EP2S180F1020C3 vs EP2S130F1020C3NGA Сравнение
Подробное сравнение бок о бок EP2S180F1020C3 от Intel и EP2S130F1020C3NGA от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP2S180F1020C3 | EP2S130F1020C3NGA |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.280,00 | $1.395,00 |
| Series | Stratix II | — |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Корпус | 1020-ball FBGA (flip-chip BGA) | 1020-ball FC-FBGA |
| Тип монтажа | Surface Mount | — |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C3 | C3 |
| Рабочая температура | Commercial (0C to +85C) | — |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Family | — | Stratix II |
| Logic Elements (LE) | — | 132,540 |
| Embedded Memory (TriMatrix) | — | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | — | Yes (18x18 multiplier blocks) |
| User I/Os | — | 742 |
| Process Technology | — | 90 nm |
| Maximum Internal Clock Frequency | — | 778.82 MHz |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | — | PS, PPS, PPA, JTAG |
| Configuration Encryption | — | 128-bit AES |
| On-chip Termination (OCT) | — | Yes (series, parallel, dynamic) |