EP2A40F1020I8 vs EP2A40F1020C8N Сравнение
Подробное сравнение бок о бок EP2A40F1020I8 от Intel и EP2A40F1020C8N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP2A40F1020I8 | EP2A40F1020C8N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $175,00 | $0,00 |
| Family | APEX II | — |
| Logic Elements | 2,560 (40,000 max with embedded array blocks) | — |
| Typical Gates | 38,400 | — |
| System Gates | 655,360 | — |
| User I/O Pins | 735 | — |
| Корпус | 1020-ball FineLine BGA (FBGA) | — |
| Process Technology | 0.18 micron CMOS | — |
| Embedded RAM Bits | 409,600 (via EABs) | — |
| Рабочая температура | -40C to +85C (Industrial) | 0 °C to 85 °C |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Supply Voltage (I/O) | [DATA_NEEDED: I/O voltage] | — |
| I/O Banks | 8 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Configuration Modes | JTAG, Passive Serial, Passive Parallel, Synchronous | — |
| In-System Programmability | Yes | — |
| Статус RoHS | Depends on lot - check manufacturer declaration | unknown |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |