119 I/Os |
| Напряжение питания | — | 1.5 V |
| Logic Family | — | CMOS |
| Process Technology | — | 130 nm |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash-based CMOS |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Package Type | — | 256-pin low-profile BGA |
| Package Pitch | — | 1.0 mm |
| Число выводов | — | 256 pins |
| Рабочая температура | — | 0 C to 70 C |
| Analog Capability | — | Configurable analog blocks |
| Clock Capability | — | Integrated clock generation and management circuitry |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |