EP2S180F1020C3 vs EP2S130F1020C3NGA Comparison
Detailed side-by-side comparison of EP2S180F1020C3 by Intel and EP2S130F1020C3NGA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2S180F1020C3 | EP2S130F1020C3NGA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,280.00 | $1,395.00 |
| Series | Stratix II | β |
| Device Family | EP2S180 | β |
| Equivalent Logic Elements (LEs) | 179,400 | β |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | β |
| Maximum User I/Os | 742 | β |
| Package | 1020-ball FBGA (flip-chip BGA) | 1020-ball FC-FBGA |
| Mounting Type | Surface Mount | β |
| Process Node | 90 nm, all-layer copper SRAM | β |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C3 | C3 |
| Operating Temperature | Commercial (0C to +85C) | β |
| DSP Blocks | Dedicated high-speed multipliers | β |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | β |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | β |
| Configuration Method | SRAM-based (volatile, requires boot device) | β |
| Development Toolchain | Quartus II / Quartus Prime | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Family | β | Stratix II |
| Logic Elements (LE) | β | 132,540 |
| Embedded Memory (TriMatrix) | β | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | β | Yes (18x18 multiplier blocks) |
| User I/Os | β | 742 |
| Process Technology | β | 90 nm |
| Maximum Internal Clock Frequency | β | 778.82 MHz |
| Temperature Grade | β | Commercial (0C to +85C) |
| PLLs | β | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | β | PS, PPS, PPA, JTAG |
| Configuration Encryption | β | 128-bit AES |
| On-chip Termination (OCT) | β | Yes (series, parallel, dynamic) |