EP2SGX60DF780C3 vs EP2SGX60CF780C3N Сравнение
Подробное сравнение бок о бок EP2SGX60DF780C3 от Intel и EP2SGX60CF780C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP2SGX60DF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $218,00 | $285,00 |
| Family | Stratix II GX | — |
| Series | Stratix II | Stratix II GX |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 816.9 MHz |
| Корпус | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | — |
| Тип монтажа | Surface Mount | — |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | — |
| Статус RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Lead-free / Compliant |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 60,440 |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Core Supply Voltage | — | 1.2 V |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Type | — | 780-ball FC-FBGA |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |
| Уровень MSL | — | [DATA_NEEDED: MSL rating] |