EPF10K100ARI240-3N vs EPF10K100EBC356-1X Сравнение
Подробное сравнение бок о бок EPF10K100ARI240-3N от Intel и EPF10K100EBC356-1X от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
EPF10K100ARI240-3N ⚠ Последняя закупкаСравнение характеристик
| Параметр | EPF10K100ARI240-3N | EPF10K100EBC356-1X |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $86,40 | $165,00 |
| Family | FLEX 10KA | — |
| Logic Elements / Cells | 4,992 | — |
| Typical Gate Count | 100,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| User I/Os | 189 | — |
| Корпус | 240-RQFP Exposed Pad (32x32 mm) | — |
| Pins | 240 | — |
| Propagation Delay (tpd) | 0.6 ns | — |
| Maximum Internal Frequency | 125 MHz | — |
| Process Technology | 0.30 µm CMOS SRAM | — |
| Supply Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Рабочая температура | -40 °C to +85 °C (Industrial) | 0 C to +70 C (Commercial) |
| Speed Grade | -3N (industrial) | -1X |
| Тип монтажа | Surface Mount (RQFP, gull-wing) | Surface Mount (BGA) |
| Уровень MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | FLEX 10KE |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Propagation Delay | — | 0.6 ns |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |