EP2SGX60DF780C3 vs EP2SGX60CF780C3N Comparison

Detailed side-by-side comparison of EP2SGX60DF780C3 by Intel and EP2SGX60CF780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX60CF780C3N EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N ⚠ Last Time Buy

Specification Comparison

Parameter EP2SGX60DF780C3 EP2SGX60CF780C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $218.00 $285.00
Family Stratix II GX β€”
Series Stratix II Stratix II GX
Logic Elements / Cells 60,440 β€”
Logic Array Blocks (LABs) 3,022 [DATA_NEEDED: LAB count]
Total RAM Bits [DATA_NEEDED: total embedded memory bits] β€”
Number of I/O 364 β€”
Number of Transceivers Up to 20 β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
Core Voltage 1.2 V β€”
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 816.9 MHz
Package 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount β€”
Operating Temperature (TJ) 0 Β°C to +85 Β°C (commercial, C speed grade) β€”
Speed Grade C3 (fastest commercial) β€”
RoHS Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Lead-free / Compliant
Device Type β€” FPGA (Field Programmable Gate Array)
Logic Elements β€” 60,440
User I/O Pins β€” 364
Embedded Memory (bits) β€” 2,544,192
Number of CLBs β€” 60,440
Core Supply Voltage β€” 1.2 V
Transceiver Channels β€” 12 (up to 6.375 Gbps)
Package Type β€” 780-ball FC-FBGA
Package Dimensions β€” 29 mm x 29 mm, 1.0 mm pitch
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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