EPF10K100ARI240-3N vs EPF10K100EBC356-1X Comparaison
Comparaison détaillée côte à côte de EPF10K100ARI240-3N par Intel et EPF10K100EBC356-1X par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
EPF10K100ARI240-3N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EPF10K100ARI240-3N | EPF10K100EBC356-1X |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $86,40 | $165,00 |
| Family | FLEX 10KA | — |
| Logic Elements / Cells | 4,992 | — |
| Typical Gate Count | 100,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| User I/Os | 189 | — |
| Boîtier | 240-RQFP Exposed Pad (32x32 mm) | — |
| Pins | 240 | — |
| Propagation Delay (tpd) | 0.6 ns | — |
| Maximum Internal Frequency | 125 MHz | — |
| Process Technology | 0.30 µm CMOS SRAM | — |
| Supply Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) | 0 C to +70 C (Commercial) |
| Speed Grade | -3N (industrial) | -1X |
| Type de montage | Surface Mount (RQFP, gull-wing) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | FLEX 10KE |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Propagation Delay | — | 0.6 ns |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |